Vishay Siliconix SIHD6N65ET4-GE3
- Part No.:
- SIHD6N65ET4-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
SIHD6N65ET4-GE3.pdf
- Description:
- MOSFET N-CH 650V 7A TO252AA
- Quantity:
- Payment:

- Shipping:

Inventory:3,194
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Product details
Overview
SIHD6N65ET4-GE3 from Vishay Siliconix is a 650 V, 7 A N-channel enhancement-mode power MOSFET in DPAK (TO-252) package, featuring RDS(on) = 0.6 Ω at VGS = 10 V, Qg = 48 nC, and avalanche-rated (EAS = 56 mJ). It serves as a high-voltage switching element in PFC and primary-side SMPS stages for telecom and server power supplies.
For engineers reviewing the SIHD6N65ET4-GE3 datasheet, SIHD6N65ET4-GE3 pinout, SIHD6N65ET4-GE3 application, or SIHD6N65ET4-GE3 equivalent, key selection criteria include its 650 V VDS, low gate charge for high-frequency hard-switching, rugged body diode (trr = 237 ns), and thermal resistance RthJC = 1.6 °C/W enabling compact heatsink designs.
Technical Context
This MOSFET employs planar silicon technology optimized for high-voltage, medium-current switching with low conduction and switching losses. Its gate threshold voltage (VGS(th) = 2–4 V) ensures reliable turn-on with standard 10 V gate drivers, while the low Ciss (820 pF) and Coss (40 pF) support fast, efficient transitions in continuous conduction mode (CCM) PFC and LLC resonant converters.
The device integrates an ultra-low Qgd/Qg ratio (11/48 nC) to minimize Miller-induced switching instability, and its rated dV/dt capability (37 V/ns at TJ = 125 °C) supports robust operation in noisy high-di/dt environments such as welder inverters and solar PV string inverters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS max | 650 V - Supports 400 V DC bus with 1.6× safety margin for telecom rectified input and industrial 3-phase rectification |
| RDS(on) max @ 10 V | 0.6 Ω - Enables ≤ 12.6 W conduction loss at 7 A continuous drain current |
| Qg max | 48 nC - Reduces gate drive power requirement and enables >100 kHz switching in hard-switched topologies |
| EAS | 56 mJ - Withstands unclamped inductive energy during fault conditions without failure |
| RthJC | 1.6 °C/W - Allows direct mounting to heatsink for thermal management in space-constrained 1U server PSUs |
| trr | 237 ns - Limits reverse recovery loss and EMI generation in bridge-leg configurations |
| ID @ TC = 100 °C | 5 A - Specifies usable current derating for sustained operation in enclosed industrial enclosures |
Pinout & Package
DPAK (TO-252) package with exposed drain pad on bottom side for thermal conduction; three-terminal surface-mount configuration requiring minimum recommended copper pad area of 6.18 mm × 5.69 mm per Vishay Application Note 826.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G (Gate) | Control electrode | Accepts 10 V logic-level drive; requires <100 nF local decoupling to suppress ringing due to low Qgd |
| D (Drain) | High-voltage output node | Connected to PCB copper pour for thermal dissipation; electrically tied to backside metal tab |
| S (Source) | Reference node / return path | Serves as common reference for gate driver and current sensing; must be low-inductance layout to avoid shoot-through risk |
Key Features
| Feature | Design Value |
|---|---|
| Low FOM (RDS(on) × Qg) | 0.6 Ω × 48 nC = 28.8 Ω·nC - Optimized trade-off for high-efficiency 65–100 kHz PFC stages |
| Avalanche energy rating | 56 mJ single-pulse - Eliminates need for external snubbers in flyback and forward converter primary switches |
| Ultra-low Qgd | 11 nC - Reduces Miller plateau duration and improves immunity to false turn-on in high-dV/dt half-bridge legs |
| Low Ciss | 820 pF - Minimizes capacitive loading on gate driver ICs and reduces switching transition time |
| Lead (Pb)-free & Halogen-free | Complies with RoHS 2011/65/EU and JEDEC J-STD-020 reflow profile - Suitable for lead-free SMT assembly |
Applications
| Server Power Supply | Telecom Rectifier |
|---|---|
Use Scenario: Primary-side switch in active clamp forward or LLC resonant converter operating at 100–300 kHz with 380–400 V DC bus. IC Role / Device Role / Timing Role: High-voltage power switch controlling energy transfer from bulk capacitor to transformer primary. Use Value: Low RDS(on) and Qg reduce conduction and switching losses, enabling >95% efficiency in 1U 2 kW units. | Use Scenario: Boost PFC stage in 3 kW telecom rectifier handling universal AC input (90–264 VAC). IC Role / Device Role / Timing Role: Fast-switching boost switch synchronizing with line frequency to shape input current waveform. Use Value: Avalanche rating and low trr prevent failure during transient overloads and improve THD performance. |
| Solar PV Inverter | Industrial Welder |
Use Scenario: DC-link switch in string-level MPPT converter interfacing photovoltaic panels to central inverter. IC Role / Device Role / Timing Role: Medium-voltage switch regulating DC bus voltage under variable irradiance and temperature. Use Value: 650 V rating accommodates 1000 V PV arrays with safety margin; low Coss minimizes dead-time losses. | Use Scenario: Inverter leg switch in IGBT-gated arc welding power supply delivering 200–500 A output. IC Role / Device Role / Timing Role: High-di/dt switching element in full-bridge topology driving high-frequency transformer. Use Value: Rated dV/dt (37 V/ns) and rugged body diode withstand rapid polarity reversal during short-circuit protection events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP6NK60ZFP | 600 V VDS, RDS(on) = 0.75 Ω, Qg = 32 nC, TO-220FP package | Lower voltage rating limits use to ≤380 V DC bus; through-hole mounting increases layout complexity | Select when cost sensitivity outweighs board space constraints and 600 V margin suffices |
| IXTH6N65X2 | 650 V VDS, RDS(on) = 0.65 Ω, Qg = 36 nC, TO-247 package | Larger TO-247 footprint and higher RthJC (0.83 °C/W) require larger heatsink but enable higher peak current | Select when >7 A pulsed current or enhanced thermal headroom is required despite larger PCB area |
Compared with STP6NK60ZFP and IXTH6N65X2, SIHD6N65ET4-GE3 delivers optimal balance of 650 V rating, surface-mount DPAK packaging, and low Qg/RDS(on) FOM for space-constrained, high-efficiency 1–3 kW power supplies where thermal interface resistance and layout density are critical.
Availability
SIHD6N65ET4-GE3 is available at Aetrix Electronics and suitable for server and telecom power supplies, solar PV inverters, and industrial motor drives requiring stable component supply across multi-year production cycles.
Supply support for SIHD6N65ET4-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-reliability MOSFETs, diodes, and optoelectronics for demanding industrial, automotive, and computing applications.
The E Series power MOSFETs, including SIHD6N65ET4-GE3, were designed specifically for high-efficiency, high-voltage switching in server PSUs, telecom rectifiers, and renewable energy systems where low gate charge and avalanche ruggedness are essential.
FAQ
What is the maximum continuous drain current for SIHD6N65ET4-GE3 at 100 °C case temperature?
The SIHD6N65ET4-GE3 supports a continuous drain current of 5 A at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limitations of the DPAK package and ensures safe operation within its 1.6 °C/W junction-to-case thermal resistance. Engineers must verify heatsink design and ambient conditions to maintain TJ ≤ 150 °C during full-load operation of the SIHD6N65ET4-GE3.
Does SIHD6N65ET4-GE3 have a fully rated avalanche capability?
Yes, the SIHD6N65ET4-GE3 is fully rated for single-pulse avalanche energy (EAS) of 56 mJ under defined test conditions (VDD = 50 V, L = 28.2 mH, Rg = 25 Ω, IAS = 2 A). This rating is validated per JEDEC standards and allows the SIHD6N65ET4-GE3 to safely absorb inductive energy during switching transients without requiring external clamping circuits in properly designed PFC and SMPS topologies.
What is the typical gate threshold voltage range for SIHD6N65ET4-GE3?
The SIHD6N65ET4-GE3 has a gate threshold voltage (VGS(th)) range of 2 V to 4 V at TJ = 25 °C and ID = 250 μA. This ensures robust turn-on with standard 10 V gate drivers while maintaining noise immunity against spurious gate excitation. The SIHD6N65ET4-GE3 remains fully enhanced across its operating temperature range, with minimal VGS(th) drift ensuring stable performance in server and telecom power supplies.
Can SIHD6N65ET4-GE3 be used in synchronous rectification applications?
No, the SIHD6N65ET4-GE3 is not optimized for synchronous rectification. It is an N-channel high-voltage power MOSFET intended for high-side or low-side switching in hard-switched topologies, with a body diode reverse recovery time (trr) of 237 ns and Qrr of 2.2 μC. For synchronous rectification, devices with faster trr, lower VSD, and optimized body diode characteristics-such as dedicated SR controllers paired with logic-level MOSFETs-are recommended instead of the SIHD6N65ET4-GE3.
What is the recommended PCB pad layout for SIHD6N65ET4-GE3 in DPAK package?
Vishay recommends a minimum copper pad area of 6.18 mm × 5.69 mm (0.243″ × 0.224″) for the drain tab of the SIHD6N65ET4-GE3, per Application Note 826. The pad should be solid, thermally connected to internal ground or power planes via multiple vias, and sized to achieve ≤1.6 °C/W junction-to-ambient thermal resistance in typical 4-layer boards. Proper SIHD6N65ET4-GE3 layout also requires short, low-inductance gate traces and Kelvin source connection for accurate current sensing.
SIHD6N65ET4-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- E
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 650 V
- Current - Continuous Drain (Id) @ 25°C:
- 7A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 600mOhm @ 3A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 48 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 820 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 78W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252AA
SIHD6N65ET4-GE3 FAQ
1.How can I place an order for SIHD6N65ET4-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIHD6N65ET4-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIHD6N65ET4-GE3 reliable?
The price and inventory of SIHD6N65ET4-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHD6N65ET4-GE3 is usually 5 days.
3.What payment methods are accepted for SIHD6N65ET4-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHD6N65ET4-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIHD6N65ET4-GE3?
SIHD6N65ET4-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIHD6N65ET4-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIHD6N65ET4-GE3?
For technical support, including SIHD6N65ET4-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHD6N65ET4-GE3 requirements.
6.How does Aetrix verify that SIHD6N65ET4-GE3 is sourced from the original manufacturer or authorized distributors?
All SIHD6N65ET4-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHD6N65ET4-GE3 meets industry standards.
7.What is the process for return or replacement of SIHD6N65ET4-GE3?
All SIHD6N65ET4-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHD6N65ET4-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIHD6N65ET4-GE3 part is unused and in its original packaging.
Return procedure for SIHD6N65ET4-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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