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Vishay Siliconix SIHG150N60E-GE3

Part No.:
SIHG150N60E-GE3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
TO-247-3
Datasheet:
AetrixSIHG150N60E-GE3.pdf
Description:
E SERIES POWER MOSFET TO-247AC,
Quantity:
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Inventory:900

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Product details

Overview

SIHG150N60E from Vishay Siliconix is a 600 V, 22 A N-channel enhancement-mode power MOSFET in TO-247AC package, featuring RDS(on) = 0.137 Ω (typ. at VGS = 10 V), Qg = 24 nC (typ.), and avalanche-rated (EAS = 111 mJ). It serves as a high-voltage switching element in primary-side SMPS, PFC stages, and solar inverters where low conduction loss and robust unclamped inductive switching are required.

For engineers reviewing the SIHG150N60E datasheet, SIHG150N60E pinout, SIHG150N60E application, or SIHG150N60E equivalent, key selection criteria include its 600 V VDS rating, 0.137 Ω RDS(on) at 10 V gate drive, 24 nC total gate charge, TO-247AC thermal performance (RthJC = 0.7 °C/W), and body diode recovery characteristics (trr = 291 ns typ., Qrr = 3.5 μC).

Technical Context

This MOSFET employs Vishay's 4th-generation E series technology optimized for high-voltage hard-switching applications. Its low figure-of-merit (RDS(on) × Qg) and reduced effective output capacitance (Co(er) = 58 pF) directly lower both conduction and switching losses in continuous conduction mode (CCM) PFC and resonant LLC topologies.

The device integrates an avalanche-energy-rated body diode with trr = 291 ns (typ.) and Qrr = 3.5 μC at TJ = 25 °C, enabling reliable operation in circuits with inductive turn-off stress. Its VGS(th) of 3.0–5.0 V ensures stable gate control under wide temperature and supply variations without requiring logic-level drive.

Key Specifications

ParameterValue and Actual Design Meaning
VDS max600 V - supports 400 V DC bus designs with ≥50 % safety margin for transient overvoltage in telecom/server PSUs
RDS(on) typ.0.137 Ω at VGS = 10 V - enables ≤2.2 W conduction loss at 10 A, critical for thermally constrained PFC boost stages
Qg typ.24 nC - reduces gate driver power demand and switching transition time in 100–300 kHz SMPS
EAS111 mJ - withstands single-pulse inductive energy without failure in unclamped inductive switching (UIS) tests
trr / Qrr291 ns / 3.5 μC - limits reverse recovery loss and dv/dt-induced shoot-through risk in bridge configurations
RthJC0.7 °C/W - allows >150 W dissipation with moderate heatsinking, supporting high-power density server PSU designs
VGS(th)3.0–5.0 V - ensures robust turn-on across temperature and manufacturing spread without gate voltage margin concerns

Pinout & Package

SIHG150N60E is housed in a TO-247AC package with isolated drain tab, rated for high-voltage isolation and optimized thermal transfer to heatsinks. The package features three leads: Gate (pin 1), Drain (pins 2 and 4), and Source (pin 3), with pins 2 and 4 electrically connected internally to the drain metallization.

Pin/TerminalCircuit RoleDesign Meaning
1GateControl terminal; requires <10 nC gate charge to reach threshold; low input capacitance (Ciss = 1514 pF) eases driver selection
2 & 4DrainMain high-voltage current path; pins 2 and 4 are bonded to same internal drain structure, enabling dual-drain connection for improved current sharing and thermal spreading
3SourcePower return and reference node for gate drive; tied to source metallization; used for Kelvin sensing in precision current monitoring layouts

Key Features

FeatureDesign Value
4th-generation E series processDelivers 20 % lower RDS(on) × Qg vs. prior generation, directly reducing combined switching + conduction loss in 100–200 kHz PFC
Low Co(er)58 pF - minimizes stored energy (Eoss) during hard-switching transitions, lowering turn-off loss in boost and flyback converters
Avalanche energy rating111 mJ - eliminates need for external snubbers in UPS and industrial motor drive H-bridge outputs subjected to inductive kick
Body diode softnessQrr/IRRM = 0.17 μC/A - reduces di/dt-induced voltage overshoot and EMI during commutation in synchronous rectification and half-bridge topologies
High dv/dt immunity100 V/ns (TJ = 125 °C) - suppresses false turn-on in high-speed, high-dV/dt environments like PV inverter DC-link switching

Applications

Server Power SupplyTelecom Rectifier

Use Scenario: Primary-side switch in 3.3 kW, 96 % efficient 48 V telecom rectifier operating at 150 kHz with interleaved PFC + LLC topology.

IC Role / Device Role / Timing Role: High-voltage switching transistor in boost PFC stage and LLC resonant half-bridge, handling 400 V DC input and delivering regulated 12 V/270 A output.

Use Value: Low RDS(on) (0.137 Ω) and Qg (24 nC) reduce conduction and gate drive losses, enabling >96 % efficiency at full load while maintaining junction temperature <125 °C with forced air cooling.

Use Scenario: Main switching device in 2 kW front-end AC/DC converter for 5G base station power system with active PFC and phase-shifted full-bridge DC/DC.

IC Role / Device Role / Timing Role: 600 V primary switch in continuous conduction mode (CCM) boost PFC, operating at 65 kHz with 380–400 V DC bus.

Use Value: Avalanche rating (EAS = 111 mJ) absorbs line transients and inductive spikes during grid disturbances, eliminating need for clamping circuits and improving system reliability.

Solar PV InverterIndustrial Motor Drive

Use Scenario: DC-link switch in 5 kW string inverter with two-level NPC topology, converting 600 V DC PV array output to 230 V AC grid.

IC Role / Device Role / Timing Role: High-side and low-side switching element in inverter leg, switching at 16 kHz with sinusoidal PWM modulation.

Use Value: Fast, soft body diode (trr = 291 ns, Qrr = 3.5 μC) minimizes commutation loss and voltage overshoot during freewheeling, improving inverter efficiency and reducing EMI filter size.

Use Scenario: Output stage switch in 7.5 kW variable frequency drive (VFD) for HVAC compressors, using six-pack IGBT+diode module replacement with discrete MOSFETs.

IC Role / Device Role / Timing Role: 600 V switching transistor in three-phase inverter bridge, operating in 2–8 kHz PWM range with regenerative braking capability.

Use Value: TO-247AC package with RthJC = 0.7 °C/W enables direct mounting to aluminum heatsink, sustaining 14 A continuous current at 100 °C case temperature without derating.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STW15NK60Z600 V, 14 A, RDS(on) = 0.38 Ω, Qg = 32 nC, TO-247 packageHigher RDS(on) and gate charge increase conduction and switching losses by ~40 % at 10 A; lacks EAS ratingAcceptable only in lower-current (<10 A), lower-frequency (<65 kHz) applications where thermal headroom exists and avalanche robustness is not required.
IXFH16N60P600 V, 16 A, RDS(on) = 0.32 Ω, Qg = 42 nC, TO-247 packageLower current rating and higher Qg limit usable frequency to <100 kHz; no specified Co(er) or soft-recovery dataSuitable for cost-sensitive 1–2 kW SMPS where peak efficiency is secondary to BOM cost, but not recommended for PFC or solar inverters demanding low EMI and high reliability.

Compared with STW15NK60Z and IXFH16N60P, SIHG150N60E delivers superior power density via its 0.137 Ω RDS(on), 24 nC Qg, and 111 mJ EAS rating-enabling smaller heatsinks, higher switching frequencies, and elimination of external protection components in mission-critical 2–5 kW industrial and renewable energy systems.

Availability

SIHG150N60E is available at Aetrix Electronics and suitable for server power supplies, telecom rectifiers, and solar PV inverters requiring stable component supply, long-term lifecycle support, and traceable sourcing for production ramp-up and field service replacement.

Supply support for SIHG150N60E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on reliability, thermal efficiency, and ruggedized packaging.

The E Series power MOSFET product line targets high-efficiency, high-voltage switching applications-including PFC, server/telecom PSUs, and industrial inverters-where low RDS(on) × Qg, avalanche robustness, and fast body diode recovery are essential design requirements.

FAQ

What is the maximum continuous drain current rating for SIHG150N60E at 100 °C case temperature?

The SIHG150N60E has a continuous drain current rating of 14 A at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This value reflects thermal derating due to junction-to-case resistance (RthJC = 0.7 °C/W) and must be validated against actual board layout, heatsink interface, and ambient airflow. At TC = 25 °C, the rating increases to 22 A.

Does SIHG150N60E support gate drive voltages below 10 V?

Yes, SIHG150N60E has a gate threshold voltage (VGS(th)) range of 3.0–5.0 V, allowing functional turn-on with gate drives as low as 5 V. However, full enhancement and minimum RDS(on) (0.137 Ω) are only guaranteed at VGS = 10 V per the datasheet test conditions. Operating at 5–8 V increases RDS(on) significantly and should be verified with thermal modeling.

Is SIHG150N60E suitable for use in synchronous rectification topologies?

No, SIHG150N60E is not optimized for synchronous rectification. Its body diode exhibits trr = 291 ns and Qrr = 3.5 μC-adequate for freewheeling in hard-switched converters but too slow and lossy for high-frequency SR applications where ultra-fast, low-Qrr diodes (e.g., SiC Schottky) are preferred. Use dedicated SR controllers with logic-level MOSFETs instead.

What is the thermal resistance from junction to case (RthJC) for SIHG150N60E?

The maximum junction-to-case thermal resistance (RthJC) for SIHG150N60E is 0.7 °C/W, measured from junction to the drain tab (pin 2/4). This value is critical for heatsink sizing and must be applied with proper thermal interface material and mounting pressure. The typical RthJC is lower but not specified; design calculations should use the max value for worst-case thermal analysis.

Can SIHG150N60E replace older Vishay 600 V MOSFETs like SIHP15N60E in existing designs?

Yes, SIHG150N60E is a direct drop-in replacement for SIHP15N60E in most cases: same TO-247AC package, identical pinout (G-D-S-D), and improved specs (lower RDS(on), lower Qg, higher EAS). No PCB changes are required, but gate drive strength and layout parasitics should be re-verified due to faster switching edges enabled by reduced Qg and Ciss.

SIHG150N60E-GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
E
Package/Case:
TO-247-3
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
600 V
Current - Continuous Drain (Id) @ 25°C:
22A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
155mOhm @ 10A, 10V
Vgs(th) (Max) @ Id:
5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
36 nC @ 10 V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
1514 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
179W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-247AC

SIHG150N60E-GE3 FAQ

1.How can I place an order for SIHG150N60E-GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIHG150N60E-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIHG150N60E-GE3 reliable?

The price and inventory of SIHG150N60E-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHG150N60E-GE3 is usually 5 days.

3.What payment methods are accepted for SIHG150N60E-GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHG150N60E-GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIHG150N60E-GE3?

SIHG150N60E-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIHG150N60E-GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIHG150N60E-GE3?

For technical support, including SIHG150N60E-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHG150N60E-GE3 requirements.

6.How does Aetrix verify that SIHG150N60E-GE3 is sourced from the original manufacturer or authorized distributors?

All SIHG150N60E-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHG150N60E-GE3 meets industry standards.

7.What is the process for return or replacement of SIHG150N60E-GE3?

All SIHG150N60E-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHG150N60E-GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIHG150N60E-GE3 part is unused and in its original packaging.

Return procedure for SIHG150N60E-GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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