Vishay Siliconix SIHH125N60EF-T1GE3
- Part No.:
- SIHH125N60EF-T1GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerTDFN
- Datasheet:
-
SIHH125N60EF-T1GE3.pdf
- Description:
- MOSFET N-CH 600V 23A PPAK 8 X 8
- Quantity:
- Payment:

- Shipping:

Inventory:3,000
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Product details
Overview
SIHH125N60EF-T1GE3 from Vishay Siliconix is a 600 V, 23 A N-channel Power MOSFET in PowerPAK® 8 × 8 package with Kelvin source connection, optimized for high-efficiency switch-mode power supplies and PFC stages. It features RDS(on) = 0.109 Ω (typ.) at VGS = 10 V, Qg = 31 nC (typ.), and fast body diode with trr = 117 ns (typ.), enabling reduced switching losses in hard-switched topologies.
For engineers reviewing the SIHH125N60EF-T1GE3 datasheet, SIHH125N60EF-T1GE3 pinout, SIHH125N60EF-T1GE3 application, or SIHH125N60EF-T1GE3 equivalent, key selection criteria include its low FOM (RDS(on) × Qg), avalanche-rated UIS capability (88 mJ), and Kelvin source configuration for gate-drive stability in high-di/dt environments.
Technical Context
This device belongs to Vishay's EF Series - fourth-generation E-series technology - engineered for high-voltage, medium-power applications requiring both low conduction loss and fast, controlled switching. Its dual-drain layout and Kelvin source terminal decouple power and signal return paths to minimize gate-loop inductance and suppress oscillation during turn-off.
The MOSFET integrates an optimized fast-recovery body diode (Qrr = 0.7 μC typ., trr = 117 ns) and exhibits low effective output capacitance (Coss(er) = 54 pF), reducing capacitive turn-on loss in ZVS-influenced designs. Thermal resistance RthJC = 0.57 °C/W enables high-power operation with minimal case-to-junction temperature rise.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS max | 600 V - supports 480 V DC bus designs with 25 % margin for voltage transients in telecom/server PSUs |
| RDS(on) typ. @ 10 V | 0.109 Ω - delivers ≤ 1.6 W conduction loss at 12 A continuous drain current |
| Qg max | 47 nC - enables efficient gate drive with standard 1–2 A peak drivers without excessive Miller plateau time |
| trr typ. | 117 ns - reduces diode reverse recovery stress and EMI in bridge-leg commutation |
| EAS | 88 mJ - rated unclamped inductive switching energy allows robust operation under transient overloads |
| RthJC max | 0.80 °C/W - supports >100 W dissipation with moderate heatsinking in compact 8 mm × 8 mm footprint |
| ID cont. @ TC = 100 °C | 14 A - defines usable current limit in thermally constrained industrial enclosures |
Pinout & Package
SIHH125N60EF-T1GE3 uses the PowerPAK® 8 × 8 surface-mount package (8.00 mm × 8.00 mm × 1.00 mm), featuring exposed drain pad for thermal performance and four dedicated terminals: Gate (Pin 1), Kelvin Source (Pin 2), Power Source (Pin 3), Drain (Pin 4).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Gate | Standard gate control input; routed separately from power loops to avoid noise coupling |
| Pin 2 | Kelvin Source | Low-current reference path for gate driver feedback - eliminates source inductance impact on switching timing |
| Pin 3 | Power Source | Main current return path for load current; connects directly to PCB ground plane for low-impedance conduction |
| Pin 4 | Drain | High-side power node; soldered to large copper area for thermal transfer and voltage standoff |
Key Features
| Feature | Design Value |
|---|---|
| 4th-gen EF Series technology | Optimized cell pitch and trench geometry deliver best-in-class RDS(on) × Qg FOM of ~3.2 Ω·nC |
| Kelvin source configuration | Separates gate-return path from high-di/dt source current, improving gate control fidelity and dV/dt immunity |
| Fast body diode (trr = 117 ns) | Enables reliable synchronous rectification and reduces shoot-through risk in half-bridge configurations |
| Avalanche-rated (EAS = 88 mJ) | Guarantees ruggedness during unclamped inductive switching events without derating |
| Low Coss(er) = 54 pF | Minimizes turn-on switching loss in hard-switched converters operating above 100 kHz |
Applications
| Server Power Supply | Telecom Rectifier |
|---|---|
Use Scenario: Primary-side switching in 48 V/54 V intermediate bus converters with active clamp or LLC topology. IC Role / Device Role / Timing Role: High-side switching element handling 12–20 A DC current at 100–300 kHz switching frequency. Use Value: Low Qg and Kelvin source reduce gate-drive loss and improve efficiency by ≥0.4 % at full load versus non-Kelvin alternatives. |
Use Scenario: Boost PFC stage in 3 kW telecom rectifiers operating at 65 kHz with 380–400 V DC output. IC Role / Device Role / Timing Role: Fast-switching boost switch managing 15 A RMS input current with tight di/dt control. Use Value: Fast body diode and low Coss(er) cut reverse recovery loss by 35 % compared to standard 600 V MOSFETs. |
| Solar PV Inverter | Industrial Motor Drive |
Use Scenario: DC-link switching in string inverters with 600 V DC input and transformerless topology. IC Role / Device Role / Timing Role: IGBT replacement in 16 kHz three-phase inverter legs driving 5–10 kW loads. Use Value: 600 V rating and 88 mJ EAS ensure safe operation during grid fault transients without snubber circuits. |
Use Scenario: Half-bridge leg in 7.5 kW servo drive with regenerative braking and high dv/dt demands. IC Role / Device Role / Timing Role: Switching device subjected to 50 V/ns voltage slew rates during PWM transitions. Use Value: dv/dt rating of 70 V/ns and Kelvin source enable stable gate control without external Miller clamping. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STW62N60M2 | 600 V, 58 A, TO-247; no Kelvin source; higher RDS(on) (0.115 Ω); Qg = 65 nC | Requires larger heatsink and higher gate drive current; suited for lower-frequency (<50 kHz) industrial SMPS | Choose when board space permits TO-247 and gate drive can support 65 nC charge |
| IXFH32N60P | 600 V, 32 A, TO-247; no Kelvin source; RDS(on) = 0.135 Ω; Qg = 52 nC; slower trr (250 ns) | Higher conduction loss and longer diode recovery increase EMI and thermal stress in high-frequency PFC | Prefer only where legacy TO-247 footprint is fixed and efficiency targets are relaxed |
Compared with STW62N60M2 and IXFH32N60P, SIHH125N60EF-T1GE3 offers superior high-frequency efficiency due to its Kelvin source, lower Qg, and faster body diode - critical for compact, high-density server and telecom power designs where thermal headroom and EMI are tightly constrained.
Availability
SIHH125N60EF-T1GE3 is available at Aetrix Electronics and suitable for server and telecom power supplies, solar PV inverters, and industrial motor drives requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.
Supply support for SIHH125N60EF-T1GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on reliability, thermal efficiency, and application-specific optimization.
The SIHH125N60EF-T1GE3 belongs to Vishay's EF Series - designed specifically for high-efficiency, high-voltage power conversion systems demanding low switching loss, fast body diode recovery, and rugged avalanche performance in compact surface-mount packages.
FAQ
What is the maximum continuous drain current rating for SIHH125N60EF-T1GE3 at 100 °C case temperature?
The SIHH125N60EF-T1GE3 has a maximum continuous drain current (ID) of 14 A at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This rating reflects thermal derating from the 23 A value at 25 °C and ensures safe operation within the device's 150 °C maximum junction temperature limit when mounted on a properly sized PCB copper area.
Does SIHH125N60EF-T1GE3 support gate drive at 5 V logic level?
No, SIHH125N60EF-T1GE3 is not a logic-level MOSFET. Its gate threshold voltage (VGS(th)) ranges from 3 V to 5 V, but it is characterized and optimized for 10 V gate drive. At VGS = 5 V, RDS(on) increases significantly beyond specification - the datasheet confirms RDS(on) = 0.109 Ω only at VGS = 10 V and ID = 12 A. Using 5 V drive risks excessive conduction loss and thermal runaway.
How does the Kelvin source connection in SIHH125N60EF-T1GE3 improve switching performance?
The Kelvin source (Pin 2) in SIHH125N60EF-T1GE3 provides a dedicated low-current return path for the gate driver, isolating it from high-di/dt power source current flowing through Pin 3. This eliminates source inductance-induced voltage drop during switching transitions, preventing false turn-off and improving gate control accuracy - especially critical in high-frequency, high-efficiency topologies like LLC resonant converters where precise timing is essential.
What is the typical reverse recovery charge (Qrr) of the body diode in SIHH125N60EF-T1GE3?
The typical reverse recovery charge (Qrr) of the integrated body diode in SIHH125N60EF-T1GE3 is 0.7 μC, measured at TJ = 25 °C, IF = 12 A, di/dt = 100 A/μs, and VR = 400 V. This low Qrr - combined with trr = 117 ns - directly reduces switching loss and EMI in bridge-leg and synchronous rectifier applications compared to standard 600 V MOSFETs.
Is SIHH125N60EF-T1GE3 lead (Pb)-free and halogen-free?
Yes, SIHH125N60EF-T1GE3 is lead (Pb)-free and halogen-free, as confirmed in the Ordering Information section of the Vishay datasheet (S23-0653-Rev. B). The "-T1GE3" suffix denotes RoHS-compliant packaging with matte tin plating and green molding compound, meeting JEDEC J-STD-020 moisture sensitivity level 1 (MSL-1) requirements.
SIHH125N60EF-T1GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- EF
- Package/Case:
- 8-PowerTDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 23A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 125mOhm @ 12A, 10V
- Vgs(th) (Max) @ Id:
- 5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 47 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1533 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 156W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerPAK® 8 x 8
SIHH125N60EF-T1GE3 FAQ
1.How can I place an order for SIHH125N60EF-T1GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIHH125N60EF-T1GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIHH125N60EF-T1GE3 reliable?
The price and inventory of SIHH125N60EF-T1GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHH125N60EF-T1GE3 is usually 5 days.
3.What payment methods are accepted for SIHH125N60EF-T1GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHH125N60EF-T1GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIHH125N60EF-T1GE3?
SIHH125N60EF-T1GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIHH125N60EF-T1GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIHH125N60EF-T1GE3?
For technical support, including SIHH125N60EF-T1GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHH125N60EF-T1GE3 requirements.
6.How does Aetrix verify that SIHH125N60EF-T1GE3 is sourced from the original manufacturer or authorized distributors?
All SIHH125N60EF-T1GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHH125N60EF-T1GE3 meets industry standards.
7.What is the process for return or replacement of SIHH125N60EF-T1GE3?
All SIHH125N60EF-T1GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHH125N60EF-T1GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIHH125N60EF-T1GE3 part is unused and in its original packaging.
Return procedure for SIHH125N60EF-T1GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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