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Vishay Siliconix SIHK055N60EF-T1GE3

Part No.:
SIHK055N60EF-T1GE3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
8-PowerBSFN
Datasheet:
AetrixSIHK055N60EF-T1GE3.pdf
Description:
E SERIES POWER MOSFET WITH FAST
Quantity:
Payment:
Payment
Shipping:
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Inventory:2,040

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Product details

Overview

SIHK055N60EF-T1GE3 from Vishay Siliconix is a 600 V, 40 A N-channel Power MOSFET in PowerPAK® 10 x 12 (TOLL) package, featuring 0.050 Ω RDS(on) at VGS = 10 V, 90 nC total gate charge, and fast body diode with 126 ns typical reverse recovery time. It delivers low conduction and switching losses for high-efficiency server power supplies and PFC stages.

For engineers reviewing the SIHK055N60EF-T1GE3 datasheet, SIHK055N60EF-T1GE3 pinout, SIHK055N60EF-T1GE3 application, or SIHK055N60EF-T1GE3 equivalent, key selection criteria include avalanche-rated ruggedness (226 mJ EAS), low effective output capacitance (146 pF Co(er)), and optimized dv/dt immunity (100 V/ns) for hard-switched topologies.

Technical Context

This MOSFET employs Vishay's 4th-generation EF-series silicon technology, engineered to minimize RDS(on) × Qg figure-of-merit (FOM) while maintaining robust unclamped inductive switching (UIS) capability. Its fast intrinsic body diode enables reduced snubber requirements in bridge-leg and synchronous rectifier configurations.

The device operates with ±30 V gate-source voltage rating and supports continuous drain current up to 40 A at TC = 25 °C, derating linearly at 1.89 W/°C above 25 °C. Thermal resistance from junction-to-case is 0.53 °C/W, enabling high-power density mounting on thermally enhanced PCBs or heatsinks.

Key Specifications

ParameterValue and Actual Design Meaning
VDS max600 V - supports 400 V DC bus designs with 50 % safety margin for telecom/server SMPS
RDS(on) typ0.050 Ω @ VGS = 10 V - enables <1.6 W conduction loss at 16 A, critical for PFC efficiency
Qg max90 nC - determines gate drive power and switching speed in 100–500 kHz converters
EAS226 mJ - ensures reliable operation under transient overloads without failure
Co(er)146 pF - reduces turn-off energy loss and improves hard-switching efficiency
trr typ126 ns - minimizes body diode reverse recovery loss in ZVS/ZCS circuits
RthJC0.53 °C/W - allows >200 W dissipation with modest heatsinking in industrial power modules

Pinout & Package

Package: PowerPAK® 10 x 12 (TOLL) - surface-mount, high-current, low-inductance package with exposed drain tab for thermal and electrical performance. Dimensions: 12.88 mm × 9.90 mm × 2.25 mm (L × W × H).

Pin/TerminalCircuit RoleDesign Meaning
Drain (Tab)Main current path, connected to PCB copper pourProvides lowest possible RthJA and inductance; requires soldered thermal pad for rated power handling
Gate (Pin 1)Control input for channel modulationLow-impedance gate input (Rg = 0.7 Ω typ) enables fast, low-loss switching with standard gate drivers
Source (Pins 3–8)Reference node for gate drive and current returnMulti-pin source configuration reduces source inductance and improves stability in high-di/dt applications
Driver Source (Pin 2)Separate Kelvin source for gate driver referenceEnables accurate gate voltage control by eliminating source inductance effects during switching transitions

Key Features

FeatureDesign Value
Fast body diode126 ns trr, 0.8 μC Qrr - reduces dead-time losses and EMI in half/full-bridge topologies
Avalanche energy rated226 mJ single-pulse UIS - eliminates need for external clamping in inductive load transients
Low Co(er)146 pF - cuts turn-off switching loss by ~25 % vs. legacy 600 V MOSFETs with same RDS(on)
Optimized FOMRDS(on) × Qg = 4.5 Ω·nC - balances conduction and switching loss for 100–300 kHz PFC and LLC designs
High dv/dt immunity100 V/ns - suppresses false turn-on in high-side configurations with fast-rising VDS

Applications

Server Power SupplyTelecom Rectifier

Use Scenario: Primary-side switch in 3.3 kW CRPS-compliant ATX server PSU with active clamp forward topology.

IC Role / Device Role / Timing Role: High-voltage, high-current switching element operating at 200 kHz with 480 V DC bus.

Use Value: Low RDS(on) and Co(er) reduce conduction and turn-off losses, improving full-load efficiency by ≥0.4 % over prior-gen devices.

Use Scenario: Boost switch in -48 V telecom rectifier with digital PFC stage.

IC Role / Device Role / Timing Role: Fast-switching MOSFET in continuous conduction mode (CCM) boost converter.

Use Value: Fast body diode and low Qgd/Qg ratio enable stable zero-voltage switching (ZVS) across 20–100 % load range.

Solar PV InverterIndustrial Motor Drive

Use Scenario: DC-link switch in 5 kW string inverter three-phase inverter stage.

IC Role / Device Role / Timing Role: 600 V-class switching device in IGBT-replacement topology with SiC gate driver.

Use Value: Avalanche rating and 150 °C TJ rating support unattended operation in outdoor enclosures with ambient up to 70 °C.

Use Scenario: Output stage switch in 7.5 kW HVAC variable-frequency drive (VFD).

IC Role / Device Role / Timing Role: Hard-switched IGBT alternative in 2-level inverter leg with 400 V DC bus.

Use Value: Multi-pin source and Kelvin gate configuration suppress oscillation and improve gate drive fidelity at 15 kHz PWM.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STW62N60M2600 V, 62 A, RDS(on) = 0.042 Ω, Qg = 105 nC, TO-247 packageHigher current rating but larger footprint and higher gate charge - less suitable for space-constrained PFC modulesPreferred where higher peak current headroom is needed and thermal mass permits TO-247 mounting
IXFH50N60P600 V, 50 A, RDS(on) = 0.065 Ω, Qg = 120 nC, TO-247 package with faster diode (trr = 95 ns)Slower switching due to higher Qg; superior diode speed but lower efficiency at mid-loadSelected when diode recovery speed dominates system EMI concerns over conduction loss

Compared with STW62N60M2 and IXFH50N60P, the SIHK055N60EF-T1GE3 offers optimal balance of low RDS(on), moderate Qg, and industry-leading Co(er) in a compact surface-mount package-making it ideal for high-density, high-efficiency 600 V power conversion where thermal management and layout area are constrained.

Availability

SIHK055N60EF-T1GE3 is available at Aetrix Electronics and suitable for server power supplies, telecom rectifiers, and solar PV inverters requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for SIHK055N60EF-T1GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on reliability, ruggedness, and application-specific optimization.

The EF Series - including SIHK055N60EF-T1GE3 - was designed for high-efficiency, high-reliability 600 V power conversion in server, telecom, and renewable energy systems where low switching loss, fast body diode recovery, and avalanche robustness are mandatory.

FAQ

What is the maximum continuous drain current rating for SIHK055N60EF-T1GE3 at 100 °C case temperature?

The SIHK055N60EF-T1GE3 supports 26 A continuous drain current at TC = 100 °C, per its absolute maximum ratings table. This derating reflects thermal limits of the PowerPAK® 10 x 12 package and ensures safe operation under sustained high-power conditions. The SIHK055N60EF-T1GE3 maintains RDS(on) stability across this range, with normalized on-resistance rising to ~1.8× its 25 °C value at 150 °C junction temperature.

Does SIHK055N60EF-T1GE3 have a Kelvin source connection, and how is it implemented?

Yes, the SIHK055N60EF-T1GE3 features a dedicated Kelvin source terminal (Pin 2) separate from the main source pins (Pins 3–8). This design isolates gate drive return from high-current source paths, minimizing source inductance-induced gate voltage distortion during fast switching. The SIHK055N60EF-T1GE3 uses this configuration to maintain precise VGS control and prevent spurious turn-on in high-di/dt applications like PFC boost stages.

What is the typical reverse recovery charge (Qrr) of the body diode in SIHK055N60EF-T1GE3, and why does it matter?

The SIHK055N60EF-T1GE3 exhibits a typical Qrr of 0.8 μC at TJ = 25 °C, IS = 16 A, and di/dt = 100 A/μs. This low value directly reduces switching loss and EMI generation during body diode commutation in bridge-leg and synchronous rectifier circuits. Because Qrr contributes significantly to total turn-off loss, the SIHK055N60EF-T1GE3's low Qrr enhances efficiency in hard-switched topologies operating above 100 kHz.

Can SIHK055N60EF-T1GE3 be used in avalanche-mode operation, and what is its rated energy?

Yes, the SIHK055N60EF-T1GE3 is fully rated for unclamped inductive switching (UIS) with a single-pulse avalanche energy (EAS) of 226 mJ at TJ = 25 °C. This specification is validated per JEDEC standards and enables robust operation during transient overloads - such as transformer saturation or short-circuit events - without requiring external snubbers. The SIHK055N60EF-T1GE3 leverages this ruggedness in industrial motor drives and UPS systems where fault tolerance is critical.

What is the gate threshold voltage range for SIHK055N60EF-T1GE3, and how does it affect drive circuit design?

The SIHK055N60EF-T1GE3 has a gate-source threshold voltage (VGS(th)) range of 3.0 V to 5.0 V at ID = 250 μA. This relatively wide spread necessitates gate drive voltages ≥10 V to ensure full enhancement and minimal RDS(on) variation across production lots. Drive circuits must deliver clean, well-regulated 10–15 V gate signals with low impedance (<1 Ω) to avoid partial turn-on and excessive heating. The SIHK055N60EF-T1GE3's specified VGS(th) range is tightly controlled within Vishay's EF process, ensuring predictable turn-on behavior in high-volume manufacturing.

SIHK055N60EF-T1GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
EF
Package/Case:
8-PowerBSFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
600 V
Current - Continuous Drain (Id) @ 25°C:
40A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
58mOhm @ 16A, 10V
Vgs(th) (Max) @ Id:
5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
90 nC @ 10 V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
3667 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
236W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PowerPAK®10 x 12

SIHK055N60EF-T1GE3 FAQ

1.How can I place an order for SIHK055N60EF-T1GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIHK055N60EF-T1GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIHK055N60EF-T1GE3 reliable?

The price and inventory of SIHK055N60EF-T1GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHK055N60EF-T1GE3 is usually 5 days.

3.What payment methods are accepted for SIHK055N60EF-T1GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHK055N60EF-T1GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIHK055N60EF-T1GE3?

SIHK055N60EF-T1GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIHK055N60EF-T1GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIHK055N60EF-T1GE3?

For technical support, including SIHK055N60EF-T1GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHK055N60EF-T1GE3 requirements.

6.How does Aetrix verify that SIHK055N60EF-T1GE3 is sourced from the original manufacturer or authorized distributors?

All SIHK055N60EF-T1GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHK055N60EF-T1GE3 meets industry standards.

7.What is the process for return or replacement of SIHK055N60EF-T1GE3?

All SIHK055N60EF-T1GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHK055N60EF-T1GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIHK055N60EF-T1GE3 part is unused and in its original packaging.

Return procedure for SIHK055N60EF-T1GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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