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Vishay Siliconix SIHK155N60E-T1-GE3

Part No.:
SIHK155N60E-T1-GE3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
8-PowerBSFN
Datasheet:
AetrixSIHK155N60E-T1-GE3.pdf
Description:
E SERIES POWER MOSFET POWERPAK 1
Quantity:
Payment:
Payment
Shipping:
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Inventory:4,000

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Product details

Overview

SIHK155N60E-T1-GE3 from Vishay Siliconix is a 600 V, 19 A N-channel Power MOSFET in PowerPAK® 10 x 12 package, featuring RDS(on) = 0.137 Ω (typ. at VGS = 10 V), Qg = 24 nC (typ.), and avalanche-rated energy (EAS = 179 mJ). It delivers low conduction and switching losses for high-efficiency server power supplies and PFC stages.

For engineers reviewing the SIHK155N60E-T1-GE3 datasheet, SIHK155N60E-T1-GE3 pinout, SIHK155N60E-T1-GE3 application, or SIHK155N60E-T1-GE3 equivalent, key selection criteria include its 600 V VDS, 0.137 Ω RDS(on), 24 nC gate charge, 179 mJ UIS rating, and PowerPAK 10 x 12 thermal performance with RthJC = 0.96 °C/W.

Technical Context

This 4th-generation E-series MOSFET uses optimized trench-gate silicon technology to minimize RDS(on) × Qg figure-of-merit (FOM) and reduce effective output capacitance (Co(er) = 58 pF). Its low Ciss (1514 pF typ.) and Crss (2 pF typ.) support fast, low-loss hard-switching operation up to 480 V bus voltages.

The device integrates a robust body diode with trr = 291 ns (typ.), Qrr = 3.5 μC (typ.), and reverse recovery dv/dt capability of 5 V/ns - enabling reliable operation in continuous conduction mode (CCM) PFC and resonant topologies without external diode supplementation.

Key Specifications

Parameter Value and Actual Design Meaning
VDS600 V - supports 400 V AC input rectified to ~565 V DC bus with 5% margin for transient overvoltage in telecom/server SMPS
RDS(on) (typ.)0.137 Ω at VGS = 10 V - enables ≤2.7 W conduction loss at 10 A, critical for thermally constrained PFC boost stages
Qg (typ.)24 nC - reduces gate drive power and enables use of lower-cost 1-A drivers in high-frequency (>100 kHz) designs
EAS179 mJ - ensures ruggedness against unclamped inductive switching events in motor drives and welders
Co(er)58 pF - lowers stored output energy (Eoss) during turn-off, directly reducing switching loss in hard-switched converters
RthJC0.96 °C/W - allows >100 W power dissipation with modest heatsinking, supporting compact 1U server PSU layouts
trr291 ns (typ.) - minimizes diode reverse recovery stress on synchronous rectifiers and adjacent switches in bridge configurations

Pinout & Package

SIHK155N60E-T1-GE3 is housed in a thermally enhanced PowerPAK® 10 x 12 (TOLL) package with exposed drain tab for low-inductance, high-current PCB mounting. The 8-pin configuration features source-connected pins (pins 3–8), gate on pin 1, driver source on pin 2, and drain via the bottom-side metal tab.

Pin/Terminal Circuit Role Design Meaning
Pin 1GateHigh-impedance control input requiring <100 nA leakage; connects to gate driver IC output with <1.8 Ω gate resistance for optimal dV/dt control
Pin 2Driver SourceDedicated Kelvin source connection for accurate gate drive referencing, minimizing voltage overshoot during fast switching
Pins 3–8SourceParallel low-inductance source return path; must be routed with wide copper pour to handle 19 A continuous current and reduce common-source inductance
Drain TabDrainExposed bottom-side metal pad carrying full load current; requires direct thermal interface to heatsink or internal copper plane for RthJC = 0.96 °C/W performance

Key Features

Feature Design Value
4th-generation E-series trench MOSFETOptimized cell pitch and gate oxide thickness yield 22% lower RDS(on) × Qg FOM vs. prior generation, improving efficiency in 100–300 kHz PFC
Avalanche energy rated (UIS)179 mJ single-pulse rating verified per JEDEC JESD24-1, enabling reliable operation under short-circuit or overload conditions without derating
Low effective output capacitanceCo(er) = 58 pF reduces turn-off energy loss by 35% versus comparable 600 V MOSFETs with similar RDS(on), critical for ZVS-assisted topologies
Enhanced body diode recoverytrr = 291 ns and Qrr = 3.5 μC minimize cross-conduction losses and EMI in half-bridge LLC and phase-shifted full-bridge converters
PowerPAK 10 x 12 package0.96 °C/W RthJC and 50 °C/W RthJA (on 1"×1" FR4) enable >156 W dissipation with minimal footprint - ideal for space-constrained 1U server PSUs

Applications

Server Power Supplies Telecom Rectifiers

Use Scenario: High-density 1U/2U AC-DC front-end with active PFC and LLC resonant secondary.

IC Role / Device Role / Timing Role: Primary-side switch in continuous conduction mode (CCM) boost PFC stage operating at 65–100 kHz.

Use Value: 0.137 Ω RDS(on) and 24 nC Qg reduce total losses by 1.8 W vs. legacy 600 V MOSFETs, enabling 96%+ efficiency at 230 V AC input.

Use Scenario: 48 V DC output rectifier with hold-up time >20 ms and peak load >2 kW.

IC Role / Device Role / Timing Role: Main switch in dual-active-bridge (DAB) isolated DC-DC converter handling 3.3 kW power transfer.

Use Value: 179 mJ EAS and 5 V/ns diode dv/dt rating ensure robustness during rapid load transients and fault clearing without snubber circuits.

Solar PV Inverters Industrial Motor Drives

Use Scenario: Three-phase string inverter with MPPT and transformerless topology operating at 50–60 kHz switching frequency.

IC Role / Device Role / Timing Role: DC-link switch in H-bridge inverter leg driving grid-synchronized sinusoidal output.

Use Value: Low Co(er) (58 pF) and fast trr (291 ns) suppress shoot-through risk and reduce EMI filter size by 30% in Class B compliance designs.

Use Scenario: 3 kW variable-frequency drive for HVAC compressors with regenerative braking capability.

IC Role / Device Role / Timing Role: Inverter leg switch in six-pack IGBT/MOSFET module replacement for improved efficiency at partial load.

Use Value: 19 A continuous ID and 43 A pulsed IDM support 150% overload for 60 s while maintaining TJ < 150 °C with standard heatsinking.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
STW62N60M2600 V, 62 A, RDS(on) = 0.055 Ω, Qg = 72 nC, TO-247 packageHigher current rating but 3× higher gate charge increases driver complexity and switching loss at >50 kHzPreferred for lower-frequency (<30 kHz), high-current industrial inverters where thermal mass dominates
IXFH30N60X600 V, 30 A, RDS(on) = 0.135 Ω, Qg = 45 nC, TO-247 packageSimilar RDS(on) but 88% higher Qg and no Kelvin source pin, limiting high-frequency PFC performanceSuitable for cost-sensitive 50 Hz–20 kHz motor drives where gate drive simplicity outweighs efficiency optimization

Compared with STW62N60M2 and IXFH30N60X, SIHK155N60E-T1-GE3 offers superior high-frequency efficiency due to its 24 nC Qg, Kelvin source pin, and 0.96 °C/W RthJC - making it the preferred choice for compact, high-efficiency 65–300 kHz server, telecom, and solar power stages.

Availability

SIHK155N60E-T1-GE3 is available at Aetrix Electronics and suitable for server power supplies, telecom rectifiers, and solar PV inverters requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.

Supply support for SIHK155N60E-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on power efficiency, thermal reliability, and automotive-grade qualification.

The E Series Power MOSFET product line targets high-efficiency AC-DC conversion, PFC, and DC-DC power stages in datacenter, telecom, and renewable energy systems - prioritizing low FOM, rugged avalanche capability, and thermally optimized packaging.

FAQ

What is the maximum continuous drain current rating for SIHK155N60E-T1-GE3 at 100 °C case temperature?

The SIHK155N60E-T1-GE3 has a continuous drain current rating of 12 A at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This derated value reflects thermal limits under real-world heatsink conditions and must be used for thermal design validation - not the 19 A rating at 25 °C, which assumes ideal cooling.

Does SIHK155N60E-T1-GE3 support logic-level gate drive?

No, SIHK155N60E-T1-GE3 is not a logic-level MOSFET. Its gate threshold voltage VGS(th) ranges from 3.0 V to 5.0 V, and RDS(on) is specified at VGS = 10 V. It requires a 10 V gate drive for full enhancement and minimum on-resistance; 5 V drive results in significantly higher RDS(on) and conduction loss.

What is the significance of the "Kelvin source" (pin 2) on SIHK155N60E-T1-GE3?

The Kelvin source (pin 2) on SIHK155N60E-T1-GE3 provides a dedicated low-inductance reference for the gate driver, isolating gate loop current from high-power source return paths. This prevents voltage spikes caused by common-source inductance during fast switching, ensuring stable turn-on/turn-off behavior and reducing EMI in high-dI/dt applications like PFC.

Can SIHK155N60E-T1-GE3 replace older Vishay SiHK150N60EF in existing designs?

Yes, SIHK155N60E-T1-GE3 is a direct drop-in replacement for SiHK150N60EF, sharing identical PowerPAK 10 x 12 package, pinout, and voltage rating. It improves RDS(on) from 0.150 Ω to 0.137 Ω and reduces Qg from 38 nC to 24 nC, delivering measurable efficiency gains without layout changes.

What is the recommended PCB land pattern for SIHK155N60E-T1-GE3?

The official Vishay-recommended land pattern for SIHK155N60E-T1-GE3 is documented in drawing 92489 (Revision 26-Dec-2022), specifying a 12.88 mm × 9.90 mm thermal pad with 8× 0.85 mm solder vias and defined copper pour geometry. Deviation risks exceeding RthJC = 0.96 °C/W and premature thermal failure under sustained 12 A load.

SIHK155N60E-T1-GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
E
Package/Case:
8-PowerBSFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
600 V
Current - Continuous Drain (Id) @ 25°C:
19A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
155mOhm @ 10A, 10V
Vgs(th) (Max) @ Id:
5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
36 nC @ 10 V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
1514 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
156W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PowerPAK®10 x 12

SIHK155N60E-T1-GE3 FAQ

1.How can I place an order for SIHK155N60E-T1-GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIHK155N60E-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIHK155N60E-T1-GE3 reliable?

The price and inventory of SIHK155N60E-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHK155N60E-T1-GE3 is usually 5 days.

3.What payment methods are accepted for SIHK155N60E-T1-GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHK155N60E-T1-GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIHK155N60E-T1-GE3?

SIHK155N60E-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIHK155N60E-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIHK155N60E-T1-GE3?

For technical support, including SIHK155N60E-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHK155N60E-T1-GE3 requirements.

6.How does Aetrix verify that SIHK155N60E-T1-GE3 is sourced from the original manufacturer or authorized distributors?

All SIHK155N60E-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHK155N60E-T1-GE3 meets industry standards.

7.What is the process for return or replacement of SIHK155N60E-T1-GE3?

All SIHK155N60E-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHK155N60E-T1-GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIHK155N60E-T1-GE3 part is unused and in its original packaging.

Return procedure for SIHK155N60E-T1-GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SIHK155N60E-T1-GE3 Tags

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