Vishay Siliconix SIHK185N60E-T1-GE3
- Part No.:
- SIHK185N60E-T1-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerBSFN
- Datasheet:
-
SIHK185N60E-T1-GE3.pdf
- Description:
- E SERIES POWER MOSFET POWERPAK 1
- Quantity:
- Payment:

- Shipping:

Inventory:2,048
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Product details
Overview
SIHK185N60E-T1-GE3 from Vishay Siliconix is a 600 V, 19 A N-channel Power MOSFET in PowerPAK® 10 x 12 (TOLL) package with RDS(on) = 0.160 Ω at VGS = 10 V, Qg = 22 nC (typ), and Kelvin-source configuration for gate noise reduction-designed for high-efficiency PFC and SMPS stages in telecom and server power supplies.
For engineers reviewing the SIHK185N60E-T1-GE3 datasheet, SIHK185N60E-T1-GE3 pinout, SIHK185N60E-T1-GE3 application, or SIHK185N60E-T1-GE3 equivalent, key selection criteria include its 75 mJ UIS rating, 59 pF Co(er), 1.1 °C/W RthJC, and low FOM (RDS(on) × Qg = 3.52 Ω·nC), critical for minimizing switching and conduction losses in hard-switched 600 V topologies.
Technical Context
This E-series MOSFET employs 4th-generation silicon technology optimized for high-voltage, medium-current applications requiring robust avalanche capability and reduced gate charge. Its Kelvin-source connection isolates driver return path from high di/dt source current, suppressing gate oscillation during fast switching.
The device features low effective output capacitance (Co(er) = 59 pF, Co(tr) = 301 pF), enabling efficient operation in continuous conduction mode (CCM) PFC and resonant LLC converters. Its 100 V/ns dv/dt rating at TJ = 125 °C supports stable operation under high-speed voltage transients.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS max | 600 V - supports 400 V DC-link designs with 50 % margin for surge and ringing |
| RDS(on) typ | 0.160 Ω at VGS = 10 V, ID = 9.5 A - enables <1.5 W conduction loss at 10 A |
| Qg typ | 22 nC - reduces gate drive power and allows use of smaller gate drivers |
| EAS | 75 mJ - withstands unclamped inductive switching events without failure |
| RthJC | 1.1 °C/W - enables high-power dissipation with minimal junction-to-case thermal rise |
| Co(er) | 59 pF - lowers stored energy in output capacitance, reducing turn-on loss in hard-switched converters |
| VGS(th) | 3.0–5.0 V - ensures reliable enhancement-mode turn-on with standard 10 V gate drivers |
Pinout & Package
Package: PowerPAK® 10 x 12 (TOLL) - thermally enhanced surface-mount package with exposed drain tab on bottom side for direct PCB heatsinking; 8-pin layout with Kelvin-source configuration.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Gate | Main gate input; routed separately from power source to minimize Miller coupling |
| Pin 2 | Driver Source | Kelvin return for gate driver loop-decoupled from high-current source path to suppress gate noise |
| Pins 3–8 | Power Source | Parallel source terminals carrying full load current; low-inductance connection to ground plane |
| Drain Tab (bottom) | Drain | Exposed copper pad for thermal and electrical connection to PCB drain net and heatsink |
Key Features
| Feature | Design Value |
|---|---|
| Kelvin-source configuration | Separates gate driver return from power source path, reducing gate voltage overshoot and improving switching stability in high-di/dt applications |
| Low RDS(on) × Qg FOM | 3.52 Ω·nC - balances conduction and switching losses for optimal efficiency in 60–100 kHz PFC stages |
| Avalanche-rated (UIS) | 75 mJ single-pulse energy - eliminates need for external snubbers in inductive switching circuits |
| Low Co(er) | 59 pF - minimizes turn-on switching loss in hard-switched topologies by reducing capacitive discharge energy |
| High dv/dt immunity | 100 V/ns at TJ = 125 °C - maintains gate control integrity during fast voltage transients in high-frequency converters |
Applications
| Server Power Supply PFC Stage | Telecom Rectifier Module |
|---|---|
Use Scenario: Boost PFC converter operating at 65–100 kHz with 400 V DC-link in 1U/2U AC-DC front-end units. IC Role / Device Role / Timing Role: Main switching device handling 1–3 kW input power; switches at fixed frequency with average current mode control. Use Value: Low Qg and RDS(on) reduce total losses by ~12 % vs. prior-gen 600 V MOSFETs, enabling higher power density without forced air cooling. | Use Scenario: High-efficiency rectifier module for -48 V telecom systems with active OR-ing and hot-swap capability. IC Role / Device Role / Timing Role: Primary switch in isolated forward or half-bridge topology; operates with synchronous rectification on secondary side. Use Value: Kelvin-source layout prevents false turn-on during bus fault transients, improving system reliability during live insertion/removal. |
| Solar PV Inverter DC-DC Stage | Industrial Motor Drive Inverter |
Use Scenario: DC-DC boost stage in string inverters converting 600–1000 V PV array output to 1200 V DC-link for three-phase inverter stage. IC Role / Device Role / Timing Role: High-side switch in interleaved boost configuration; gated at 30–50 kHz with phase-shifted PWM. Use Value: 75 mJ UIS rating absorbs energy from leakage inductance spikes during zero-crossing transitions, eliminating need for clamping diodes. | Use Scenario: Three-phase inverter leg in 5–15 kW industrial servo drives operating with field-oriented control (FOC). IC Role / Device Role / Timing Role: Upper-leg switching device in 600 V bridge; commutated at up to 16 kHz with dead-time compensation. Use Value: 1.1 °C/W RthJC enables direct thermal coupling to aluminum baseplate, maintaining TJ < 135 °C at 12 A RMS without heatsink fins. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STW62N60M2 | 600 V, 62 A, RDS(on) = 0.055 Ω, TO-247 package, no Kelvin source | Higher current rating but larger footprint and higher Qg (65 nC); lacks integrated gate noise suppression | Preferred where board space permits and higher peak current is required; requires external gate ferrite bead for noise mitigation |
| IXFH60N60X | 600 V, 60 A, RDS(on) = 0.052 Ω, TO-247, no Kelvin source, higher Ciss (2900 pF) | Higher conduction capability but significantly higher input capacitance increases gate drive loss and slows switching | Best suited for lower-frequency (<30 kHz) applications where conduction loss dominates; not recommended for high-frequency PFC |
Compared with STW62N60M2 and IXFH60N60X, the SIHK185N60E-T1-GE3 delivers superior high-frequency efficiency due to its lower FOM and Kelvin-source architecture-making it optimal for compact, thermally constrained 60–100 kHz PFC and DC-DC converters where gate noise and switching loss are critical.
Availability
SIHK185N60E-T1-GE3 is available at Aetrix Electronics and suitable for server power supply PFC stages, telecom rectifier modules, and solar PV inverter DC-DC stages requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production lots.
Supply support for SIHK185N60E-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on power efficiency, ruggedness, and thermal reliability.
The E Series Power MOSFET product line targets high-voltage, medium-current switching applications-including PFC, SMPS, and motor drives-where low FOM, avalanche robustness, and advanced packaging (e.g., Kelvin-source) deliver measurable system-level efficiency gains.
FAQ
What is the maximum continuous drain current rating for SIHK185N60E-T1-GE3 at 100 °C case temperature?
The SIHK185N60E-T1-GE3 has a continuous drain current rating of 12 A at TC = 100 °C, derated linearly above 25 °C with a factor of 0.9 W/°C. This rating assumes proper PCB copper area per the recommended land pattern and adequate airflow or heatsinking. At TC = 25 °C, the rating rises to 19 A, reflecting its 114 W maximum power dissipation capability.
Does SIHK185N60E-T1-GE3 support logic-level gate drive?
No, SIHK185N60E-T1-GE3 is not a logic-level MOSFET. Its gate threshold voltage range is 3.0–5.0 V, and it is specified for RDS(on) at VGS = 10 V. For reliable enhancement-mode operation and low on-resistance, a 10–15 V gate drive is required. Using 5 V logic-level drive would result in incomplete turn-on and excessive conduction loss.
What is the significance of the "Kelvin source" configuration in SIHK185N60E-T1-GE3?
The Kelvin source in SIHK185N60E-T1-GE3 separates the gate driver's source return path (Pin 2) from the main power source terminals (Pins 3–8). This eliminates voltage drop from high di/dt source current from appearing in the gate loop, preventing false turn-on and oscillation-especially critical in high-frequency, high-power PFC and LLC converters where gate noise can cause shoot-through or EMI issues.
Can SIHK185N60E-T1-GE3 be used in avalanche mode repeatedly?
The SIHK185N60E-T1-GE3 is rated for single-pulse avalanche energy (EAS) of 75 mJ, tested under defined conditions (VDD = 120 V, L = 28.2 mH, Rg = 25 Ω). It is not characterized for repetitive avalanche operation. For designs subject to repeated inductive switching stress, additional protection (e.g., clamping circuits or snubbers) is recommended to avoid cumulative junction degradation.
What is the thermal resistance from junction to case (RthJC) for SIHK185N60E-T1-GE3, and how does it impact heatsink design?
The SIHK185N60E-T1-GE3 has a maximum RthJC of 1.1 °C/W, measured from junction to the exposed drain tab. This low value enables efficient heat transfer directly into the PCB copper or an attached heatsink. When designing thermal management, this value must be combined with RthCS (case-to-sink) and RthSA (sink-to-ambient) to ensure TJ remains below 150 °C under worst-case load and ambient conditions. The PowerPAK® 10 x 12 land pattern (Document 92489) is mandatory for achieving this spec.
SIHK185N60E-T1-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- E
- Package/Case:
- 8-PowerBSFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 19A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 185mOhm @ 9.5A, 10V
- Vgs(th) (Max) @ Id:
- 5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 33 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1085 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 114W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerPAK®10 x 12
SIHK185N60E-T1-GE3 FAQ
1.How can I place an order for SIHK185N60E-T1-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIHK185N60E-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIHK185N60E-T1-GE3 reliable?
The price and inventory of SIHK185N60E-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHK185N60E-T1-GE3 is usually 5 days.
3.What payment methods are accepted for SIHK185N60E-T1-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHK185N60E-T1-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIHK185N60E-T1-GE3?
SIHK185N60E-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIHK185N60E-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIHK185N60E-T1-GE3?
For technical support, including SIHK185N60E-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHK185N60E-T1-GE3 requirements.
6.How does Aetrix verify that SIHK185N60E-T1-GE3 is sourced from the original manufacturer or authorized distributors?
All SIHK185N60E-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHK185N60E-T1-GE3 meets industry standards.
7.What is the process for return or replacement of SIHK185N60E-T1-GE3?
All SIHK185N60E-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHK185N60E-T1-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIHK185N60E-T1-GE3 part is unused and in its original packaging.
Return procedure for SIHK185N60E-T1-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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