Vishay Siliconix SIHL620S-GE3
- Part No.:
- SIHL620S-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
SIHL620S-GE3.pdf
- Description:
- LOGIC MOSFET N-CHANNEL 200V
- Quantity:
- Payment:

- Shipping:

Inventory:686
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SIHL620S-GE3 from Vishay Siliconix is a 200 V, 5.2 A N-channel surface-mount power MOSFET in D2PAK (TO-263) package, featuring logic-level gate drive (VGS(th) = 1.0–2.0 V), RDS(on) = 0.80 Ω at VGS = 10 V, and repetitive avalanche rating (IAR = 5.2 A). It is designed for high-current DC-DC converters and motor control circuits requiring rugged switching under inductive loads.
For engineers reviewing the SIHL620S-GE3 datasheet, SIHL620S-GE3 pinout, SIHL620S-GE3 application, or SIHL620S-GE3 equivalent, key selection criteria include its 200 V VDS, 16 nC total gate charge, 5.2 A continuous drain current at TC = 25 °C, and D2PAK thermal performance (RthJC = 2.5 °C/W), critical for board-level power density and thermal management.
Technical Context
This third-generation power MOSFET uses planar silicon technology optimized for fast switching and ruggedized avalanche operation. Its dynamic dV/dt rating (5.0 V/ns) and unclamped inductive switching capability (EAS = 125 mJ) support reliable operation in hard-switched topologies with high di/dt transients.
The device integrates a low-Qgd/Qg ratio (9.6/16 nC) and low output capacitance (Coss = 91 pF), enabling efficient zero-voltage switching (ZVS) assist and reduced switching losses in resonant converters. Body diode recovery (trr = 180–270 ns, Qrr = 1.1–1.7 μC) is characterized for synchronous rectification and freewheeling applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 200 V - supports input rails up to 170 V DC in offline SMPS or 48 V industrial bus systems with margin |
| RDS(on) max | 0.80 Ω at VGS = 10 V - enables ≤2.5 W conduction loss at 5.2 A, suitable for medium-power switching |
| Qg | 16 nC - determines gate driver strength requirement; compatible with standard 1-A peak drivers |
| ID continuous | 5.2 A at TC = 25 °C - defines PCB copper area and heatsinking needs for sustained load conditions |
| EAS | 125 mJ - quantifies single-pulse energy handling during inductive turn-off, critical for relay/snubberless designs |
| RthJC | 2.5 °C/W - allows direct case-to-heatsink thermal path; enables >30 W dissipation with 75 °C ΔT |
| trr | 180–270 ns - sets minimum dead-time in half-bridge configurations to prevent shoot-through |
Pinout & Package
D2PAK (TO-263) package: surface-mount, isolated thermal pad (drain-connected), 3-terminal configuration with 4.06–4.83 mm height, 8.38–9.65 mm width, and 9.65–10.67 mm length per JEDEC MS-013. Thermal pad must be soldered to large copper pour for rated power dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Tab / Pin 2 (Drain) | Main power output terminal and thermal interface | Electrically connected to die drain; requires full-solder coverage of thermal pad for RthJC = 2.5 °C/W performance |
| Pin 1 (Gate) | Control input for channel modulation | Logic-compatible (VGS(th) ≤ 2.0 V); requires <16 nC charge for full enhancement; sensitive to ESD |
| Pin 3 (Source) | Power return and reference node for gate drive | Serves as local ground for gate loop; internal source inductance (LS = 7.5 nH) impacts switching waveform ringing |
Key Features
| Feature | Design Value |
|---|---|
| Logic-level gate drive | Operates fully enhanced at VGS = 4.0 V (RDS(on) ≤ 1.0 Ω), eliminating need for gate boosters in 3.3 V/5 V microcontroller interfaces |
| Repetitive avalanche rated | Rated for IAR = 5.2 A pulses (TJ ≤ 150 °C), enabling robust operation in flyback snubberless or solenoid drive circuits |
| Dynamic dV/dt immunity | Specified at 5.0 V/ns - suppresses false turn-on during high-speed voltage transients in bridge legs |
| Low Qgd/Qg ratio | 60 % of total gate charge resides in Miller region (9.6/16 nC), improving controllability during switching transitions |
| RoHS-compliant, halogen-free | Meets IEC 61249-2-21 and JEDEC J-STD-609A Class 1 standards; Pb-free matte tin terminations |
Applications
| DC-DC Converter Primary Switch | Industrial Motor Driver Half-Bridge |
|---|---|
Use Scenario: 48 V input, 12 V output synchronous buck converter operating at 200 kHz. IC Role / Device Role / Timing Role: High-side power switch controlling energy transfer into output inductor; duty-cycle modulated by PWM controller. Use Value: Low RDS(on) (0.80 Ω) minimizes conduction loss at 5 A load; fast tr/tf (31 ns/17 ns) reduces switching loss contribution. | Use Scenario: 24 V brushed DC motor H-bridge driving 3 A stall current in factory automation actuator. IC Role / Device Role / Timing Role: Low-side switching element in half-bridge leg; commutated at ≤10 kHz with PWM speed control. Use Value: Repetitive avalanche rating absorbs inductive kickback during PWM off-time; logic-level gate simplifies MCU GPIO direct drive. |
| AC-DC Adapter Flyback Switch | LED Driver Constant-Current Switch |
Use Scenario: 85–265 V AC input offline flyback adapter delivering 12 V/1.5 A with primary-side regulation. IC Role / Device Role / Timing Role: Primary-side power switch clamping reflected output voltage and conducting magnetizing current. Use Value: 200 V VDS provides 30 % margin over 1.414 × 265 V = 375 V peak line; EAS = 125 mJ handles unclamped leakage inductance spikes. | Use Scenario: 36 V constant-voltage LED string driver with analog dimming via MOSFET current shunt. IC Role / Device Role / Timing Role: Linear-mode current regulator placed in series with LED string, dissipating excess voltage. Use Value: RDS(on) tolerance and thermal stability (ΔRDS(on)/TJ = +0.27 %/°C) ensure consistent current regulation across -40 to +125 °C ambient. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRL620SPbF | Same die, leaded (Pb) terminations; identical RDS(on), Qg, and avalanche specs | Not RoHS-compliant; restricted in EU/China electronics; requires exemption documentation | Select only if legacy Pb-based assembly process is mandated and compliance waivers apply |
| STP20NM20 | 200 V, 20 A, RDS(on) = 0.22 Ω @ 10 V; TO-220 package; higher current, lower RDS(on), but larger footprint and no logic-level gate | Requires gate driver for 3.3 V logic; better for high-current, low-loss designs where space and thermal mass allow TO-220 mounting | Choose when >10 A continuous current or lower conduction loss is required, and gate drive voltage ≥10 V is available |
Compared with IRL620SPbF, SIHL620S-GE3 offers RoHS/halogen-free compliance without electrical trade-offs; versus STP20NM20, it trades higher RDS(on) and lower current for surface-mount compatibility, logic-level drive, and smaller D2PAK footprint-ideal for space-constrained, low-to-medium power boards.
Availability
SIHL620S-GE3 is available at Aetrix Electronics and suitable for industrial motor drives, DC-DC converters, and LED lighting systems requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.
Supply support for SIHL620S-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in power MOSFETs, diodes, and optoelectronics with emphasis on ruggedness, efficiency, and reliability.
The SIHL620S-GE3 belongs to Vishay's third-generation surface-mount power MOSFET family, engineered for high-current, high-voltage switching in compact industrial and consumer power supplies where logic-level drive and avalanche robustness are essential.
FAQ
What is the maximum continuous drain current for SIHL620S-GE3 at 100 °C case temperature?
The SIHL620S-GE3 supports 3.3 A continuous drain current at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limitations of the D2PAK package; designers must ensure adequate PCB copper area and airflow to maintain case temperature within this limit during sustained operation. The SIHL620S-GE3 datasheet confirms this value under standard test conditions with FR-4 mounting.
Does SIHL620S-GE3 support logic-level gate drive, and what is its threshold voltage range?
Yes, SIHL620S-GE3 is a logic-level MOSFET with gate-threshold voltage VGS(th) specified from 1.0 V to 2.0 V at ID = 250 μA. It achieves RDS(on) ≤ 1.0 Ω at VGS = 4.0 V, enabling direct drive from 3.3 V or 5 V microcontrollers without level-shifting circuitry. This characteristic is explicitly confirmed in the Static Specifications table of the SIHL620S-GE3 datasheet.
What is the avalanche energy rating of SIHL620S-GE3, and how is it tested?
The SIHL620S-GE3 has a single-pulse avalanche energy rating EAS = 125 mJ, measured under VDD = 50 V, starting TJ = 25 °C, L = 6.9 mH, Rg = 25 Ω, and IAS = 5.2 A per Figure 12. This rating validates its ability to absorb inductive energy during unclamped inductive switching events, such as relay coil de-energization or motor phase commutation. The SIHL620S-GE3 datasheet specifies this as a repetitive rating with pulse width limited by junction temperature.
What package type does SIHL620S-GE3 use, and what are its thermal characteristics?
SIHL620S-GE3 uses the D2PAK (TO-263AB) surface-mount package with an exposed drain thermal pad. Its thermal resistance is RthJC = 2.5 °C/W (junction-to-case) and RthJA = 40 °C/W (junction-to-ambient on 1" FR-4 PCB). These values enable up to 50 W power dissipation at TC = 25 °C and require full-solder coverage of the thermal pad to achieve rated performance. The SIHL620S-GE3 package drawing conforms to JEDEC MS-013.
Is SIHL620S-GE3 RoHS-compliant and halogen-free?
Yes, SIHL620S-GE3 is both RoHS-compliant and halogen-free, as indicated by the "-GE3" suffix and confirmed in the Ordering Information and Material Categorization sections of the datasheet. It meets IEC 61249-2-21 and JEDEC J-STD-609A Class 1 requirements, with matte tin (Sn) lead finish and no brominated flame retardants. This compliance is verified in Vishay document 91302, revision D.
SIHL620S-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 200 V
- Current - Continuous Drain (Id) @ 25°C:
- 5.2A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4V, 10V
- Rds On (Max) @ Id, Vgs:
- 800mOhm @ 3.1A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 16 nC @ 5 V
- Vgs (Max):
- ±10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 360 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 3.1W (Ta), 50W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-263 (D2PAK)
SIHL620S-GE3 FAQ
1.How can I place an order for SIHL620S-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIHL620S-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIHL620S-GE3 reliable?
The price and inventory of SIHL620S-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHL620S-GE3 is usually 5 days.
3.What payment methods are accepted for SIHL620S-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHL620S-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIHL620S-GE3?
SIHL620S-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIHL620S-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIHL620S-GE3?
For technical support, including SIHL620S-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHL620S-GE3 requirements.
6.How does Aetrix verify that SIHL620S-GE3 is sourced from the original manufacturer or authorized distributors?
All SIHL620S-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHL620S-GE3 meets industry standards.
7.What is the process for return or replacement of SIHL620S-GE3?
All SIHL620S-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHL620S-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIHL620S-GE3 part is unused and in its original packaging.
Return procedure for SIHL620S-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SIHL620S-GE3 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

.jpg)