Vishay Siliconix SIHP12N50E-BE3
- Part No.:
- SIHP12N50E-BE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3
- Datasheet:
-
SIHP12N50E-BE3.pdf
- Description:
- N-CHANNEL 500V
- Quantity:
- Payment:

- Shipping:

Inventory:836
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Product details
Overview
SIHP12N50E-BE3 from Vishay Siliconix is a 500 V, 10.5 A N-channel enhancement-mode Power MOSFET in TO-220AB package, optimized for hard-switched SMPS topologies including PFC and flyback converters, with RDS(on) = 0.380 Ω at VGS = 10 V and Qg = 50 nC.
For engineers reviewing the SIHP12N50E-BE3 datasheet, SIHP12N50E-BE3 pinout, SIHP12N50E-BE3 application, or SIHP12N50E-BE3 equivalent, key selection criteria include avalanche-rated UIS energy (103 mJ), low Ciss (886 pF), and thermal resistance RthJC = 1.1 °C/W - critical for high-efficiency, thermally constrained power stages.
Technical Context
This MOSFET employs planar silicon technology with an integral body diode rated for 10.5 A continuous source-drain current and 244 ns reverse recovery time. Its gate threshold voltage (2.0–4.0 V) ensures robust turn-on under standard 10 V drive while maintaining noise immunity.
The device is characterized for operation up to TJ = 150 °C with a positive VDS temperature coefficient (0.60 V/°C) and supports unclamped inductive switching per JEDEC JESD24-11. Dynamic parameters are specified at VDS = 400 V, ID = 6 A, Rg = 9.1 Ω, enabling accurate loss modeling in PFC and forward converter designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS max | 500 V - supports 400 V DC bus designs with 25 % margin for voltage transients in PFC and industrial SMPS |
| RDS(on) max | 0.380 Ω @ VGS = 10 V - determines conduction loss in high-current primary-side switches |
| Qg max | 50 nC - directly impacts gate drive power and switching speed in 65–100 kHz hard-switched topologies |
| EAS | 103 mJ - enables reliable operation under unclamped inductive load conditions without external snubbers |
| Ciss | 886 pF - reduces Miller-induced shoot-through risk and eases gate driver sizing in high-dV/dt environments |
| RthJC | 1.1 °C/W - allows 114 W dissipation with ≤125 °C case-to-ambient delta, supporting compact heatsink integration |
| ID cont @ TC = 100 °C | 6.6 A - defines usable current derating in enclosed, convection-cooled enclosures |
Pinout & Package
TO-220AB package with isolated tab (drain-connected), standard 3-lead through-hole mounting, 1.1 °C/W junction-to-case thermal resistance, and RoHS-compliant lead-free/halogen-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G (Gate) | Control terminal | Receives 10 V logic-level drive; 6 nC Qgs enables fast turn-on with minimal driver stress |
| D (Drain) | High-side power output | Connected to drain metallization and package tab; electrically isolated but thermally coupled to heatsink |
| S (Source) | Power return / reference node | Common return path for load current and gate drive loop; low-inductance layout essential for EMI control |
Key Features
| Feature | Design Value |
|---|---|
| Low FOM (RDS(on) × Qg) | 19.0 Ω·nC - balances conduction and switching losses for optimal efficiency in 65–100 kHz PFC stages |
| Avalanche-rated (UIS) | 103 mJ single-pulse energy - eliminates need for external clamping in inductive load switching |
| Low Ciss and Crss | 886 pF input / 6 pF reverse transfer capacitance - minimizes Miller effect and improves dv/dt immunity |
| Enhanced body diode | 244 ns trr, 2.5 μC Qrr - reduces recovery loss and ringing in synchronous rectification and flyback freewheeling |
| Thermal performance | RthJC = 1.1 °C/W - enables direct-mount heatsinking for high-power density designs without thermal interface pads |
Applications
| PC ATX Silver Box Power Supply | Two-Stage LED Driver |
|---|---|
Use Scenario: Primary-side switch in active PFC boost stage operating at 65–100 kHz with 400 V DC bus. IC Role / Device Role / Timing Role: High-voltage, high-current switching element controlling inductor current to shape input current waveform. Use Value: 500 V rating and 103 mJ UIS energy ensure reliability during line surges and startup transients without snubber circuits. | Use Scenario: Primary-side switch in flyback converter powering constant-current LED strings in commercial lighting fixtures. IC Role / Device Role / Timing Role: Main power switch regulating energy transfer to secondary side via transformer coupling. Use Value: Low 0.380 Ω RDS(on) and 50 nC Qg reduce total losses at 70–100 kHz, improving thermal margin in sealed luminaires. |
| Hard-Switched Two-Switch Forward Converter | Industrial SMPS for Control Systems |
Use Scenario: Main switching device in two-switch forward topology for 24–48 V output, 200–500 W industrial power modules. IC Role / Device Role / Timing Role: Synchronized high-side switch managing duty cycle and core reset during each switching cycle. Use Value: 1.1 °C/W RthJC and 114 W PD allow direct heatsink mounting, simplifying mechanical design and reducing thermal interface layers. | Use Scenario: Primary-side switch in DIN-rail mounted 24 V/5 A SMPS powering PLC I/O modules and sensors. IC Role / Device Role / Timing Role: Robust main switch handling wide input range (85–265 VAC) and sustained overload conditions. Use Value: -55 to +150 °C operating range and 10.5 A continuous current support long-term reliability in unventilated enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP12NK50ZFP | 500 V, 12 A, RDS(on) = 0.38 Ω, Qg = 45 nC, TO-220FP package (full-pack) | Lower RthJA due to insulated package; slightly lower Qg reduces gate drive loss | Preferred when isolation from heatsink is required; same footprint but different mounting (no insulator needed for SIHP12N50E-BE3) |
| IRFP460LC | 500 V, 20 A, RDS(on) = 0.27 Ω, Qg = 120 nC, TO-247AC package | Higher current rating and lower RDS(on), but larger package and higher Qg demands stronger gate driver | Selected for higher-power designs (>300 W) where thermal headroom and peak current margin outweigh layout size constraints |
Compared with STP12NK50ZFP and IRFP460LC, SIHP12N50E-BE3 offers best-in-class FOM for mid-power PFC and flyback use cases, with optimized trade-off between conduction loss, switching charge, and thermal resistance in TO-220AB - making it ideal for cost-sensitive, space-constrained 100–250 W systems.
Availability
SIHP12N50E-BE3 is available at Aetrix Electronics and suitable for PC ATX power supplies, LED lighting drivers, and industrial SMPS requiring stable component supply, long-lifecycle support, and consistent parametric performance across manufacturing lots.
Supply support for SIHP12N50E-BE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-reliability MOSFETs, diodes, and optoelectronics for power, signal, and sensing applications.
The SIHP12N50E-BE3 belongs to Vishay's E Series Power MOSFET family, engineered specifically for high-efficiency, hard-switched AC/DC and DC/DC conversion in computing, lighting, and industrial power systems.
FAQ
What is the maximum continuous drain current of SIHP12N50E-BE3 at 100 °C case temperature?
The SIHP12N50E-BE3 supports 6.6 A continuous drain current at TC = 100 °C, as specified in its Absolute Maximum Ratings table. This derated value reflects thermal limitations under real-world heatsink conditions and must be used for safe operating area (SOA) validation in designs where ambient temperature exceeds 50 °C or airflow is restricted. The SIHP12N50E-BE3 datasheet confirms this rating applies with VGS = 10 V and TJ ≤ 150 °C.
Does SIHP12N50E-BE3 have avalanche capability, and how is it rated?
Yes, SIHP12N50E-BE3 is fully rated for unclamped inductive switching (UIS) with a single-pulse avalanche energy of 103 mJ at TJ = 25 °C, tested per JEDEC JESD24-11. This rating is measured with L = 28.2 mH, Rg = 25 Ω, and IAS = 2.7 A. The SIHP12N50E-BE3's ruggedness supports reliable operation in PFC and flyback converters without external avalanche clamping components.
What is the gate threshold voltage range for SIHP12N50E-BE3, and why does it matter?
The SIHP12N50E-BE3 has a gate-source threshold voltage (VGS(th)) range of 2.0 V to 4.0 V at ID = 250 μA. This ensures full enhancement at standard 10 V gate drive while providing noise margin against spurious turn-on in high-dV/dt environments. The SIHP12N50E-BE3's typical VGS(th) of ~3.0 V aligns with industry-standard logic-level drivers, eliminating need for level-shifting circuitry in most SMPS designs.
How does the body diode performance of SIHP12N50E-BE3 compare to standard MOSFETs?
The SIHP12N50E-BE3 features an optimized body diode with trr = 244 ns and Qrr = 2.5 μC at TJ = 25 °C, IS = 6 A, dI/dt = 100 A/μs. This is significantly faster and lower-charge than generic power MOSFETs, reducing recovery loss and EMI in flyback and LLC resonant converters. The SIHP12N50E-BE3's body diode is characterized for hard commutation, supporting quasi-resonant and discontinuous conduction mode operation.
Is SIHP12N50E-BE3 compatible with lead-free reflow soldering processes?
Yes, SIHP12N50E-BE3 is lead (Pb)-free and halogen-free, qualified for peak reflow temperatures up to 300 °C for 10 seconds per IPC/JEDEC J-STD-020. The "-BE3" suffix explicitly denotes Vishay's lead-free/halogen-free manufacturing process and packaging. The SIHP12N50E-BE3's TO-220AB package meets RoHS Directive 2011/65/EU and complies with Vishay's material categorization per document 99912.
SIHP12N50E-BE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- -
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 500 V
- Current - Continuous Drain (Id) @ 25°C:
- 10.5A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 380mOhm @ 6A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 50 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 886 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 114W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220AB
SIHP12N50E-BE3 FAQ
1.How can I place an order for SIHP12N50E-BE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIHP12N50E-BE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIHP12N50E-BE3 reliable?
The price and inventory of SIHP12N50E-BE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHP12N50E-BE3 is usually 5 days.
3.What payment methods are accepted for SIHP12N50E-BE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHP12N50E-BE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIHP12N50E-BE3?
SIHP12N50E-BE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIHP12N50E-BE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIHP12N50E-BE3?
For technical support, including SIHP12N50E-BE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHP12N50E-BE3 requirements.
6.How does Aetrix verify that SIHP12N50E-BE3 is sourced from the original manufacturer or authorized distributors?
All SIHP12N50E-BE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHP12N50E-BE3 meets industry standards.
7.What is the process for return or replacement of SIHP12N50E-BE3?
All SIHP12N50E-BE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHP12N50E-BE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIHP12N50E-BE3 part is unused and in its original packaging.
Return procedure for SIHP12N50E-BE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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