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Vishay Siliconix SIHP15N60E-E3

Part No.:
SIHP15N60E-E3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
TO-220-3
Datasheet:
AetrixSIHP15N60E-E3.pdf
Description:
MOSFET N-CH 600V 15A TO220AB
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,208

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Product details

Overview

SIHP15N60E-E3 from Vishay Siliconix is a 600 V, 15 A N-channel enhancement-mode Power MOSFET in TO-220AB package, featuring RDS(on) = 0.28 Ω (max) at VGS = 10 V, Qg = 78 nC (max), and avalanche-rated (EAS = 102 mJ). It delivers low conduction and switching losses for high-efficiency SMPS and PFC stages in telecom and server power supplies.

For engineers reviewing the SIHP15N60E-E3 datasheet, SIHP15N60E-E3 pinout, SIHP15N60E-E3 application, or SIHP15N60E-E3 equivalent, key selection criteria include its 600 V VDS, 0.28 Ω RDS(on), 78 nC total gate charge, TO-220AB thermal performance (RthJC = 0.7 °C/W), and UIS-rated ruggedness - all critical for hard-switched industrial and renewable energy inverters.

Technical Context

This MOSFET employs planar stripe silicon technology optimized for high-voltage switching with low figure-of-merit (RDS(on) × Qg). Its gate threshold voltage (VGS(th) = 2–4 V) ensures reliable turn-on with standard 10 V gate drivers, while its Ciss = 1350 pF (typ) and Coss = 70 pF (typ) support fast, controlled transitions under 480 V bus conditions.

The integrated body diode exhibits trr = 302–604 ns and Qrr = 4.0–8.0 μC at IF = 8 A, enabling moderate-frequency freewheeling in continuous conduction mode (CCM) PFC. Its 150 °C maximum junction temperature and 180 W power dissipation rating allow operation in thermally constrained enclosures when mounted on heatsinks.

Key Specifications

ParameterValue and Actual Design Meaning
VDS600 V - supports 400 V AC input rectified to ~560 V DC bus with margin for transient spikes in telecom/server PSUs
RDS(on) max0.28 Ω at VGS = 10 V, TJ = 25 °C - limits conduction loss to ≤2.2 W at 10 A DC, enabling compact thermal design
Qg max78 nC - determines gate drive power requirement (~0.78 mW per 100 kHz switch cycle at 10 V drive)
EAS102 mJ - enables unclamped inductive switching survival without external snubbers in motor drive or welder H-bridges
RthJC0.7 °C/W - allows 126 W junction-to-case heat transfer at ΔT = 88 °C, supporting high-power density layouts
ID cont15 A at TC = 25 °C - defines maximum continuous current under ideal heatsinking; derates to 9.6 A at TC = 100 °C
VGS(th)2–4 V - ensures full enhancement with industry-standard 10 V gate drivers while avoiding spurious turn-on from noise

Pinout & Package

TO-220AB package with isolated tab (drain-connected), 3-pin through-hole mounting, 0.7 °C/W junction-to-case thermal resistance, and JEDEC-compliant outline.

Pin/TerminalCircuit RoleDesign Meaning
G (Gate)Control electrodeReceives 10 V logic-level signal; requires <78 nC charge to fully enhance; low Ciss reduces driver loading
D (Drain)High-side power terminalConnected to TO-220 tab; carries full load current and withstands 600 V; must be electrically isolated from heatsink unless specified
S (Source)Reference node / return pathCommon reference for gate drive and current sensing; ties to power ground; body diode anode

Key Features

FeatureDesign Value
Low RDS(on) × Qg FOM21.8 Ω·nC (0.28 Ω × 78 nC) - directly improves efficiency in 100–300 kHz SMPS by reducing combined conduction + switching loss
Avalanche energy rating102 mJ single-pulse - eliminates need for external clamping in inductive load switching (e.g., PFC boost chokes, motor phase legs)
Low Ciss (1350 pF typ)Reduces gate drive current demand and EMI generation during hard switching at 480 V bus
Body diode trr (302–604 ns)Enables reliable commutation in CCM PFC and half-bridge topologies without excessive diode loss or voltage overshoot
Lead (Pb)-free & halogen-freeMeets RoHS 2011/65/EU and Vishay's "Green" material categorization (doc# 99912)

Applications

Server Power SuppliesPhotovoltaic Inverters

Use Scenario: Primary-side switching in 1–3 kW telecom rectifiers and server CRPS power supplies operating at 100–200 kHz.

IC Role / Device Role / Timing Role: High-side switch in LLC resonant or hard-switched forward converters handling 400–560 V DC bus.

Use Value: 0.28 Ω RDS(on) and 78 nC Qg reduce total losses below 3.5 W at 12 A, improving system efficiency to >95% at full load.

Use Scenario: DC-DC boost stage and inverter bridge in string-level solar inverters (1–5 kW).

IC Role / Device Role / Timing Role: Unidirectional switch in interleaved boost converters and 600 V-class H-bridge legs.

Use Value: 102 mJ EAS rating tolerates inductive kickback from PV array transients without failure, extending field reliability.

Industrial Motor DrivesFluorescent Ballast Lighting

Use Scenario: Output stage in 0.5–2 kW variable frequency drives for HVAC blowers and pumps.

IC Role / Device Role / Timing Role: Low-side switch in three-phase IGBT/MOSFET inverter modules driving 3-phase induction motors.

Use Value: 15 A continuous current and 150 °C TJ rating sustain 100% torque at elevated ambient temperatures in enclosed cabinets.

Use Scenario: Resonant half-bridge switch in electronic fluorescent lamp (EFL) ballasts operating at 25–50 kHz.

IC Role / Device Role / Timing Role: Fast-switching power switch controlling lamp current via series-resonant tank.

Use Value: 302–604 ns reverse recovery time and low Qrr minimize diode conduction loss and voltage ringing during zero-voltage switching transitions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STP15NM60NDRDS(on) = 0.32 Ω (max), Qg = 65 nC, EAS = 75 mJ, TO-220FP package (lower PD = 110 W)Lower avalanche robustness and power dissipation limit it to lower-stress PFC and lighting applicationsPrefer SIHP15N60E-E3 where 102 mJ EAS and 180 W PD are required for industrial UPS or welder duty cycles
IXTH15N60L2RDS(on) = 0.29 Ω (max), Qg = 62 nC, EAS = 120 mJ, TO-247AC package (RthJC = 0.45 °C/W)Superior thermal performance but larger footprint; higher cost and layout complexity than TO-220ABChoose IXTH15N60L2 only when junction temperature must stay <125 °C under sustained 15 A load without forced air cooling

Compared with STP15NM60ND and IXTH15N60L2, the SIHP15N60E-E3 offers the best balance of avalanche ruggedness (102 mJ), thermal capability (0.7 °C/W), and TO-220AB form factor for cost-sensitive 1–2 kW industrial and telecom power designs.

Availability

SIHP15N60E-E3 is available at Aetrix Electronics and suitable for server power supplies, photovoltaic inverters, industrial motor drives, and fluorescent ballast lighting requiring stable component supply across multi-year production cycles.

Supply support for SIHP15N60E-E3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-reliability MOSFETs, diodes, and optoelectronics for power, signal, and sensing applications.

The SIHP15N60E-E3 belongs to Vishay's E Series Power MOSFET family, engineered for high-voltage switching in telecom, industrial, and renewable energy systems where ruggedness, low loss, and long-term stability are critical.

FAQ

What is the maximum continuous drain current rating for SIHP15N60E-E3 at 100 °C case temperature?

The SIHP15N60E-E3 has a maximum continuous drain current (ID) of 9.6 A at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limitations of the TO-220AB package; at TC = 25 °C, ID is rated at 15 A. The linear derating factor is 1.4 W/°C, allowing precise thermal margin calculation for heatsink design in the SIHP15N60E-E3 application.

Does SIHP15N60E-E3 have a fully rated avalanche capability, and what is its single-pulse energy limit?

Yes, the SIHP15N60E-E3 is fully rated for unclamped inductive switching (UIS) with a single-pulse avalanche energy (EAS) of 102 mJ, tested per JEDEC JESD24-1. This rating applies under defined conditions: VDD = 50 V, starting TJ = 25 °C, L = 11.6 mH, Rg = 25 Ω, and IAS = 4.2 A. This ruggedness makes SIHP15N60E-E3 suitable for PFC and motor drive circuits where inductive energy must be safely absorbed without external protection.

What is the typical gate charge profile of SIHP15N60E-E3, and how does it affect gate driver selection?

The SIHP15N60E-E3 has Qg = 39–78 nC (typ–max) at VGS = 10 V, with Qgs = 11 nC and Qgd = 17 nC. This profile indicates strong Miller immunity and predictable turn-on timing. For 100 kHz switching, a driver capable of sourcing/sinking ≥1 A peak current is recommended to achieve <50 ns rise/fall times. The low Qgd/Qg ratio (≈22%) minimizes sensitivity to dV/dt-induced false turn-on, enhancing reliability in the SIHP15N60E-E3 application.

How does the body diode performance of SIHP15N60E-E3 compare to standard recovery diodes in PFC applications?

The SIHP15N60E-E3 body diode has trr = 302–604 ns and Qrr = 4.0–8.0 μC at IF = 8 A, dI/dt = 100 A/μs, and TJ = 25 °C. Compared to standard FRDs, this is moderately fast and low-charge, enabling acceptable efficiency in CCM boost PFC. However, for ultra-high-efficiency (>98%) designs, a dedicated SiC Schottky or fast recovery diode remains preferable. The SIHP15N60E-E3 body diode is sufficient for cost-optimized 1–2 kW telecom PSUs where simplicity outweighs marginal loss reduction.

Is SIHP15N60E-E3 compatible with standard TO-220 heatsinks, and what is its thermal resistance from junction to case?

Yes, the SIHP15N60E-E3 uses the industry-standard TO-220AB package with a drain-connected metal tab, making it mechanically and thermally compatible with off-the-shelf TO-220 heatsinks. Its maximum junction-to-case thermal resistance (RthJC) is 0.7 °C/W, meaning a 126 W power dissipation raises the junction temperature by 88.2 °C above case temperature. Proper mounting pressure, thermal interface material, and heatsink surface flatness are essential to achieve this spec in the SIHP15N60E-E3 application.

SIHP15N60E-E3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
-
Package/Case:
TO-220-3
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
600 V
Current - Continuous Drain (Id) @ 25°C:
15A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
280mOhm @ 8A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
78 nC @ 10 V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
1350 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
180W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-220AB

SIHP15N60E-E3 FAQ

1.How can I place an order for SIHP15N60E-E3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIHP15N60E-E3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIHP15N60E-E3 reliable?

The price and inventory of SIHP15N60E-E3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHP15N60E-E3 is usually 5 days.

3.What payment methods are accepted for SIHP15N60E-E3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHP15N60E-E3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIHP15N60E-E3?

SIHP15N60E-E3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIHP15N60E-E3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIHP15N60E-E3?

For technical support, including SIHP15N60E-E3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHP15N60E-E3 requirements.

6.How does Aetrix verify that SIHP15N60E-E3 is sourced from the original manufacturer or authorized distributors?

All SIHP15N60E-E3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHP15N60E-E3 meets industry standards.

7.What is the process for return or replacement of SIHP15N60E-E3?

All SIHP15N60E-E3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHP15N60E-E3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIHP15N60E-E3 part is unused and in its original packaging.

Return procedure for SIHP15N60E-E3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SIHP15N60E-E3 Tags

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