Vishay Siliconix SIHP15N60E-E3
- Part No.:
- SIHP15N60E-E3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-220-3
- Datasheet:
-
SIHP15N60E-E3.pdf
- Description:
- MOSFET N-CH 600V 15A TO220AB
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SIHP15N60E-E3 from Vishay Siliconix is a 600 V, 15 A N-channel enhancement-mode Power MOSFET in TO-220AB package, featuring RDS(on) = 0.28 Ω (max) at VGS = 10 V, Qg = 78 nC (max), and avalanche-rated (EAS = 102 mJ). It delivers low conduction and switching losses for high-efficiency SMPS and PFC stages in telecom and server power supplies.
For engineers reviewing the SIHP15N60E-E3 datasheet, SIHP15N60E-E3 pinout, SIHP15N60E-E3 application, or SIHP15N60E-E3 equivalent, key selection criteria include its 600 V VDS, 0.28 Ω RDS(on), 78 nC total gate charge, TO-220AB thermal performance (RthJC = 0.7 °C/W), and UIS-rated ruggedness - all critical for hard-switched industrial and renewable energy inverters.
Technical Context
This MOSFET employs planar stripe silicon technology optimized for high-voltage switching with low figure-of-merit (RDS(on) × Qg). Its gate threshold voltage (VGS(th) = 2–4 V) ensures reliable turn-on with standard 10 V gate drivers, while its Ciss = 1350 pF (typ) and Coss = 70 pF (typ) support fast, controlled transitions under 480 V bus conditions.
The integrated body diode exhibits trr = 302–604 ns and Qrr = 4.0–8.0 μC at IF = 8 A, enabling moderate-frequency freewheeling in continuous conduction mode (CCM) PFC. Its 150 °C maximum junction temperature and 180 W power dissipation rating allow operation in thermally constrained enclosures when mounted on heatsinks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 600 V - supports 400 V AC input rectified to ~560 V DC bus with margin for transient spikes in telecom/server PSUs |
| RDS(on) max | 0.28 Ω at VGS = 10 V, TJ = 25 °C - limits conduction loss to ≤2.2 W at 10 A DC, enabling compact thermal design |
| Qg max | 78 nC - determines gate drive power requirement (~0.78 mW per 100 kHz switch cycle at 10 V drive) |
| EAS | 102 mJ - enables unclamped inductive switching survival without external snubbers in motor drive or welder H-bridges |
| RthJC | 0.7 °C/W - allows 126 W junction-to-case heat transfer at ΔT = 88 °C, supporting high-power density layouts |
| ID cont | 15 A at TC = 25 °C - defines maximum continuous current under ideal heatsinking; derates to 9.6 A at TC = 100 °C |
| VGS(th) | 2–4 V - ensures full enhancement with industry-standard 10 V gate drivers while avoiding spurious turn-on from noise |
Pinout & Package
TO-220AB package with isolated tab (drain-connected), 3-pin through-hole mounting, 0.7 °C/W junction-to-case thermal resistance, and JEDEC-compliant outline.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G (Gate) | Control electrode | Receives 10 V logic-level signal; requires <78 nC charge to fully enhance; low Ciss reduces driver loading |
| D (Drain) | High-side power terminal | Connected to TO-220 tab; carries full load current and withstands 600 V; must be electrically isolated from heatsink unless specified |
| S (Source) | Reference node / return path | Common reference for gate drive and current sensing; ties to power ground; body diode anode |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(on) × Qg FOM | 21.8 Ω·nC (0.28 Ω × 78 nC) - directly improves efficiency in 100–300 kHz SMPS by reducing combined conduction + switching loss |
| Avalanche energy rating | 102 mJ single-pulse - eliminates need for external clamping in inductive load switching (e.g., PFC boost chokes, motor phase legs) |
| Low Ciss (1350 pF typ) | Reduces gate drive current demand and EMI generation during hard switching at 480 V bus |
| Body diode trr (302–604 ns) | Enables reliable commutation in CCM PFC and half-bridge topologies without excessive diode loss or voltage overshoot |
| Lead (Pb)-free & halogen-free | Meets RoHS 2011/65/EU and Vishay's "Green" material categorization (doc# 99912) |
Applications
| Server Power Supplies | Photovoltaic Inverters |
|---|---|
Use Scenario: Primary-side switching in 1–3 kW telecom rectifiers and server CRPS power supplies operating at 100–200 kHz. IC Role / Device Role / Timing Role: High-side switch in LLC resonant or hard-switched forward converters handling 400–560 V DC bus. Use Value: 0.28 Ω RDS(on) and 78 nC Qg reduce total losses below 3.5 W at 12 A, improving system efficiency to >95% at full load. | Use Scenario: DC-DC boost stage and inverter bridge in string-level solar inverters (1–5 kW). IC Role / Device Role / Timing Role: Unidirectional switch in interleaved boost converters and 600 V-class H-bridge legs. Use Value: 102 mJ EAS rating tolerates inductive kickback from PV array transients without failure, extending field reliability. |
| Industrial Motor Drives | Fluorescent Ballast Lighting |
Use Scenario: Output stage in 0.5–2 kW variable frequency drives for HVAC blowers and pumps. IC Role / Device Role / Timing Role: Low-side switch in three-phase IGBT/MOSFET inverter modules driving 3-phase induction motors. Use Value: 15 A continuous current and 150 °C TJ rating sustain 100% torque at elevated ambient temperatures in enclosed cabinets. | Use Scenario: Resonant half-bridge switch in electronic fluorescent lamp (EFL) ballasts operating at 25–50 kHz. IC Role / Device Role / Timing Role: Fast-switching power switch controlling lamp current via series-resonant tank. Use Value: 302–604 ns reverse recovery time and low Qrr minimize diode conduction loss and voltage ringing during zero-voltage switching transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP15NM60ND | RDS(on) = 0.32 Ω (max), Qg = 65 nC, EAS = 75 mJ, TO-220FP package (lower PD = 110 W) | Lower avalanche robustness and power dissipation limit it to lower-stress PFC and lighting applications | Prefer SIHP15N60E-E3 where 102 mJ EAS and 180 W PD are required for industrial UPS or welder duty cycles |
| IXTH15N60L2 | RDS(on) = 0.29 Ω (max), Qg = 62 nC, EAS = 120 mJ, TO-247AC package (RthJC = 0.45 °C/W) | Superior thermal performance but larger footprint; higher cost and layout complexity than TO-220AB | Choose IXTH15N60L2 only when junction temperature must stay <125 °C under sustained 15 A load without forced air cooling |
Compared with STP15NM60ND and IXTH15N60L2, the SIHP15N60E-E3 offers the best balance of avalanche ruggedness (102 mJ), thermal capability (0.7 °C/W), and TO-220AB form factor for cost-sensitive 1–2 kW industrial and telecom power designs.
Availability
SIHP15N60E-E3 is available at Aetrix Electronics and suitable for server power supplies, photovoltaic inverters, industrial motor drives, and fluorescent ballast lighting requiring stable component supply across multi-year production cycles.
Supply support for SIHP15N60E-E3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-reliability MOSFETs, diodes, and optoelectronics for power, signal, and sensing applications.
The SIHP15N60E-E3 belongs to Vishay's E Series Power MOSFET family, engineered for high-voltage switching in telecom, industrial, and renewable energy systems where ruggedness, low loss, and long-term stability are critical.
FAQ
What is the maximum continuous drain current rating for SIHP15N60E-E3 at 100 °C case temperature?
The SIHP15N60E-E3 has a maximum continuous drain current (ID) of 9.6 A at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limitations of the TO-220AB package; at TC = 25 °C, ID is rated at 15 A. The linear derating factor is 1.4 W/°C, allowing precise thermal margin calculation for heatsink design in the SIHP15N60E-E3 application.
Does SIHP15N60E-E3 have a fully rated avalanche capability, and what is its single-pulse energy limit?
Yes, the SIHP15N60E-E3 is fully rated for unclamped inductive switching (UIS) with a single-pulse avalanche energy (EAS) of 102 mJ, tested per JEDEC JESD24-1. This rating applies under defined conditions: VDD = 50 V, starting TJ = 25 °C, L = 11.6 mH, Rg = 25 Ω, and IAS = 4.2 A. This ruggedness makes SIHP15N60E-E3 suitable for PFC and motor drive circuits where inductive energy must be safely absorbed without external protection.
What is the typical gate charge profile of SIHP15N60E-E3, and how does it affect gate driver selection?
The SIHP15N60E-E3 has Qg = 39–78 nC (typ–max) at VGS = 10 V, with Qgs = 11 nC and Qgd = 17 nC. This profile indicates strong Miller immunity and predictable turn-on timing. For 100 kHz switching, a driver capable of sourcing/sinking ≥1 A peak current is recommended to achieve <50 ns rise/fall times. The low Qgd/Qg ratio (≈22%) minimizes sensitivity to dV/dt-induced false turn-on, enhancing reliability in the SIHP15N60E-E3 application.
How does the body diode performance of SIHP15N60E-E3 compare to standard recovery diodes in PFC applications?
The SIHP15N60E-E3 body diode has trr = 302–604 ns and Qrr = 4.0–8.0 μC at IF = 8 A, dI/dt = 100 A/μs, and TJ = 25 °C. Compared to standard FRDs, this is moderately fast and low-charge, enabling acceptable efficiency in CCM boost PFC. However, for ultra-high-efficiency (>98%) designs, a dedicated SiC Schottky or fast recovery diode remains preferable. The SIHP15N60E-E3 body diode is sufficient for cost-optimized 1–2 kW telecom PSUs where simplicity outweighs marginal loss reduction.
Is SIHP15N60E-E3 compatible with standard TO-220 heatsinks, and what is its thermal resistance from junction to case?
Yes, the SIHP15N60E-E3 uses the industry-standard TO-220AB package with a drain-connected metal tab, making it mechanically and thermally compatible with off-the-shelf TO-220 heatsinks. Its maximum junction-to-case thermal resistance (RthJC) is 0.7 °C/W, meaning a 126 W power dissipation raises the junction temperature by 88.2 °C above case temperature. Proper mounting pressure, thermal interface material, and heatsink surface flatness are essential to achieve this spec in the SIHP15N60E-E3 application.
SIHP15N60E-E3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- -
- Package/Case:
- TO-220-3
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 15A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 280mOhm @ 8A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 78 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1350 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 180W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-220AB
SIHP15N60E-E3 FAQ
1.How can I place an order for SIHP15N60E-E3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIHP15N60E-E3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIHP15N60E-E3 reliable?
The price and inventory of SIHP15N60E-E3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHP15N60E-E3 is usually 5 days.
3.What payment methods are accepted for SIHP15N60E-E3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHP15N60E-E3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIHP15N60E-E3?
SIHP15N60E-E3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIHP15N60E-E3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIHP15N60E-E3?
For technical support, including SIHP15N60E-E3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHP15N60E-E3 requirements.
6.How does Aetrix verify that SIHP15N60E-E3 is sourced from the original manufacturer or authorized distributors?
All SIHP15N60E-E3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHP15N60E-E3 meets industry standards.
7.What is the process for return or replacement of SIHP15N60E-E3?
All SIHP15N60E-E3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHP15N60E-E3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIHP15N60E-E3 part is unused and in its original packaging.
Return procedure for SIHP15N60E-E3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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