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Vishay Siliconix SIHP24N65E-E3

Part No.:
SIHP24N65E-E3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
TO-220-3
Datasheet:
AetrixSIHP24N65E-E3.pdf
Description:
MOSFET N-CH 650V 24A TO220AB
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,707

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Product details

Overview

SIHP24N65E-E3 from Vishay Siliconix is a 650 V, 24 A N-channel enhancement-mode Power MOSFET in TO-220AB package, featuring RDS(on) = 0.145 Ω @ VGS = 10 V, Qg = 122 nC, and avalanche-rated (EAS = 508 mJ). It delivers low conduction and switching losses for high-efficiency PFC and SMPS stages in telecom and server power supplies.

For engineers reviewing the SIHP24N65E-E3 datasheet, SIHP24N65E-E3 pinout, SIHP24N65E-E3 application, or SIHP24N65E-E3 equivalent, key selection criteria include its 650 V VDS, 0.145 Ω RDS(on), 122 nC gate charge, TO-220AB thermal performance (RthJC = 0.5 °C/W), and UIS ruggedness-critical for hard-switched industrial and renewable energy inverters.

Technical Context

This MOSFET employs planar silicon technology optimized for high-voltage, medium-current switching with low Ciss (2740 pF) and ultra-low Qgd/Qg ratio (37/122 nC), enabling fast, low-loss turn-on/turn-off transitions. Its body diode exhibits trr = 433 ns and Qrr = 7.3 μC at 25 °C, supporting moderate-frequency synchronous rectification and flyback operation.

The device operates across -55 to +150 °C junction temperature range and supports dV/dt immunity up to 37 V/ns at 125 °C. Its 0.5 °C/W junction-to-case thermal resistance enables 250 W continuous dissipation at TC = 25 °C, making it suitable for thermally constrained board-level designs without forced airflow.

Key Specifications

ParameterValue and Actual Design Meaning
VDS max650 V - Supports 400 V DC bus designs with ≥30 % safety margin for transient overvoltage in PFC and solar inverters.
RDS(on) max @ 10 V0.145 Ω - Enables <1.7 W conduction loss at 12 A DC, reducing heatsink size in 1–3 kW power stages.
Qg max122 nC - Determines gate driver current requirement (~1.2 A peak for 100 ns rise time), critical for selecting compatible drivers like UCC27531.
EAS508 mJ - Confirmed single-pulse unclamped inductive switching capability, essential for reliability in motor drive snubberless designs.
RthJC0.5 °C/W - Allows direct mounting to heatsink with minimal thermal interface resistance; enables 250 W continuous operation at TC = 25 °C.
trr433 ns - Limits reverse recovery losses in bridge-leg configurations; requires careful gate drive timing to avoid shoot-through in half-bridge topologies.
ID cont @ 100 °C16 A - Defines usable current derating for sealed enclosures or ambient temperatures >70 °C without active cooling.

Pinout & Package

TO-220AB package with isolated tab (drain-connected), standard 3-lead through-hole configuration. Mounting hole accommodates M3 screw; tab must be electrically isolated unless used as heatsink return path.

Pin/TerminalCircuit RoleDesign Meaning
G (Gate)Control electrodeHigh-impedance input requiring ≤122 nC charge; sensitive to ESD; must be driven with low-inductance path to minimize ringing.
D (Drain)Main current output / high-side switch nodeConnected to internal die backside; tab is electrically tied to drain-requires isolation washer if mounted to grounded heatsink.
S (Source)Reference node / current returnCommon return for gate drive and load current; layout must minimize source inductance to preserve switching speed and stability.

Key Features

FeatureDesign Value
Low FOM (RDS(on) × Qg)17.7 Ω·nC - Balances conduction and switching loss trade-off better than legacy 650 V MOSFETs, improving full-load efficiency by ~0.5–1.2 % in 1 kW PFC.
Avalanche energy rating508 mJ - Eliminates need for external clamping circuits in inductive load switching, reducing BOM count in welding and motor control.
Low Ciss (2740 pF)Reduces capacitive loading on gate driver, enabling use of lower-cost drivers and minimizing Miller-induced false turn-on risk.
Body diode Qrr = 7.3 μCEnables predictable commutation in LLC resonant converters and reduces voltage overshoot during freewheeling in buck-derived topologies.
Lead (Pb)-free & Halogen-free optionSiHP24N65E-GE3 variant available - meets RoHS 2011/65/EU and JEDEC J-STD-609A Class 1 requirements for green manufacturing compliance.

Applications

Server Power SupplySolar PV Inverter

Use Scenario: Active clamp forward or two-switch forward PFC stage operating at 100 kHz with 400 V DC bus.

IC Role / Device Role / Timing Role: High-side switching element handling 24 A RMS current, switching at 100–200 kHz with 520 V VDS stress.

Use Value: 0.145 Ω RDS(on) and 122 nC Qg enable >96 % efficiency at full load while maintaining thermal margin under 70 °C ambient.

Use Scenario: DC-link switching in string inverters converting 600–1000 V PV array output to grid-synchronized AC.

IC Role / Device Role / Timing Role: Main switch in three-phase IGBT/MOSFET-based inverter leg, operating in hard-switched mode below 20 kHz.

Use Value: 650 V rating and 508 mJ EAS ensure robustness against DC-link transients and inductive kickback during fault conditions.

Industrial Motor DriveFluorescent Ballast Lighting

Use Scenario: 3 kW induction motor drive using 650 V three-phase inverter with discrete gate drivers.

IC Role / Device Role / Timing Role: Low-side switch in IGBT/MOSFET hybrid inverter leg, conducting 16 A continuous at 100 °C case temperature.

Use Value: RthJC = 0.5 °C/W allows direct heatsink mounting without thermal paste degradation concerns over 10-year field life.

Use Scenario: High-frequency electronic ballast driving 40–60 W fluorescent lamps at 25–60 kHz.

IC Role / Device Role / Timing Role: Resonant half-bridge switch controlling lamp ignition and regulation via variable frequency control.

Use Value: Low Qgd/Qg ratio (37/122 nC) ensures clean zero-voltage switching transition, minimizing EMI and extending lamp life.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STW24N65M5650 V, 24 A, RDS(on) = 0.135 Ω, Qg = 110 nC, TO-247 packageHigher thermal mass and RthJC = 0.45 °C/W; requires larger PCB footprint but offers superior surge current handlingPreferred for >3 kW designs where layout space permits TO-247 and higher peak current (>70 A IDM) is needed
IXFH24N65X2650 V, 24 A, RDS(on) = 0.125 Ω, Qg = 95 nC, TO-247 package, enhanced body diodeLower Qrr (4.2 μC) and faster trr (290 ns); optimized for ZVS/ZCS topologiesBetter suited for resonant LLC and phase-shifted full-bridge where diode recovery performance dominates efficiency

Compared with STW24N65M5 and IXFH24N65X2, SIHP24N65E-E3 provides optimal cost-performance balance in TO-220AB form factor for 1–2 kW PFC and inverter stages, with verified UIS ruggedness and industry-standard pinout compatibility for drop-in replacement in existing layouts.

Availability

SIHP24N65E-E3 is available at Aetrix Electronics and suitable for server power supplies, solar PV inverters, and industrial motor drives requiring stable component supply, long-term lifecycle support, and traceable sourcing from authorized channels.

Supply support for SIHP24N65E-E3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-reliability MOSFETs, diodes, and optoelectronics for demanding industrial, automotive, and computing applications.

The E Series Power MOSFET product line targets high-efficiency, high-voltage switching in power conversion systems-including telecom rectifiers, server PSUs, and renewable energy inverters-where low RDS(on) × Qg and avalanche ruggedness are critical.

FAQ

What is the maximum continuous drain current for SIHP24N65E-E3 at 100 °C case temperature?

The SIHP24N65E-E3 supports 16 A continuous drain current at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limitations of the TO-220AB package and ensures safe operation within the 150 °C maximum junction temperature limit. Designers must verify heatsink performance to maintain TC ≤ 100 °C under full-load conditions.

Does SIHP24N65E-E3 have avalanche capability, and how is it rated?

Yes, SIHP24N65E-E3 is fully rated for unclamped inductive switching (UIS) with EAS = 508 mJ at TJ = 25 °C. This rating is validated per JEDEC standard JESD24-11 and applies to single-pulse events. The device does not require external snubbers in properly designed inductive load circuits, enhancing system reliability in motor drives and welding equipment.

What is the gate threshold voltage range for SIHP24N65E-E3, and how does it affect drive design?

The SIHP24N65E-E3 has a gate threshold voltage VGS(th) of 2–4 V at TJ = 25 °C. This range ensures reliable turn-on with standard 10 V gate drive while preventing accidental conduction from noise. Designers should use gate drivers capable of delivering ≥12 V to guarantee full enhancement and minimize RDS(on) variation across temperature and unit-to-unit spread.

How does the body diode performance of SIHP24N65E-E3 compare to standard MOSFETs in flyback applications?

The SIHP24N65E-E3 body diode features trr = 433 ns and Qrr = 7.3 μC at 25 °C, which is competitive among 650 V MOSFETs. While not optimized for synchronous rectification like dedicated FRDs, its recovery characteristics allow stable operation in discontinuous conduction mode (DCM) flyback converters up to 100 kHz when paired with appropriate gate timing and snubbing.

Is SIHP24N65E-E3 pin-compatible with other TO-220AB MOSFETs, and what mechanical considerations apply?

Yes, SIHP24N65E-E3 uses the industry-standard TO-220AB outline with G-D-S pinout and 2.54 mm lead pitch. The drain-connected tab requires electrical isolation (e.g., mica washer + thermal paste) when mounted to a grounded heatsink. Mounting torque must not exceed 0.5 N·m to avoid package cracking or bond wire damage.

SIHP24N65E-E3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
-
Package/Case:
TO-220-3
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
650 V
Current - Continuous Drain (Id) @ 25°C:
24A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
145mOhm @ 12A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
122 nC @ 10 V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
2740 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
250W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-220AB

SIHP24N65E-E3 FAQ

1.How can I place an order for SIHP24N65E-E3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIHP24N65E-E3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIHP24N65E-E3 reliable?

The price and inventory of SIHP24N65E-E3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHP24N65E-E3 is usually 5 days.

3.What payment methods are accepted for SIHP24N65E-E3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHP24N65E-E3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIHP24N65E-E3?

SIHP24N65E-E3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIHP24N65E-E3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIHP24N65E-E3?

For technical support, including SIHP24N65E-E3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHP24N65E-E3 requirements.

6.How does Aetrix verify that SIHP24N65E-E3 is sourced from the original manufacturer or authorized distributors?

All SIHP24N65E-E3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHP24N65E-E3 meets industry standards.

7.What is the process for return or replacement of SIHP24N65E-E3?

All SIHP24N65E-E3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHP24N65E-E3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIHP24N65E-E3 part is unused and in its original packaging.

Return procedure for SIHP24N65E-E3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SIHP24N65E-E3 Tags

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