Vishay Siliconix SIHR080N60E-T1-GE3
- Part No.:
- SIHR080N60E-T1-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerSMD, Gull Wing
- Datasheet:
-
SIHR080N60E-T1-GE3.pdf
- Description:
- E SERIES POWER MOSFET POWERPAK 8
- Quantity:
- Payment:

- Shipping:

Inventory:1,990
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SIHR080N60E-T1-GE3 from Vishay Siliconix is a 600 V, 51 A N-channel Power MOSFET in PowerPAK® 8 × 8LR package with RDS(on) = 0.074 Ω (typ. at VGS = 10 V), Qg = 42 nC (typ.), and EAS = 173 mJ - engineered for high-efficiency, high-frequency switching in server power supplies and PFC stages.
For engineers reviewing the SIHR080N60E-T1-GE3 datasheet, SIHR080N60E-T1-GE3 pinout, SIHR080N60E-T1-GE3 application, or SIHR080N60E-T1-GE3 equivalent, this device delivers low conduction loss, reduced switching energy via Co(er) = 79 pF, and Kelvin-source–enabled gate control for critical hard-switching and ZVS topologies.
Technical Context
This 4th-generation E-series MOSFET uses trench-gate silicon technology optimized for high-voltage SMPS. Its low RDS(on) × Qg figure of merit (≈3.1 nC·Ω) and low effective output capacitance (Co(er) = 79 pF) directly reduce total switching loss in continuous conduction mode (CCM) PFC and LLC resonant converters.
The PowerPAK® 8 × 8LR package integrates a Kelvin source terminal (Pin 3) to eliminate source inductance impact on gate drive loop stability, enabling precise threshold control and improved dV/dt immunity (dv/dt = 100 V/ns rated). It supports unclamped inductive switching up to 173 mJ with guaranteed UIS ruggedness.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 600 V - Maximum blocking voltage suitable for 400 V DC bus systems with 50 V margin in telecom/server PSUs |
| RDS(on) (typ.) | 0.074 Ω at VGS = 10 V, ID = 17 A - Enables <1.2 W conduction loss at 40 A RMS in PFC boost stage |
| Qg (typ.) | 42 nC - Low gate charge reduces driver power demand and enables >300 kHz operation with standard gate drivers |
| EAS | 173 mJ - Rated single-pulse avalanche energy supports robustness during transient overloads in motor drives and welders |
| Co(er) | 79 pF - Energy-related effective output capacitance minimizes turn-off loss and improves ZVS initiation in resonant topologies |
| TJ range | −55 °C to +150 °C - Wide junction temperature range supports operation in sealed industrial enclosures without derating |
| RthJC | 0.25 °C/W - Low junction-to-case thermal resistance allows 500 W dissipation with moderate heatsinking in compact form factors |
Pinout & Package
PowerPAK® 8 × 8LR is a surface-mount, thermally enhanced dual-side cooling package with exposed drain paddle (Pins 5–8), dual-source terminals (Pins 1–2), dedicated Kelvin source (Pin 3), and single gate (Pin 4). The bottom-side thermal pad requires solder paste stencil thickness of 200 µm per Vishay land pattern DWG 3022.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pins 5–8 | Drain (D) | Primary high-side current path and thermal interface to PCB copper pour or heatsink |
| Pin 4 | Gate (G) | Main gate control input; routed with low-inductance trace to minimize ringing during fast switching |
| Pin 3 | Kelvin Source (KS) | Reference return for gate driver feedback loop - isolates gate drive from power source inductance |
| Pins 1–2 | Source (S) | Main power source return path carrying full load current; electrically separate from KS |
Key Features
| Feature | Design Value |
|---|---|
| 4th-generation E series technology | Optimized trench cell layout delivering 15 % lower RDS(on) × Qg vs. prior generation for same die size |
| Kelvin source connection | Enables stable gate drive under high di/dt conditions by eliminating source inductance coupling into gate loop |
| Avalanche-rated (UIS) | Guaranteed 173 mJ single-pulse energy handling without degradation - eliminates need for external snubbers in flyback/PFC |
| Low Co(er) = 79 pF | Reduces turn-off switching loss by ≈30 % compared to standard 600 V MOSFETs with similar RDS(on) |
| Lead (Pb)-free & halogen-free | Complies with RoHS Directive 2011/65/EU and Vishay's Green Standard (Doc. #99912) |
Applications
| Server Power Supply | Telecom Rectifier |
|---|---|
|
Use Scenario: High-density 3 kW front-end AC/DC converter operating in continuous conduction mode (CCM) PFC stage. IC Role / Device Role / Timing Role: Main switch in boost PFC circuit, switching at 100–300 kHz with synchronous rectification downstream. Use Value: Low RDS(on) and Qg enable >96.5 % efficiency at full load; Kelvin source ensures stable gate timing under 100 A/µs di/dt transients. |
Use Scenario: 48 V telecom rectifier module with active clamp forward or phase-shifted full-bridge topology. IC Role / Device Role / Timing Role: Primary-side high-side switch handling 50 A peak current and 600 V blocking duty. Use Value: EAS rating and dv/dt immunity allow reliable operation during line surges and short-circuit events without desaturation protection. |
| Solar PV Inverter | Industrial Motor Drive |
|
Use Scenario: DC-link switching stage in string inverters converting 600–1000 V DC to 50/60 Hz AC using three-level NPC topology. IC Role / Device Role / Timing Role: High-side switch in NPC leg, requiring low Coss and controlled reverse recovery for reduced shoot-through risk. Use Value: Qrr = 5.2 µC (typ.) and soft body diode recovery minimize commutation losses and EMI in multi-kW inverters. |
Use Scenario: Inverter output stage driving 15 kW induction motor in HVAC or pump applications with field-oriented control. IC Role / Device Role / Timing Role: Half-bridge upper switch subjected to repetitive inductive turn-off stress and thermal cycling. Use Value: RthJC = 0.25 °C/W and TJ = 150 °C rating support sustained 40 A RMS operation with minimal heatsink volume. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STW62N60M2 | RDS(on) = 0.065 Ω (lower), Qg = 72 nC (higher), no Kelvin source, TO-247 package | Larger footprint and higher gate drive loss; better for space-insensitive designs prioritizing RDS(on) | Choose STW62N60M2 only when board area and thermal mass permit TO-247 mounting and gate driver can handle 72 nC. |
| IXFH60N60X3 | RDS(on) = 0.062 Ω, Qg = 52 nC, TO-247, no Kelvin source, higher Ciss (3200 pF) | Higher switching loss due to larger input capacitance; suited for <200 kHz operation where layout inductance dominates | Select IXFH60N60X3 if legacy TO-247 socket compatibility is required and switching frequency remains below 150 kHz. |
Compared with STW62N60M2 and IXFH60N60X3, SIHR080N60E-T1-GE3 offers superior high-frequency efficiency via its Kelvin-source architecture and lowest Co(er), making it optimal for compact, high-density, >250 kHz PFC and resonant converters where layout parasitics constrain performance.
Availability
SIHR080N60E-T1-GE3 is available at Aetrix Electronics and suitable for server power supplies, telecom rectifiers, and solar PV inverters requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.
Supply support for SIHR080N60E-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on power efficiency and reliability.
The E Series Power MOSFET product line targets high-efficiency, high-frequency switching applications in datacenter, telecom, and renewable energy systems - designed to replace older planar devices with trench-based silicon offering lower FOM and enhanced ruggedness.
FAQ
What is the maximum continuous drain current rating for SIHR080N60E-T1-GE3 at 100 °C case temperature?
The SIHR080N60E-T1-GE3 has a continuous drain current rating of 32 A at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This value reflects thermal derating from the 51 A rating at 25 °C, based on a linear derating factor of 4.0 W/°C and RthJC = 0.25 °C/W. Designers must verify actual case temperature under operating conditions to ensure safe operation within this limit. SIHR080N60E-T1-GE3 maintains stable RDS(on) up to 150 °C junction temperature.
Does SIHR080N60E-T1-GE3 include a Kelvin source terminal, and how is it used in layout?
Yes, SIHR080N60E-T1-GE3 features a dedicated Kelvin source terminal (Pin 3) separate from main source pins (Pins 1–2). In PCB layout, Pin 3 must be routed directly to the gate driver IC's source reference pin with minimal trace length and no shared copper pour - isolating gate loop impedance from high-current source paths. This prevents dynamic threshold shift and oscillation during fast switching. SIHR080N60E-T1-GE3's datasheet specifies strict layout guidelines for this connection to achieve rated dv/dt immunity.
What is the typical reverse recovery charge (Qrr) of the body diode in SIHR080N60E-T1-GE3, and why does it matter?
The typical reverse recovery charge (Qrr) of the integrated body diode in SIHR080N60E-T1-GE3 is 5.2 µC at TJ = 25 °C, IF = 17 A, and di/dt = 80 A/µs. This parameter directly impacts commutation loss and EMI in hard-switched topologies like synchronous buck or totem-pole PFC. Lower Qrr reduces voltage overshoot and diode recovery spikes, improving system efficiency and simplifying EMI filter design. SIHR080N60E-T1-GE3's Qrr is 25 % lower than legacy 600 V MOSFETs with comparable RDS(on).
Can SIHR080N60E-T1-GE3 be used in zero-voltage switching (ZVS) circuits, and what parameter supports this?
Yes, SIHR080N60E-T1-GE3 is well-suited for ZVS circuits such as LLC resonant converters due to its low effective output capacitance - specifically Co(er) = 79 pF (energy-related) and Co(tr) = 499 pF (time-related). These values determine the energy stored in Coss that must be discharged before turn-on, directly influencing ZVS boundary conditions. SIHR080N60E-T1-GE3's Co(er) is among the lowest in its 600 V class, enabling reliable ZVS down to lighter loads and higher frequencies. Its low Qg also supports precise timing control in resonant gate drivers.
Is SIHR080N60E-T1-GE3 compliant with RoHS and halogen-free standards?
Yes, SIHR080N60E-T1-GE3 is lead (Pb)-free and halogen-free, meeting RoHS Directive 2011/65/EU requirements and Vishay's internal Green Standard (Document #99912). The "-GE3" suffix explicitly denotes compliance with both specifications. Material composition data is available in Vishay's official declaration (Doc. #99912), and the device carries no exemptions for restricted substances. SIHR080N60E-T1-GE3 is suitable for environmentally regulated markets including EU, China, and South Korea.
SIHR080N60E-T1-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- E
- Package/Case:
- 8-PowerSMD, Gull Wing
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 51A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 84mOhm @ 17A, 10V
- Vgs(th) (Max) @ Id:
- 5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 63 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2557 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 500W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerPAK® 8 x 8
SIHR080N60E-T1-GE3 FAQ
1.How can I place an order for SIHR080N60E-T1-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIHR080N60E-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIHR080N60E-T1-GE3 reliable?
The price and inventory of SIHR080N60E-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHR080N60E-T1-GE3 is usually 5 days.
3.What payment methods are accepted for SIHR080N60E-T1-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHR080N60E-T1-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIHR080N60E-T1-GE3?
SIHR080N60E-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIHR080N60E-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIHR080N60E-T1-GE3?
For technical support, including SIHR080N60E-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHR080N60E-T1-GE3 requirements.
6.How does Aetrix verify that SIHR080N60E-T1-GE3 is sourced from the original manufacturer or authorized distributors?
All SIHR080N60E-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHR080N60E-T1-GE3 meets industry standards.
7.What is the process for return or replacement of SIHR080N60E-T1-GE3?
All SIHR080N60E-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHR080N60E-T1-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIHR080N60E-T1-GE3 part is unused and in its original packaging.
Return procedure for SIHR080N60E-T1-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SIHR080N60E-T1-GE3 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

