Vishay Siliconix SIHU6N62E-GE3
- Part No.:
- SIHU6N62E-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-251-3 Short Leads, IPAK, TO-251AA
- Datasheet:
-
SIHU6N62E-GE3.pdf
- Description:
- MOSFET N-CH 620V 6A IPAK
- Quantity:
- Payment:

- Shipping:

Inventory:8,148
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Product details
Overview
SIHU6N62E-GE3 from Vishay Siliconix is a 620 V, 6 A N-channel power MOSFET in IPAK (TO-251) package, optimized for high-voltage switching in server/telecom SMPS and PFC stages. It delivers RDS(on) = 0.9 Ω @ VGS = 10 V, Qg = 34 nC max, and 88 mJ single-pulse avalanche energy - enabling efficient hard-switched topologies with robust ruggedness.
For engineers reviewing the SIHU6N62E-GE3 datasheet, SIHU6N62E-GE3 pinout, SIHU6N62E-GE3 application, or SIHU6N62E-GE3 equivalent, key selection criteria include its 620 V VDS rating, low gate charge for reduced drive loss, TO-251 thermal performance (RthJC = 1.6 °C/W), and body diode recovery characteristics (trr = 190 ns, Qrr = 1.3 μC) critical for ZVS/ZCS design validation.
Technical Context
This device employs planar high-voltage silicon technology with optimized charge distribution to achieve low figure-of-merit (RDS(on) × Qg). Its gate threshold voltage (VGS(th) = 2–4 V) ensures reliable turn-on with standard 10 V gate drivers while maintaining noise immunity.
The integrated body diode supports continuous 7 A source-drain current and exhibits controlled reverse recovery (dI/dt = 100 A/μs, IRRM = 11 A), making it suitable for freewheeling and synchronous rectification in high-frequency converters where diode stress must be managed.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 620 V - Withstands DC bus voltages up to 496 V in 400 V AC PFC applications with margin for transients. |
| RDS(on) max | 0.9 Ω @ VGS = 10 V - Enables <1.5 W conduction loss at 3 A, supporting thermally constrained IPAK layouts. |
| Qg max | 34 nC - Reduces gate drive power and enables use of lower-current drivers in 100–300 kHz SMPS designs. |
| EAS | 88 mJ - Rated for unclamped inductive switching events without failure, critical for PFC boost choke protection. |
| trr | 190 ns - Limits diode reverse recovery spike amplitude and EMI generation during hard commutation. |
| RthJC | 1.6 °C/W - Supports >70 W power dissipation with moderate heatsinking, typical for mid-power industrial converters. |
| ID cont. | 6 A @ TC = 25 °C - Sustains full-load current in compact TO-251 packages when mounted on ≥2 oz copper with thermal pad. |
Pinout & Package
IPAK (TO-251) package with isolated drain tab (pin 1), gate (pin 2), and source (pin 3) terminals. The drain connects directly to the exposed metal tab for low-inductance, high-current paths and thermal conduction to heatsink.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Tab) | High-voltage power output node | Electrically and thermally connected to PCB heatsink area; requires isolation from other layers unless designated as ground-referenced. |
| Gate (Pin 2) | Control input | Low-impedance capacitive node (Ciss = 578 pF); requires <10 Ω series resistance to damp ringing in fast-switching applications. |
| Source (Pin 3) | Power return / reference node | Serves as local ground reference for gate driver; layout must minimize inductance to avoid false turn-on during dV/dt transitions. |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(on) × Qg FOM | Enables higher efficiency than comparable 600 V MOSFETs in 100–250 kHz PFC and LLC primary switches. |
| Avalanche-rated (UIS) | Guarantees operation under inductive switching stress without derating, eliminating need for external snubbers in many designs. |
| Ultra-low Qgd/Qg ratio | Qgd = 8 nC / Qg = 34 nC → ~24 % - Improves Miller immunity and reduces risk of spurious turn-on in high-dV/dt environments. |
| Controlled body diode trr | 190 ns with soft recovery profile - Lowers EMI and reduces voltage overshoot during commutation vs. standard fast-recovery diodes. |
| Lead (Pb)-free & Halogen-free | Complies with RoHS 2011/65/EU and JEDEC J-STD-020 reflow profiles, supporting lead-free assembly without reliability compromise. |
Applications
| Server Power Supply PFC Stage | Telecom Rectifier Module |
|---|---|
|
Use Scenario: Boost PFC converter operating at 65–100 kHz with 380–400 V DC output from 3-phase 400 V AC input. IC Role / Device Role / Timing Role: Main switching device in continuous conduction mode (CCM) boost stage, handling full line current with minimal conduction and switching loss. Use Value: 0.9 Ω RDS(on) and 34 nC Qg reduce total losses by ~12 % vs. legacy 600 V MOSFETs, improving system efficiency from 95.2 % to 96.1 % at 2 kW load. |
Use Scenario: Isolated forward or half-bridge DC/DC stage in 48 V telecom rectifier delivering up to 2.5 kW. IC Role / Device Role / Timing Role: Primary-side switch managing 380–400 V bus with synchronous rectification on secondary side. Use Value: 88 mJ EAS withstands transformer leakage inductance spikes during overcurrent events, eliminating need for clamping circuits in field-deployed units. |
| Solar PV Inverter DC Link | Industrial Motor Drive Inverter |
|
Use Scenario: DC link switching in string inverters converting 600–1000 V PV array output to 50/60 Hz AC grid. IC Role / Device Role / Timing Role: High-side switch in three-level NPC or T-type inverter topology, operating at 16–20 kHz with SiC gate drivers. Use Value: 620 V VDS rating provides 20 % margin above 1000 V PV open-circuit voltage, ensuring long-term reliability under surge conditions per IEC 61000-4-5. |
Use Scenario: Inverter leg switch in 3–7.5 kW variable frequency drives for HVAC and pump control. IC Role / Device Role / Timing Role: Hard-switched IGBT replacement in 2–8 kHz PWM motor control, leveraging low Qg for reduced gate drive loss. Use Value: 190 ns trr and 1.3 μC Qrr limit diode-induced shoot-through risk during dead-time transitions, improving fault tolerance in 400 V AC systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP6NK60ZFP | 600 V VDS, RDS(on) = 1.2 Ω, Qg = 27 nC, TO-220FP package | Larger footprint, higher RDS(on), but lower Qg; lacks avalanche rating | Prefer when board space allows TO-220FP and avalanche ruggedness is not required. |
| IXTP50N10P | 100 V VDS, RDS(on) = 0.022 Ω, Qg = 75 nC, TO-220 package | Lower voltage rating, much lower RDS(on), significantly higher Qg | Only suitable for low-voltage (<100 V) motor drive or battery systems - not a functional substitute for SIHU6N62E-GE3. |
Compared with STP6NK60ZFP, SIHU6N62E-GE3 offers higher voltage margin and guaranteed avalanche capability at the cost of slightly higher RDS(on); compared with IXTP50N10P, it serves entirely different voltage classes - SIHU6N62E-GE3 is the only viable option for 400–600 V DC bus applications requiring ruggedness and TO-251 form factor.
Availability
SIHU6N62E-GE3 is available at Aetrix Electronics and suitable for server power supplies, telecom rectifiers, and solar PV inverters requiring stable component supply across multi-year production cycles and extended temperature operation.
Supply support for SIHU6N62E-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on power efficiency and ruggedness.
The SIHU6N62E-GE3 belongs to Vishay's E Series high-voltage power MOSFET family, engineered for demanding hard-switched SMPS, PFC, and industrial inverter applications where avalanche capability and low gate charge are essential.
FAQ
What is the maximum continuous drain current rating for SIHU6N62E-GE3 at 100 °C case temperature?
The SIHU6N62E-GE3 supports 4 A continuous drain current at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This reflects thermal derating from its 6 A rating at 25 °C case temperature, based on its 1.6 °C/W junction-to-case thermal resistance and 150 °C maximum junction temperature limit.
Does SIHU6N62E-GE3 have an avalanche energy rating, and what is its value?
Yes, SIHU6N62E-GE3 is fully rated for unclamped inductive switching (UIS) with a single-pulse avalanche energy (EAS) of 88 mJ, tested per JEDEC standard with L = 28.2 mH, IAS = 2.5 A, and Rg = 25 Ω. This rating is confirmed in the Absolute Maximum Ratings section and enables robust operation in PFC and flyback topologies without external snubbers.
What is the gate-source threshold voltage range for SIHU6N62E-GE3, and how does it affect drive requirements?
The gate-source threshold voltage (VGS(th)) for SIHU6N62E-GE3 is specified as 2–4 V at ID = 250 μA. This range ensures reliable turn-on with standard 10 V gate drivers while providing sufficient noise margin against false triggering in noisy industrial environments - consistent with its intended use in high-voltage SMPS where gate drive stability is critical.
Can SIHU6N62E-GE3 be used in place of a logic-level MOSFET in 5 V gate drive applications?
No - SIHU6N62E-GE3 is not a logic-level device. Its RDS(on) is characterized at VGS = 10 V, and its VGS(th) minimum of 2 V does not guarantee full enhancement at 5 V. At VGS = 5 V, RDS(on) increases significantly beyond specification, leading to excessive conduction loss. SIHU6N62E-GE3 requires ≥10 V gate drive for optimal performance.
What is the reverse recovery charge (Qrr) of the body diode in SIHU6N62E-GE3, and why does it matter in PFC designs?
The body diode reverse recovery charge (Qrr) of SIHU6N62E-GE3 is 1.3 μC, measured at TJ = 25 °C, IF = 3 A, dI/dt = 100 A/μs, and VR = 400 V. In boost PFC stages, low Qrr minimizes diode-induced switching loss and voltage overshoot during turn-off, directly improving efficiency and reducing EMI filter complexity - a key advantage over higher-Qrr alternatives.
SIHU6N62E-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- -
- Package/Case:
- TO-251-3 Short Leads, IPAK, TO-251AA
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 620 V
- Current - Continuous Drain (Id) @ 25°C:
- 6A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 900mOhm @ 3A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 34 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 578 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 78W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- IPAK (TO-251)
SIHU6N62E-GE3 FAQ
1.How can I place an order for SIHU6N62E-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIHU6N62E-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIHU6N62E-GE3 reliable?
The price and inventory of SIHU6N62E-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHU6N62E-GE3 is usually 5 days.
3.What payment methods are accepted for SIHU6N62E-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHU6N62E-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIHU6N62E-GE3?
SIHU6N62E-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIHU6N62E-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIHU6N62E-GE3?
For technical support, including SIHU6N62E-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHU6N62E-GE3 requirements.
6.How does Aetrix verify that SIHU6N62E-GE3 is sourced from the original manufacturer or authorized distributors?
All SIHU6N62E-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHU6N62E-GE3 meets industry standards.
7.What is the process for return or replacement of SIHU6N62E-GE3?
All SIHU6N62E-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHU6N62E-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIHU6N62E-GE3 part is unused and in its original packaging.
Return procedure for SIHU6N62E-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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