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Vishay Siliconix SIHU6N62E-GE3

Part No.:
SIHU6N62E-GE3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
TO-251-3 Short Leads, IPAK, TO-251AA
Datasheet:
AetrixSIHU6N62E-GE3.pdf
Description:
MOSFET N-CH 620V 6A IPAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,148

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Product details

Overview

SIHU6N62E-GE3 from Vishay Siliconix is a 620 V, 6 A N-channel power MOSFET in IPAK (TO-251) package, optimized for high-voltage switching in server/telecom SMPS and PFC stages. It delivers RDS(on) = 0.9 Ω @ VGS = 10 V, Qg = 34 nC max, and 88 mJ single-pulse avalanche energy - enabling efficient hard-switched topologies with robust ruggedness.

For engineers reviewing the SIHU6N62E-GE3 datasheet, SIHU6N62E-GE3 pinout, SIHU6N62E-GE3 application, or SIHU6N62E-GE3 equivalent, key selection criteria include its 620 V VDS rating, low gate charge for reduced drive loss, TO-251 thermal performance (RthJC = 1.6 °C/W), and body diode recovery characteristics (trr = 190 ns, Qrr = 1.3 μC) critical for ZVS/ZCS design validation.

Technical Context

This device employs planar high-voltage silicon technology with optimized charge distribution to achieve low figure-of-merit (RDS(on) × Qg). Its gate threshold voltage (VGS(th) = 2–4 V) ensures reliable turn-on with standard 10 V gate drivers while maintaining noise immunity.

The integrated body diode supports continuous 7 A source-drain current and exhibits controlled reverse recovery (dI/dt = 100 A/μs, IRRM = 11 A), making it suitable for freewheeling and synchronous rectification in high-frequency converters where diode stress must be managed.

Key Specifications

Parameter Value and Actual Design Meaning
VDS 620 V - Withstands DC bus voltages up to 496 V in 400 V AC PFC applications with margin for transients.
RDS(on) max 0.9 Ω @ VGS = 10 V - Enables <1.5 W conduction loss at 3 A, supporting thermally constrained IPAK layouts.
Qg max 34 nC - Reduces gate drive power and enables use of lower-current drivers in 100–300 kHz SMPS designs.
EAS 88 mJ - Rated for unclamped inductive switching events without failure, critical for PFC boost choke protection.
trr 190 ns - Limits diode reverse recovery spike amplitude and EMI generation during hard commutation.
RthJC 1.6 °C/W - Supports >70 W power dissipation with moderate heatsinking, typical for mid-power industrial converters.
ID cont. 6 A @ TC = 25 °C - Sustains full-load current in compact TO-251 packages when mounted on ≥2 oz copper with thermal pad.

Pinout & Package

IPAK (TO-251) package with isolated drain tab (pin 1), gate (pin 2), and source (pin 3) terminals. The drain connects directly to the exposed metal tab for low-inductance, high-current paths and thermal conduction to heatsink.

Pin/Terminal Circuit Role Design Meaning
Drain (Tab) High-voltage power output node Electrically and thermally connected to PCB heatsink area; requires isolation from other layers unless designated as ground-referenced.
Gate (Pin 2) Control input Low-impedance capacitive node (Ciss = 578 pF); requires <10 Ω series resistance to damp ringing in fast-switching applications.
Source (Pin 3) Power return / reference node Serves as local ground reference for gate driver; layout must minimize inductance to avoid false turn-on during dV/dt transitions.

Key Features

Feature Design Value
Low RDS(on) × Qg FOM Enables higher efficiency than comparable 600 V MOSFETs in 100–250 kHz PFC and LLC primary switches.
Avalanche-rated (UIS) Guarantees operation under inductive switching stress without derating, eliminating need for external snubbers in many designs.
Ultra-low Qgd/Qg ratio Qgd = 8 nC / Qg = 34 nC → ~24 % - Improves Miller immunity and reduces risk of spurious turn-on in high-dV/dt environments.
Controlled body diode trr 190 ns with soft recovery profile - Lowers EMI and reduces voltage overshoot during commutation vs. standard fast-recovery diodes.
Lead (Pb)-free & Halogen-free Complies with RoHS 2011/65/EU and JEDEC J-STD-020 reflow profiles, supporting lead-free assembly without reliability compromise.

Applications

Server Power Supply PFC Stage Telecom Rectifier Module

Use Scenario: Boost PFC converter operating at 65–100 kHz with 380–400 V DC output from 3-phase 400 V AC input.

IC Role / Device Role / Timing Role: Main switching device in continuous conduction mode (CCM) boost stage, handling full line current with minimal conduction and switching loss.

Use Value: 0.9 Ω RDS(on) and 34 nC Qg reduce total losses by ~12 % vs. legacy 600 V MOSFETs, improving system efficiency from 95.2 % to 96.1 % at 2 kW load.

Use Scenario: Isolated forward or half-bridge DC/DC stage in 48 V telecom rectifier delivering up to 2.5 kW.

IC Role / Device Role / Timing Role: Primary-side switch managing 380–400 V bus with synchronous rectification on secondary side.

Use Value: 88 mJ EAS withstands transformer leakage inductance spikes during overcurrent events, eliminating need for clamping circuits in field-deployed units.

Solar PV Inverter DC Link Industrial Motor Drive Inverter

Use Scenario: DC link switching in string inverters converting 600–1000 V PV array output to 50/60 Hz AC grid.

IC Role / Device Role / Timing Role: High-side switch in three-level NPC or T-type inverter topology, operating at 16–20 kHz with SiC gate drivers.

Use Value: 620 V VDS rating provides 20 % margin above 1000 V PV open-circuit voltage, ensuring long-term reliability under surge conditions per IEC 61000-4-5.

Use Scenario: Inverter leg switch in 3–7.5 kW variable frequency drives for HVAC and pump control.

IC Role / Device Role / Timing Role: Hard-switched IGBT replacement in 2–8 kHz PWM motor control, leveraging low Qg for reduced gate drive loss.

Use Value: 190 ns trr and 1.3 μC Qrr limit diode-induced shoot-through risk during dead-time transitions, improving fault tolerance in 400 V AC systems.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power switching applications.

Alternative Part Technical Difference Application Difference Selection Advice
STP6NK60ZFP 600 V VDS, RDS(on) = 1.2 Ω, Qg = 27 nC, TO-220FP package Larger footprint, higher RDS(on), but lower Qg; lacks avalanche rating Prefer when board space allows TO-220FP and avalanche ruggedness is not required.
IXTP50N10P 100 V VDS, RDS(on) = 0.022 Ω, Qg = 75 nC, TO-220 package Lower voltage rating, much lower RDS(on), significantly higher Qg Only suitable for low-voltage (<100 V) motor drive or battery systems - not a functional substitute for SIHU6N62E-GE3.

Compared with STP6NK60ZFP, SIHU6N62E-GE3 offers higher voltage margin and guaranteed avalanche capability at the cost of slightly higher RDS(on); compared with IXTP50N10P, it serves entirely different voltage classes - SIHU6N62E-GE3 is the only viable option for 400–600 V DC bus applications requiring ruggedness and TO-251 form factor.

Availability

SIHU6N62E-GE3 is available at Aetrix Electronics and suitable for server power supplies, telecom rectifiers, and solar PV inverters requiring stable component supply across multi-year production cycles and extended temperature operation.

Supply support for SIHU6N62E-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on power efficiency and ruggedness.

The SIHU6N62E-GE3 belongs to Vishay's E Series high-voltage power MOSFET family, engineered for demanding hard-switched SMPS, PFC, and industrial inverter applications where avalanche capability and low gate charge are essential.

FAQ

What is the maximum continuous drain current rating for SIHU6N62E-GE3 at 100 °C case temperature?

The SIHU6N62E-GE3 supports 4 A continuous drain current at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This reflects thermal derating from its 6 A rating at 25 °C case temperature, based on its 1.6 °C/W junction-to-case thermal resistance and 150 °C maximum junction temperature limit.

Does SIHU6N62E-GE3 have an avalanche energy rating, and what is its value?

Yes, SIHU6N62E-GE3 is fully rated for unclamped inductive switching (UIS) with a single-pulse avalanche energy (EAS) of 88 mJ, tested per JEDEC standard with L = 28.2 mH, IAS = 2.5 A, and Rg = 25 Ω. This rating is confirmed in the Absolute Maximum Ratings section and enables robust operation in PFC and flyback topologies without external snubbers.

What is the gate-source threshold voltage range for SIHU6N62E-GE3, and how does it affect drive requirements?

The gate-source threshold voltage (VGS(th)) for SIHU6N62E-GE3 is specified as 2–4 V at ID = 250 μA. This range ensures reliable turn-on with standard 10 V gate drivers while providing sufficient noise margin against false triggering in noisy industrial environments - consistent with its intended use in high-voltage SMPS where gate drive stability is critical.

Can SIHU6N62E-GE3 be used in place of a logic-level MOSFET in 5 V gate drive applications?

No - SIHU6N62E-GE3 is not a logic-level device. Its RDS(on) is characterized at VGS = 10 V, and its VGS(th) minimum of 2 V does not guarantee full enhancement at 5 V. At VGS = 5 V, RDS(on) increases significantly beyond specification, leading to excessive conduction loss. SIHU6N62E-GE3 requires ≥10 V gate drive for optimal performance.

What is the reverse recovery charge (Qrr) of the body diode in SIHU6N62E-GE3, and why does it matter in PFC designs?

The body diode reverse recovery charge (Qrr) of SIHU6N62E-GE3 is 1.3 μC, measured at TJ = 25 °C, IF = 3 A, dI/dt = 100 A/μs, and VR = 400 V. In boost PFC stages, low Qrr minimizes diode-induced switching loss and voltage overshoot during turn-off, directly improving efficiency and reducing EMI filter complexity - a key advantage over higher-Qrr alternatives.

SIHU6N62E-GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
-
Package/Case:
TO-251-3 Short Leads, IPAK, TO-251AA
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
620 V
Current - Continuous Drain (Id) @ 25°C:
6A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
900mOhm @ 3A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
34 nC @ 10 V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
578 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
78W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
IPAK (TO-251)

SIHU6N62E-GE3 FAQ

1.How can I place an order for SIHU6N62E-GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIHU6N62E-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIHU6N62E-GE3 reliable?

The price and inventory of SIHU6N62E-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHU6N62E-GE3 is usually 5 days.

3.What payment methods are accepted for SIHU6N62E-GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHU6N62E-GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIHU6N62E-GE3?

SIHU6N62E-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIHU6N62E-GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIHU6N62E-GE3?

For technical support, including SIHU6N62E-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHU6N62E-GE3 requirements.

6.How does Aetrix verify that SIHU6N62E-GE3 is sourced from the original manufacturer or authorized distributors?

All SIHU6N62E-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHU6N62E-GE3 meets industry standards.

7.What is the process for return or replacement of SIHU6N62E-GE3?

All SIHU6N62E-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHU6N62E-GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIHU6N62E-GE3 part is unused and in its original packaging.

Return procedure for SIHU6N62E-GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SIHU6N62E-GE3 Tags

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