Vishay Siliconix SIJ4409DP-T1-GE3
- Part No.:
- SIJ4409DP-T1-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- PowerPAK® SO-8
- Datasheet:
-
SIJ4409DP-T1-GE3.pdf
- Description:
- P-CHANNEL 40 V (D-S) MOSFET 150C
- Quantity:
- Payment:

- Shipping:

Inventory:8,755
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Product details
Overview
SIJ4409DP-T1-GE3 from Vishay Siliconix is a P-channel enhancement-mode MOSFET designed for high-efficiency load switching and battery protection circuits, featuring -40 V VDS, 0.0096 Ω RDS(on) at -10 V VGS, 38.1 nC Qg, -43.6 A continuous drain current (TC = 25 °C), and PowerPAK® SO-8L package. It operates in motor drive control and reverse-polarity protection applications where low conduction loss and fast switching are critical.
For engineers reviewing the SIJ4409DP-T1-GE3 datasheet, SIJ4409DP-T1-GE3 pinout, SIJ4409DP-T1-GE3 application, or SIJ4409DP-T1-GE3 equivalent, this page delivers verified electrical parameters, thermal resistance values (RthJC = 3.0 °C/W), body diode characteristics (VSD = -0.75 V at -5 A), avalanche energy rating (EAS = 45 mJ), and package mechanical dimensions to support layout, thermal design, and reliability validation.
Technical Context
This device uses a trench-gate silicon process optimized for ultra-low RDS(on) × Qg figure-of-merit (FOM), enabling high-efficiency operation in 12 V and 24 V DC systems. Its gate threshold voltage range (-1.0 V to -2.3 V) ensures robust turn-on with standard logic-level drivers while maintaining low leakage (IDSS ≤ -1 μA at -40 V).
The integrated source-drain body diode supports synchronous rectification and freewheeling in H-bridge motor drives, with trr = 19 ns and Qrr = 12 nC at 25 °C. Thermal performance is defined by RthJC = 3.0 °C/W (max 3.8 °C/W) and RthJA = 24 °C/W (t ≤ 10 s), validated on 1" × 1" FR4 board per JEDEC standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | -40 V - Maximum blocking voltage for 12 V/24 V automotive and industrial bus protection |
| RDS(on) @ -10 V | 0.0096 Ω - Enables <1 W conduction loss at 32 A, supporting compact thermal design |
| Qg @ -4.5 V | 38.1 nC - Low gate charge reduces driver power demand and switching losses in PWM control |
| ID (continuous) | -43.6 A @ TC = 25 °C - Supports high-current load switching without external heatsink under case-cooled conditions |
| EAS | 45 mJ - Rated single-pulse avalanche energy ensures robustness during inductive load turn-off transients |
| RthJC | 3.0 °C/W - Confirmed junction-to-case thermal resistance enables accurate heatsink sizing |
| VGS(th) | -1.0 to -2.3 V - Logic-compatible gate threshold allows direct interface with 3.3 V/5 V microcontrollers |
Pinout & Package
SIJ4409DP-T1-GE3 is housed in a leadless PowerPAK® SO-8L package (5.13 mm × 6.15 mm × 1.07 mm), with exposed copper drain paddle on bottom side for enhanced thermal conduction. The package is RoHS-compliant, halogen-free, and qualified per JEDEC J-STD-020 moisture sensitivity level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 7, 8 | Source (S) | Common source connection; pins 1–4 and 7–8 are internally bonded to reduce source inductance |
| 5 | Gate (G) | Control terminal; requires ≤ ±20 V gate drive; Rg = 1.0–4.0 Ω typical for optimal switching |
| 6 | Drain (D) | Main power output; connected to exposed copper paddle for low thermal resistance path to PCB |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) × Qg FOM | Enables >95 % efficiency in 12 V load switches operating at 100 kHz–1 MHz |
| 100 % Rg and UIS tested | Guarantees gate resistance consistency and unclamped inductive switching ruggedness across production lots |
| Body diode trr = 19 ns | Reduces reverse recovery losses in half-bridge configurations, minimizing shoot-through risk |
| VSD = -0.75 V @ -5 A | Low forward voltage drop improves efficiency in freewheeling paths without external Schottky diodes |
| PowerPAK® SO-8L footprint | Drop-in replacement for SO-8 packages with 3× higher current density and 50 % lower RthJA |
Applications
| Battery Protection Circuit | Motor Drive Half-Bridge |
|---|---|
Use Scenario: Reverse-polarity and overcurrent protection in 12 V Li-ion battery packs for portable tools and medical devices. IC Role / Device Role / Timing Role: High-side P-channel switch controlling main power path; activated/deactivated by system controller GPIO. Use Value: 0.0096 Ω RDS(on) limits voltage drop to <0.3 V at 30 A, preserving battery runtime and reducing thermal stress on PCB traces. | Use Scenario: Low-side switching in brushed DC motor H-bridge for automotive HVAC actuators and industrial valves. IC Role / Device Role / Timing Role: Synchronous rectifier in freewheeling phase; body diode conducts return current during PWM off-time. Use Value: 19 ns trr and 12 nC Qrr minimize switching losses and EMI generation compared to discrete Schottky solutions. |
| Load Switch for Industrial PLC I/O | Hot-Swap Controller Backplane |
Use Scenario: Controlled power-up of field modules in programmable logic controllers with surge current limiting. IC Role / Device Role / Timing Role: Main pass element in soft-start load switch; gate driven via RC network for controlled dV/dt. Use Value: -43.6 A ID rating and 45 mJ EAS withstand capacitor inrush and cable fault transients without failure. | Use Scenario: Redundant power rail isolation in telecom backplanes during live insertion/removal of line cards. IC Role / Device Role / Timing Role: OR-ing FET in hot-swap circuit; blocks reverse current flow when primary supply fails. Use Value: -40 V VDS and -1.0 V VGS(th) ensure reliable turn-on with minimal gate drive overhead in dual-supply architectures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF7425PbF | RDS(on) = 0.012 Ω @ -10 V; Qg = 42 nC; TO-252 package | Higher RthJA (62 °C/W) requires larger PCB copper area; no exposed drain pad | Choose for legacy TO-252 layouts where footprint compatibility outweighs thermal performance |
| DMG2307L-7 | RDS(on) = 0.022 Ω @ -4.5 V; Qg = 12 nC; SOT-23-6 package | Lower current rating (-2.8 A); suited for signal-level switching, not power loads | Choose only for space-constrained low-power bias rails where <5 A load current suffices |
Compared with IRF7425PbF and DMG2307L-7, SIJ4409DP-T1-GE3 delivers superior power density (32.8 W PD), lowest RDS(on) × Qg FOM, and best thermal coupling via PowerPAK® SO-8L's exposed drain, making it optimal for high-current, thermally constrained industrial and automotive load switching.
Availability
SIJ4409DP-T1-GE3 is available at Aetrix Electronics and suitable for battery protection, motor drive control, and industrial load switching applications requiring stable component supply, long-term lifecycle support, and traceable sourcing from authorized channels.
Supply support for SIJ4409DP-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in MOSFETs, diodes, and optoelectronics with emphasis on power efficiency, reliability, and miniaturization.
The SIJ4409DP-T1-GE3 belongs to Vishay's PowerPAK® SO-8L P-channel MOSFET family, engineered specifically for high-current, low-voltage DC power management in automotive, industrial, and computing systems where thermal performance and gate drive simplicity are critical.
FAQ
What is the maximum continuous drain current rating for SIJ4409DP-T1-GE3 at 70 °C case temperature?
The SIJ4409DP-T1-GE3 supports -34.9 A continuous drain current at TC = 70 °C, as specified in the Absolute Maximum Ratings table. This value reflects derating due to thermal constraints and must be used with appropriate heatsinking or airflow to maintain junction temperature below 150 °C. Designers should verify actual power dissipation using RDS(on) = 0.0096 Ω and ambient conditions before finalizing thermal solution.
Does SIJ4409DP-T1-GE3 require a gate resistor for safe operation?
Yes, SIJ4409DP-T1-GE3 benefits from an external gate resistor (Rg) to control switching speed and suppress ringing. The datasheet specifies Rg = 1.0–4.0 Ω typical, and using Rg ≈ 2.2 Ω balances turn-on/turn-off times (td(on) = 31 ns, td(off) = 41 ns at -4.5 V drive) while minimizing EMI and voltage overshoot. Omitting Rg may cause oscillation or excessive dv/dt stress on the gate oxide.
Can SIJ4409DP-T1-GE3 be used in avalanche mode repeatedly?
No, SIJ4409DP-T1-GE3 is rated for single-pulse avalanche only (EAS = 45 mJ). While 100 % UIS testing ensures robustness against one-time inductive energy dump, repeated avalanche operation degrades the device and is not guaranteed by specification. For circuits with frequent inductive switching, use snubbers or clamp circuits to limit VDS spikes below -40 V, ensuring SIJ4409DP-T1-GE3 remains within its safe operating area.
What is the recommended PCB pad layout for SIJ4409DP-T1-GE3's PowerPAK® SO-8L package?
The recommended minimum pad layout for SIJ4409DP-T1-GE3 is defined in Vishay document 63818: a 4.061 mm × 2.715 mm thermal pad for the exposed drain (Pin 6), with 0.510 mm wide source/gate traces and 0.710 mm solder mask openings. Use at least 2 oz copper and multiple thermal vias (≥8 × 0.3 mm) under the drain pad to achieve RthJA ≤ 30 °C/W. Avoid solder fillet requirements at the exposed copper tip-bottom-side interconnection is ensured by solder volume, not fillet formation.
Is SIJ4409DP-T1-GE3 suitable for 3.3 V microcontroller gate drive?
Yes, SIJ4409DP-T1-GE3 is fully compatible with 3.3 V logic-level gate drive. Its VGS(th) range (-1.0 V to -2.3 V) ensures strong enhancement at -3.3 V, delivering RDS(on) = 0.0122 Ω (max) at -4.5 V and -15 A. At -3.3 V, RDS(on) increases moderately but remains usable for moderate-current applications (<10 A); for full -43.6 A capability, -10 V drive is required. Always verify gate drive strength and rise/fall time in the target MCU's GPIO spec.
SIJ4409DP-T1-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- -
- Package/Case:
- PowerPAK® SO-8
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 40 V
- Current - Continuous Drain (Id) @ 25°C:
- 15.5A (Ta), 43.6A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 9.6mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 2.3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 126 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 5670 pF @ 20 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.6W (Ta), 32.8W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerPAK® SO-8
SIJ4409DP-T1-GE3 FAQ
1.How can I place an order for SIJ4409DP-T1-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIJ4409DP-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIJ4409DP-T1-GE3 reliable?
The price and inventory of SIJ4409DP-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIJ4409DP-T1-GE3 is usually 5 days.
3.What payment methods are accepted for SIJ4409DP-T1-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIJ4409DP-T1-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIJ4409DP-T1-GE3?
SIJ4409DP-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIJ4409DP-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIJ4409DP-T1-GE3?
For technical support, including SIJ4409DP-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIJ4409DP-T1-GE3 requirements.
6.How does Aetrix verify that SIJ4409DP-T1-GE3 is sourced from the original manufacturer or authorized distributors?
All SIJ4409DP-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIJ4409DP-T1-GE3 meets industry standards.
7.What is the process for return or replacement of SIJ4409DP-T1-GE3?
All SIJ4409DP-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIJ4409DP-T1-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIJ4409DP-T1-GE3 part is unused and in its original packaging.
Return procedure for SIJ4409DP-T1-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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