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Vishay Siliconix SIJ484DP-T1-GE3

Part No.:
SIJ484DP-T1-GE3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
PowerPAK® SO-8
Datasheet:
AetrixSIJ484DP-T1-GE3.pdf
Description:
MOSFET N-CH 30V 35A PPAK SO-8
Quantity:
Payment:
Payment
Shipping:
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Inventory:9,265

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Product details

Overview

SIJ484DP-T1-GE3 from Vishay Siliconix is a N-channel 30-V TrenchFET® Power MOSFET in PowerPAK® SO-8L Single package, with RDS(on) = 0.0063 Ω at VGS = 10 V, 35 A continuous drain current (package-limited), and 13.7 nC total gate charge. It serves as a high-side switch in DC/DC converters requiring low conduction loss and fast switching.

For engineers reviewing the SIJ484DP-T1-GE3 datasheet, SIJ484DP-T1-GE3 pinout, SIJ484DP-T1-GE3 application, or SIJ484DP-T1-GE3 equivalent, key selection criteria include its 30-V VDS, 0.0063 Ω on-resistance at 10 V drive, 3.4 °C/W junction-to-case thermal resistance, and halogen-free RoHS-compliant construction.

Technical Context

This MOSFET uses trench-gate silicon technology to achieve low RDS(on) and optimized gate charge for high-efficiency synchronous rectification and high-side switching. Its 100 % Rg and UIS testing ensures robustness in power conversion circuits under transient stress.

The device operates with VGS(th) between 1.2 V and 2.5 V and supports gate drive down to 4.5 V (RDS(on) = 0.0082 Ω), enabling compatibility with 5-V and 3.3-V controller outputs. Thermal performance is characterized by RthJC = 3.4 °C/W (typ.) and RthJA = 20 °C/W (t ≤ 10 s).

Key Specifications

ParameterValue and Actual Design Meaning
VDS30 V - Maximum drain-source blocking voltage for 12-V and 24-V input DC/DC stages
RDS(on) @ VGS = 10 V0.0063 Ω - Enables <19 mW conduction loss at 35 A, critical for high-current POL converters
ID (continuous)35 A - Package-limited rating; defines maximum steady-state current without heatsink
Qg (total)13.7 nC - Low gate charge reduces driver power and switching transition time in high-frequency operation
RthJC3.4 °C/W - Enables direct thermal coupling to PCB copper or heatsink for >20 W power dissipation
VGS(th)1.2–2.5 V - Ensures reliable turn-on with standard logic-level gate drivers
Ciss1600 pF - Input capacitance impacts gate drive loop stability and Miller effect in hard-switched topologies

Pinout & Package

PowerPAK® SO-8L Single is a leadless surface-mount package measuring 6.15 mm × 5.13 mm × 1.0 mm, with exposed drain paddle on bottom for enhanced thermal performance. The package has 8 terminals, all on perimeter, with no leads.

Pin/TerminalCircuit RoleDesign Meaning
1 (G)GateControl terminal; accepts 0–20 V gate drive; requires low-impedance path to minimize switching losses
2 (S)SourceReference node for gate drive and current sensing; connects to power ground or low-side return path
3 (S)SourceSecond source connection; paralleled internally to reduce source inductance and improve current sharing
4 (S)SourceThird source connection; provides additional low-inductance return path for high di/dt applications
5 (D)DrainMain power output node; electrically connected to exposed copper paddle for thermal and current conduction
6 (D)DrainSecond drain connection; tied to same internal drain node and paddle for lower parasitic inductance
7 (D)DrainThird drain connection; enhances current spreading and thermal transfer from die to PCB
8 (G)GateSecondary gate terminal; used for Kelvin gate sensing or dual-drive configurations to suppress Miller ringing

Key Features

FeatureDesign Value
TrenchFET® architectureDelivers industry-leading RDS(on) × Qg figure-of-merit for high-frequency DC/DC efficiency
100 % Rg testedEnsures consistent gate resistance across production lots, critical for predictable switching timing
100 % UIS testedValidates ruggedness against unclamped inductive switching events common in buck converter freewheeling
Halogen-free & RoHS-compliantMeets IEC 61249-2-21 and Directive 2002/95/EC for environmentally regulated industrial and automotive end equipment
Exposed drain paddleReduces RthJC to 3.4 °C/W, enabling >27 W power dissipation with minimal external heatsinking

Applications

High-Efficiency Synchronous Buck Converter12-V Automotive DC/DC Module

Use Scenario: Primary high-side switch in a 400-kHz, 12-V input to 1.2-V/30-A output VRM for FPGA or ASIC core supply.

IC Role / Device Role / Timing Role: High-side power switch controlling energy transfer into output inductor; duty cycle modulated by PWM controller.

Use Value: 0.0063 Ω RDS(on) limits conduction loss to <6.6 W at full load, while 13.7 nC Qg enables clean 20-ns rise/fall times with 1-Ω gate resistor.

Use Scenario: High-side switch in a 12-V to 5-V/15-A automotive body control module power rail.

IC Role / Device Role / Timing Role: Main switching element in a compact, thermally constrained buck regulator operating in ambient up to 85 °C.

Use Value: 3.4 °C/W RthJC allows direct mounting to 2-oz copper thermal pad, maintaining TJ < 125 °C at full load without forced air.

Industrial PLC I/O Power DistributionServer Point-of-Load Regulator

Use Scenario: Hot-swap and overcurrent protection switch for 24-V fieldbus I/O channel in programmable logic controller.

IC Role / Device Role / Timing Role: Load switch enabling controlled inrush limiting and fault isolation via gate-controlled turn-on/turn-off.

Use Value: 30-V VDS headroom accommodates 24-V nominal + transients; 100 % UIS rating ensures survival during cable-disconnect events.

Use Scenario: High-current phase in a multiphase 48-V to 0.8-V server CPU VR with >100-A total output.

IC Role / Device Role / Timing Role: One of multiple paralleled high-side switches per phase, driven synchronously for interleaved operation.

Use Value: Multiple source/drain terminals reduce package parasitics, improving current sharing accuracy and reducing EMI in multi-phase layouts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRF7470PBFRDS(on) = 0.0055 Ω @ 10 V, but larger SO-8 package (RthJA = 62 °C/W); no Kelvin gate terminalsHigher thermal resistance limits usable current in space-constrained PCBs; less suitable for >200 kHz switchingChoose IRF7470PBF only if board layout allows larger thermal pad area and lower switching frequency suffices.
DMN3025LSD-13Same PowerPAK SO-8L footprint; RDS(on) = 0.0025 Ω @ 10 V but rated only for 25 A continuous (package-limited)Lower on-resistance improves efficiency at light loads, but 25-A limit restricts peak current capability vs. SIJ484DP-T1-GE3's 35-A ratingPrefer DMN3025LSD-13 when ultra-low RDS(on) dominates over current capacity; verify thermal margin at full load.

Compared with IRF7470PBF and DMN3025LSD-13, SIJ484DP-T1-GE3 uniquely balances 35-A current capability, 0.0063 Ω on-resistance, and Kelvin-source/gate terminals in a thermally optimized 6.15 mm × 5.13 mm footprint-making it optimal for high-density, high-current DC/DC phases where layout area and thermal management are co-constrained.

Availability

SIJ484DP-T1-GE3 is available at Aetrix Electronics and suitable for high-efficiency DC/DC converters, automotive body electronics, and industrial PLC power distribution requiring stable component supply and long-term manufacturability.

Supply support for SIJ484DP-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in MOSFETs, diodes, and optoelectronics with emphasis on power efficiency and reliability.

The SiJ484DP product line delivers high-current, low-RDS(on) TrenchFET® MOSFETs optimized for high-frequency, high-density DC/DC conversion in computing, automotive, and industrial systems.

FAQ

What is the maximum continuous drain current rating for SIJ484DP-T1-GE3?

The SIJ484DP-T1-GE3 has a continuous drain current rating of 35 A at TC = 25 °C, limited by package thermal capacity-not silicon die capability. At TC = 70 °C, the rating remains 35 A, but at TA = 25 °C it drops to 21.5 A due to higher junction-to-ambient thermal resistance. This package-limited rating is confirmed in the Absolute Maximum Ratings table of Vishay document 64812.

Does SIJ484DP-T1-GE3 support 4.5-V gate drive?

Yes, SIJ484DP-T1-GE3 is fully specified for 4.5-V gate drive: RDS(on) = 0.0082 Ω (max) at VGS = 4.5 V and ID = 7 A, and VGS(th) ranges from 1.2 V to 2.5 V. Its trench-gate design ensures strong enhancement-mode behavior and low threshold variation across temperature, making it compatible with 5-V and 3.3-V controller outputs without level-shifting.

What is the thermal resistance from junction to case for SIJ484DP-T1-GE3?

The SIJ484DP-T1-GE3 has a typical junction-to-case (drain) thermal resistance RthJC of 3.4 °C/W, with a maximum of 4.5 °C/W under steady-state conditions. This value is measured from the silicon junction to the exposed drain paddle and is critical for calculating maximum power dissipation when mounted to a heatsink or thermal pad-enabling >27 W dissipation with proper PCB copper area.

Is SIJ484DP-T1-GE3 suitable for synchronous rectification?

Yes, SIJ484DP-T1-GE3 is well-suited for synchronous rectification due to its low RDS(on) (0.0063 Ω @ 10 V), fast switching parameters (tr = 9 ns, tf = 8 ns), and integrated body diode with VSD = 0.75–1.1 V at IS = 3 A. Its 100 % UIS testing further validates robustness during reverse recovery transitions in buck and LLC topologies.

What does the "-GE3" suffix indicate in SIJ484DP-T1-GE3?

Per Vishay's ordering nomenclature, the "-GE3" suffix in SIJ484DP-T1-GE3 denotes lead (Pb)-free and halogen-free construction compliant with RoHS Directive 2002/95/EC and IEC 61249-2-21. It also specifies tape-and-reel packaging (T1) and confirms the part meets Vishay's green material standards without compromising electrical or thermal performance.

SIJ484DP-T1-GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
TrenchFET®
Package/Case:
PowerPAK® SO-8
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
35A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
6.3mOhm @ 10A, 10V
Vgs(th) (Max) @ Id:
2.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
45 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1600 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
5W (Ta), 27.7W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PowerPAK® SO-8

SIJ484DP-T1-GE3 FAQ

1.How can I place an order for SIJ484DP-T1-GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIJ484DP-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIJ484DP-T1-GE3 reliable?

The price and inventory of SIJ484DP-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIJ484DP-T1-GE3 is usually 5 days.

3.What payment methods are accepted for SIJ484DP-T1-GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIJ484DP-T1-GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIJ484DP-T1-GE3?

SIJ484DP-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIJ484DP-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIJ484DP-T1-GE3?

For technical support, including SIJ484DP-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIJ484DP-T1-GE3 requirements.

6.How does Aetrix verify that SIJ484DP-T1-GE3 is sourced from the original manufacturer or authorized distributors?

All SIJ484DP-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIJ484DP-T1-GE3 meets industry standards.

7.What is the process for return or replacement of SIJ484DP-T1-GE3?

All SIJ484DP-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIJ484DP-T1-GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIJ484DP-T1-GE3 part is unused and in its original packaging.

Return procedure for SIJ484DP-T1-GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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