Vishay Siliconix SIR500DP-T1-UE3
- Part No.:
- SIR500DP-T1-UE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- PowerPAK® SO-8
- Datasheet:
-
SIR500DP-T1-UE3.pdf
- Description:
- N-CHANNEL 30 V (D-S) MOSFET 150
- Quantity:
- Payment:

- Shipping:

Inventory:6,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SIR500DP-T1-UE3 from Vishay Siliconix is an N-channel 30 V TrenchFET® Gen V power MOSFET in PowerPAK® SO-8 package, delivering RDS(on) = 0.47 mΩ at VGS = 10 V and 0.68 mΩ at VGS = 4.5 V, with 54.3 nC total gate charge and 350.8 A continuous drain current (TC = 25 °C), optimized for high-efficiency DC/DC converters and synchronous rectification.
For engineers reviewing the SIR500DP-T1-UE3 datasheet, SIR500DP-T1-UE3 pinout, SIR500DP-T1-UE3 application, or SIR500DP-T1-UE3 equivalent, this page provides verified electrical parameters, thermal resistance values, body diode characteristics, gate drive timing data, and validated alternative parts for high-current, low-voltage switching designs.
Technical Context
This MOSFET employs TrenchFET® Gen V silicon technology to achieve ultra-low RDS(on) × Qg figure-of-merit, enabling high power density in compact layouts. Its 30 V VDS rating and 150 °C maximum junction temperature support robust operation in demanding POL and battery management systems.
The device features 100 % Rg and UIS tested units, integrated source-drain body diode with 65 ns reverse recovery time (trr) and 86 nC Qrr, and a thermally enhanced leadless PowerPAK SO-8 package with exposed copper drain pads for low RthJC = 0.9 °C/W (typical).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum drain-source blocking voltage for 12 V and 24 V input rail applications. |
| RDS(on) @ VGS = 10 V | 0.47 mΩ max - Enables <1 W conduction loss at 300 A, critical for high-current server VRMs. |
| RDS(on) @ VGS = 4.5 V | 0.68 mΩ max - Ensures low on-resistance under logic-level gate drive, supporting 3.3 V/5 V controller compatibility. |
| Qg typ. | 54.3 nC - Low gate charge reduces driver power loss and enables fast switching with minimal EMI. |
| ID continuous (TC = 25 °C) | 350.8 A - Supports single-device implementation in high-power POL modules without paralleling. |
| RthJC max. | 1.2 °C/W - Enables efficient heat transfer to heatsink or PCB copper, essential for >200 W/in² power density. |
| VSD @ IS = 5 A | 0.69–1.1 V - Low forward voltage of integrated body diode minimizes reverse conduction loss in synchronous rectifier mode. |
Pinout & Package
Package: PowerPAK® SO-8 (leadless, thermally enhanced), dimensions 6.15 mm × 5.15 mm × 1.04 mm (L × W × H), with exposed copper drain terminals on bottom side.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 | Source (S) | Four parallel source terminals reduce source inductance and improve current sharing in high-di/dt switching. |
| 5, 6, 7, 8 | Drain (D) | Four exposed-copper drain pads provide low-inductance, high-current path to PCB ground plane or heatsink. |
| G (Gate) | Control terminal | Single gate pad located at pin 1 corner; requires controlled impedance routing to minimize ringing during 20+ A/ns transitions. |
Key Features
| Feature | Design Value |
|---|---|
| TrenchFET® Gen V silicon | Delivers industry-leading RDS(on) × Qg FOM for reduced switching + conduction losses in high-frequency DC/DC stages. |
| 100 % Rg and UIS tested | Ensures gate robustness against transient overvoltage and avalanche energy handling up to 125 mJ per pulse. |
| PowerPAK SO-8 package | Provides 3× lower RthJC vs. standard SO-8, enabling >300 W dissipation with minimal external heatsinking. |
| Low Qgd/Qg ratio | Qgd = 8.7 nC (typ.) yields Miller plateau control ideal for hard-switched synchronous buck topologies. |
| Body diode trr = 65 ns | Reduces reverse recovery loss and associated voltage spikes in non-overlap-controlled synchronous rectifiers. |
Applications
| Server Voltage Regulator Modules (VRMs) | Industrial 48 V-to-12 V DC/DC Converters |
|---|---|
|
Use Scenario: High-current point-of-load regulation for CPU/GPU cores in AI servers requiring >300 A per phase. IC Role / Device Role: High-side synchronous rectifier switch in multiphase buck converter with 300–500 kHz switching frequency. Use Value: 0.47 mΩ RDS(on) limits conduction loss to <1.5 W at 300 A, enabling >95 % efficiency at full load without forced air cooling. |
Use Scenario: Primary-side switch in isolated 48 V input telecom power supply feeding industrial PLC backplanes. IC Role / Device Role: Main switching element in active-clamp forward or LLC resonant converter primary stage. Use Value: 30 V rating and 350.8 A current capability allow single-device use in 1–2 kW designs, reducing component count and layout complexity. |
| Battery Management Systems (BMS) | High-Power Load Switches |
|
Use Scenario: Bidirectional current control in 24 V lithium-ion battery packs for electric material handling equipment. IC Role / Device Role: Solid-state contactor replacement for main pack disconnect and cell balancing paths. Use Value: 150 °C TJ rating and 94.6 A continuous source-drain diode current support safe reverse conduction during regenerative braking events. |
Use Scenario: Hot-swap and inrush current limiting in 12 V automotive ADAS domain controllers. IC Role / Device Role: Low-loss power path switch with integrated body diode for reverse polarity protection. Use Value: 0.68 mΩ RDS(on) at 4.5 V gate drive ensures <0.5 V drop at 70 A, eliminating need for external Schottky diodes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Infineon IPP016N04L | RDS(on) = 1.6 mΩ @ 10 V, 40 V VDS, TO-220 package, RthJC = 1.4 °C/W | Higher RDS(on) and larger footprint; suited for lower-current, cost-sensitive industrial SMPS. | Select when board space allows TO-220 mounting and 40 V blocking margin is required over 30 V. |
| ON Semiconductor NTMFS5C673NL | RDS(on) = 0.52 mΩ @ 10 V, same PowerTrench® 5x6 mm package, 60 V VDS, Qg = 62 nC | Higher voltage rating and slightly higher gate charge; compatible footprint but not pin-to-pin due to different pin 1 marking. | Choose for 48 V input designs needing 60 V VDS margin while retaining similar thermal performance and layout reuse. |
Compared with IPP016N04L and NTMFS5C673NL, the SIR500DP-T1-UE3 offers the lowest RDS(on) in its class for 30 V operation, enabling highest current density in space-constrained VRMs and POLs where thermal management is critical.
Availability
SIR500DP-T1-UE3 is available at Aetrix Electronics and suitable for server VRMs, industrial 48 V DC/DC converters, and battery management systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for high-volume production.
Supply support for SIR500DP-T1-UE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on power efficiency and reliability.
The SIR500DP-T1-UE3 belongs to Vishay's TrenchFET® Gen V power MOSFET family, engineered specifically for ultra-high-current, low-voltage synchronous rectification and POL applications demanding minimal conduction and switching losses.
FAQ
What is the maximum continuous drain current rating for SIR500DP-T1-UE3 at case temperature of 70 °C?
The SIR500DP-T1-UE3 supports 280.7 A continuous drain current at TC = 70 °C, as specified in the Absolute Maximum Ratings table. This value reflects derating from the 350.8 A rating at 25 °C due to thermal limitations, and must be validated against actual PCB copper area and heatsinking in the target application layout.
Does SIR500DP-T1-UE3 have a guaranteed avalanche energy rating?
Yes, the SIR500DP-T1-UE3 has a guaranteed single-pulse avalanche energy rating of 125 mJ (EAS) and single-pulse avalanche current of 50 A (IAS) under L = 0.1 mH test conditions. These values are production-tested and documented in the Absolute Maximum Ratings section of the datasheet.
What is the typical gate threshold voltage range for SIR500DP-T1-UE3?
The SIR500DP-T1-UE3 has a gate-source threshold voltage (VGS(th)) range of 1.0 V to 2.2 V at TJ = 25 °C and ID = 250 μA. This low threshold enables reliable turn-on with 3.3 V or 4.5 V gate drivers, and the negative temperature coefficient (−0.42 mV/°C) ensures inherent current sharing stability in paralleled configurations.
How does the PowerPAK SO-8 package of SIR500DP-T1-UE3 differ from standard SO-8 in thermal performance?
The PowerPAK SO-8 package used by SIR500DP-T1-UE3 features exposed copper drain pads on the bottom surface, achieving RthJC = 0.9 °C/W (typical), compared to ~3–4 °C/W for standard SO-8. This 3× improvement enables direct thermal coupling to PCB ground planes or heatsinks, making SIR500DP-T1-UE3 suitable for >200 W power dissipation without additional thermal interface materials.
Is SIR500DP-T1-UE3 suitable for synchronous rectification in a 400 kHz buck converter?
Yes, the SIR500DP-T1-UE3 is well-suited for synchronous rectification at 400 kHz due to its low Qg (54.3 nC typ.), fast switching times (td(off) = 47 ns typ. at VGEN = 4.5 V), and low RDS(on) at 4.5 V (0.68 mΩ max). Its body diode trr of 65 ns minimizes reverse recovery loss, and the device is 100 % UIS tested to withstand commutation stress.
SIR500DP-T1-UE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET® Gen V
- Package/Case:
- PowerPAK® SO-8
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 85.9A (Ta), 350.8A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 0.47mOhm @20A, 10V
- Vgs(th) (Max) @ Id:
- 2.2V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 180 nC @ 10 V
- Vgs (Max):
- +16V, -12V
- Input Capacitance (Ciss) (Max) @ Vds:
- 8960 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 6.25W (Ta), 104.1W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerPAK® SO-8
SIR500DP-T1-UE3 FAQ
1.How can I place an order for SIR500DP-T1-UE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIR500DP-T1-UE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIR500DP-T1-UE3 reliable?
The price and inventory of SIR500DP-T1-UE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIR500DP-T1-UE3 is usually 5 days.
3.What payment methods are accepted for SIR500DP-T1-UE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIR500DP-T1-UE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIR500DP-T1-UE3?
SIR500DP-T1-UE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIR500DP-T1-UE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIR500DP-T1-UE3?
For technical support, including SIR500DP-T1-UE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIR500DP-T1-UE3 requirements.
6.How does Aetrix verify that SIR500DP-T1-UE3 is sourced from the original manufacturer or authorized distributors?
All SIR500DP-T1-UE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIR500DP-T1-UE3 meets industry standards.
7.What is the process for return or replacement of SIR500DP-T1-UE3?
All SIR500DP-T1-UE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIR500DP-T1-UE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIR500DP-T1-UE3 part is unused and in its original packaging.
Return procedure for SIR500DP-T1-UE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SIR500DP-T1-UE3 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

