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Vishay Siliconix SIR846DP-T1-GE3

Part No.:
SIR846DP-T1-GE3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
PowerPAK® SO-8
Datasheet:
AetrixSIR846DP-T1-GE3.pdf
Description:
MOSFET N-CH 100V 60A PPAK SO-8
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,980

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Product details

Overview

SIR846DP-T1-GE3 from Vishay Siliconix is an N-channel 100-V TrenchFET® Power MOSFET in PowerPAK® SO-8 package, delivering 60 A continuous drain current at TC = 25 °C, RDS(on) of 7.8 mΩ at VGS = 10 V, and 35.7 nC total gate charge - optimized for primary-side switching in isolated DC/DC converters and full-bridge topologies.

For engineers reviewing the SIR846DP-T1-GE3 datasheet, SIR846DP-T1-GE3 pinout, SIR846DP-T1-GE3 application, or SIR846DP-T1-GE3 equivalent, key selection considerations include its 100 % UIS-tested ruggedness, lead (Pb)-free and halogen-free construction per IEC 61249-2-21, and junction-to-case thermal resistance of 0.9 °C/W enabling high-power density designs.

Technical Context

This MOSFET employs trench-gate silicon technology to achieve low RDS(on) with fast switching dynamics: Crss = 83 pF and Qgd = 9.1 nC support efficient hard-switching operation in high-frequency power supplies. Its gate threshold voltage (VGS(th) = 1.5–3.5 V) and negative temperature coefficient (−6.7 mV/°C) ensure stable turn-on behavior across −55 to 150 °C operating range.

The device integrates a robust body diode with trr = 59–100 ns and Qrr = 89–150 nC, validated for synchronous rectification and freewheeling roles. Absolute maximum ratings include VDS = 100 V, VGS = ±20 V, and single-pulse avalanche energy EAS = 61 mJ - confirming suitability for transient-prone primary-side switch applications.

Key Specifications

ParameterValue and Actual Design Meaning
VDS100 V - supports input voltages up to 100 V DC without breakdown in primary-side SMPS stages
RDS(on)7.8 mΩ @ VGS = 10 V - enables <1.6 W conduction loss at 20 A, critical for high-efficiency 100-W+ converters
ID (continuous)60 A @ TC = 25 °C - package-limited current handling suitable for high-current bridge legs
Qg35.7 nC @ VGS = 7.5 V - determines gate drive power requirement and switching speed in PWM controllers
RthJC0.9 °C/W (typ.) - allows direct thermal coupling to heatsink or PCB copper, enabling >100 W dissipation with minimal ΔT
EAS61 mJ - withstands repetitive unclamped inductive switching events common in flyback and forward converters
VGS(th)1.5–3.5 V - ensures reliable enhancement-mode turn-on with standard 5 V or 3.3 V logic-level gate drivers

Pinout & Package

PowerPAK® SO-8 is a leadless surface-mount package with same footprint as standard SO-8 but enhanced thermal performance via exposed drain pad on bottom side. Dimensions: 6.15 mm × 5.15 mm × 1.04 mm (L × W × H), with 1.27 mm pitch between gate and source terminals.

Pin/TerminalCircuit RoleDesign Meaning
1, 2, 3, 4, 5, 6, 7, 8 (Drain)Drain (D)All eight pins are internally connected to drain; forms low-inductance, high-current path to PCB copper pour
Source (S)Source (S)Pins 1–3 and 5–7 are source-connected; provides return path for load current and gate drive reference
Gate (G)Gate (G)Pin 4 only - isolated control terminal requiring <10 Ω series resistance to damp ringing during fast switching

Key Features

FeatureDesign Value
TrenchFET® architectureEnables 7.8 mΩ RDS(on) in SO-8 footprint - 40 % lower than typical planar MOSFETs at same voltage rating
100 % UIS testedGuarantees avalanche ruggedness to 61 mJ per pulse - eliminates need for external snubbers in clamp circuits
PowerPAK® SO-8 package0.9 °C/W RthJC - matches DPAK thermal performance while maintaining SO-8 board layout compatibility
Halogen-free & RoHS-compliantMeets IEC 61249-2-21 and Directive 2002/95/EC - supports green manufacturing and end-of-life compliance
Body diode trr & Qrr59–100 ns trr / 89–150 nC Qrr - reduces reverse recovery losses in synchronous rectification and ZVS designs

Applications

Primary-Side SwitchIsolated DC/DC Converter

Use Scenario: High-voltage primary switch in 36–75 V telecom offline PSUs with 300 kHz switching frequency.

IC Role / Device Role / Timing Role: Main power switch controlling energy transfer into transformer primary winding during PWM ON-time.

Use Value: 7.8 mΩ RDS(on) limits conduction loss to <3.1 W at 60 A peak, enabling >94 % efficiency at full load.

Use Scenario: Input stage of 48 V input, 12 V output isolated buck-derived converter for server VRMs.

IC Role / Device Role / Timing Role: High-side switch in active-clamp forward topology managing duty cycle and reset timing.

Use Value: 35.7 nC Qg enables clean 20 ns rise time with 1 Ω gate resistor, supporting tight regulation at 500 kHz.

Full-Bridge InverterIndustrial Motor Drive Half-Bridge

Use Scenario: Upper and lower quadrant switches in 100 V, 5 kW full-bridge inverter for battery-powered traction systems.

IC Role / Device Role / Timing Role: Paired N-channel switches implementing complementary PWM with dead-time control.

Use Value: 60 A continuous rating and 100 A pulsed capability sustain motor surge currents without derating.

Use Scenario: Low-side switch in 100 V half-bridge driving 3-phase BLDC motor in HVAC compressors.

IC Role / Device Role / Timing Role: Ground-referenced switching element conducting phase current during PWM low-side conduction.

Use Value: 0.9 °C/W RthJC maintains TJ < 135 °C under 40 A RMS load, eliminating need for external heatsink.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel 100-V power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SiR872DP-T1-GE3RDS(on) = 5.2 mΩ @ 10 V; higher Qg = 52.5 nC; same PowerPAK SO-8 packageBetter conduction loss but slower switching; suited for <200 kHz applications prioritizing efficiency over speedSelect when optimizing for lowest RDS(on) in thermally constrained 100-V primary switches
IRF540NPBFTO-220 package; RDS(on) = 44 mΩ @ 10 V; no UIS testing; higher RthJC = 1.5 °C/WLarger footprint, higher thermal resistance, and lower current rating limit use in compact, high-density boardsConsider only for legacy through-hole designs where rework to surface-mount is not feasible

Compared with SiR872DP-T1-GE3, SIR846DP-T1-GE3 trades 2.6 mΩ higher RDS(on) for 16.8 nC lower Qg - favoring high-frequency switching. Versus IRF540NPBF, it delivers 82 % lower RDS(on) and 40 % better thermal resistance in half the footprint, enabling next-generation power density.

Availability

SIR846DP-T1-GE3 is available at Aetrix Electronics and suitable for isolated DC/DC converters, full-bridge inverters, and primary-side switching applications requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production batches.

Supply support for SIR846DP-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on power efficiency and reliability.

The SiR846DP product line targets high-current, high-voltage switching in space-constrained power conversion systems - engineered specifically for rugged primary-side operation in telecom, industrial, and computing power supplies.

FAQ

What is the maximum continuous drain current rating for SIR846DP-T1-GE3 at 70 °C case temperature?

The SIR846DP-T1-GE3 supports 60 A continuous drain current at TC = 70 °C, as specified in the Absolute Maximum Ratings table. This rating is package-limited and remains unchanged from the 25 °C value due to the PowerPAK® SO-8's superior thermal design, which minimizes junction-to-case resistance to 0.9 °C/W.

Does SIR846DP-T1-GE3 require a heatsink in typical 48 V DC/DC converter applications?

SIR846DP-T1-GE3 typically does not require an external heatsink when mounted on a 4-layer FR-4 PCB with ≥0.5 in² of copper pour under the drain pad. With RthJC = 0.9 °C/W and RthJA ≈ 15 °C/W (t ≤ 10 s), junction temperature stays below 125 °C at 40 A continuous current and 25 °C ambient - verified in Vishay Application Note AN821.

Is SIR846DP-T1-GE3 compatible with standard SO-8 footprints?

Yes, SIR846DP-T1-GE3 uses the PowerPAK® SO-8 package, which maintains identical outline, pin pitch, and land pattern compatibility with standard SO-8. The drain pads extend beyond traditional leads to maximize thermal contact, but no PCB redesign is needed - existing SO-8 layouts accept this part directly per Vishay Application Note AN826.

What gate drive voltage is recommended for optimal RDS(on) performance in SIR846DP-T1-GE3?

For minimum RDS(on), SIR846DP-T1-GE3 should be driven with VGS = 10 V, achieving 7.8 mΩ. At VGS = 7.5 V, RDS(on) rises to 8.5 mΩ - still suitable for most applications. Gate drive must remain within ±20 V absolute maximum to avoid oxide damage, and gate resistance should be selected to limit dV/dt-induced shoot-through in bridge configurations.

How is the body diode performance of SIR846DP-T1-GE3 characterized for synchronous rectification?

The SIR846DP-T1-GE3 body diode exhibits VSD = 0.77–1.1 V at IS = 5 A and trr = 59–100 ns at IF = 20 A, dI/dt = 100 A/µs. Its Qrr = 89–150 nC enables low-loss freewheeling in synchronous buck and LLC resonant converters, especially when paired with adaptive gate timing to minimize reverse recovery overlap losses.

SIR846DP-T1-GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
TrenchFET®
Package/Case:
PowerPAK® SO-8
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
100 V
Current - Continuous Drain (Id) @ 25°C:
60A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
7.5V, 10V
Rds On (Max) @ Id, Vgs:
7.8mOhm @ 20A, 10V
Vgs(th) (Max) @ Id:
3.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
72 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
2870 pF @ 50 V
FET Feature:
-
Power Dissipation (Max):
6.25W (Ta), 104W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PowerPAK® SO-8

SIR846DP-T1-GE3 FAQ

1.How can I place an order for SIR846DP-T1-GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIR846DP-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIR846DP-T1-GE3 reliable?

The price and inventory of SIR846DP-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIR846DP-T1-GE3 is usually 5 days.

3.What payment methods are accepted for SIR846DP-T1-GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIR846DP-T1-GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIR846DP-T1-GE3?

SIR846DP-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIR846DP-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIR846DP-T1-GE3?

For technical support, including SIR846DP-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIR846DP-T1-GE3 requirements.

6.How does Aetrix verify that SIR846DP-T1-GE3 is sourced from the original manufacturer or authorized distributors?

All SIR846DP-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIR846DP-T1-GE3 meets industry standards.

7.What is the process for return or replacement of SIR846DP-T1-GE3?

All SIR846DP-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIR846DP-T1-GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIR846DP-T1-GE3 part is unused and in its original packaging.

Return procedure for SIR846DP-T1-GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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