NXP Semiconductors SL2FCS2001DV/DH,11

Overview

SL2FCS2001DV/DH from NXP Semiconductors (formerly Philips Semiconductors) is an ISO/IEC 15693-compliant contactless smart label IC in SOT732AA1 flip-chip package, operating at 13.56 MHz with ±7 kHz bandwidth, minimum supply voltage ±2.5 V_rms, and EEPROM endurance of 100,000 write cycles for RFID tag applications in logistics and asset tracking.

For engineers reviewing the SL2FCS2001DV/DH datasheet, SL2FCS2001DV/DH pinout, SL2FCS2001DV/DH application, or SL2FCS2001DV/DH equivalent, key selection factors include its I-CONNECT SLI interface compliance, on-chip voltage limiting for LA–LB input, 280 µW minimum operating power, 10-year EEPROM data retention at ≤55 °C, and hot-laminated backside tape configuration.

Technical Context

The SL2FCS2001DV/DH implements a passive RF interface compliant with ISO/IEC 15693-2 and -3, using load modulation for backscatter communication and integrated demodulator circuitry with response time specified per standard pulse shapes. It features on-chip voltage limitation between LA and LB terminals to constrain input current to 30 mArms under nominal operation.

Its RF front-end supports 13.553–13.567 MHz operation within ISM band regulations, with input capacitance of 23.5 pF measured at 13.56 MHz, and requires external resonant capacitor and coil design aligned with ISO/IEC 15693 specifications for proper demodulator response and modulation pulse timing.

Key Specifications

Pinout & Package

SOT732AA1 is a 4-terminal flip-chip package with exposed die pad, designed for direct bonding to antenna substrate. Terminal layout follows I-CONNECT SLI mechanical specification FCP 2.1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar contactless smart label IC applications.

Compared with SL2FCS2001DV/DH, the bare-die SL2ICS2001 offers greater integration flexibility but demands advanced assembly capability, while SL2FCS2001DV/DC provides identical RF performance with lower thermal lamination requirements-making it preferable for thin-film or pre-printed label production.

Availability

SL2FCS2001DV/DH is available at Aetrix Electronics and suitable for inventory management, retail authentication, reusable asset tracking, and library media identification requiring stable component supply and long-term traceability.

Supply support for SL2FCS2001DV/DH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions, with roots in Philips Semiconductors' RFID and smart card IC development.

The SL2FCS2001DV/DH belongs to the I-CONNECT SLI product line, engineered specifically for ISO/IEC 15693-compliant passive RFID labels targeting high-speed, multi-tag reading in industrial and commercial identification systems.

FAQ

What is the primary function of the SL2FCS2001DV/DH in an RFID system?

The SL2FCS2001DV/DH serves as a passive, contactless smart label IC compliant with ISO/IEC 15693. It receives power from an RF field, demodulates incoming commands, executes memory operations (read/write/EAS), and transmits responses via load modulation. Its role in the SL2FCS2001DV/DH-based tag is to provide standardized, interoperable identification and data storage without onboard power.

Does the SL2FCS2001DV/DH require external components to operate?

Yes, the SL2FCS2001DV/DH requires an external LC resonant circuit-typically a printed antenna coil and a discrete capacitor-to form the 13.56 MHz tank circuit. No external voltage regulator or clock source is needed, as power and timing are derived entirely from the RF field. The SL2FCS2001DV/DH integrates all necessary demodulation, logic, and EEPROM functions on-die.

What does "hot laminated backside tape" mean for the SL2FCS2001DV/DH?

"Hot laminated backside tape" refers to a thermally activated adhesive layer on the underside of the SOT732AA1 package. During manufacturing, heat and pressure bond the SL2FCS2001DV/DH directly to the antenna substrate-enabling robust mechanical attachment and electrical grounding without solder or conductive epoxy. This feature is integral to the SL2FCS2001DV/DH's suitability for high-speed label production lines.

Can the SL2FCS2001DV/DH be used in environments exceeding +85 °C junction temperature?

No. The SL2FCS2001DV/DH is rated for operating junction temperature from –25 °C to +85 °C. Operation above +85 °C violates absolute maximum ratings and risks permanent damage or unpredictable behavior. For elevated-temperature applications, thermal modeling must ensure T_j remains within this range-even if ambient temperature is lower-due to RF power dissipation in the chip.

How does the SL2FCS2001DV/DH handle electrostatic discharge during handling?

The SL2FCS2001DV/DH incorporates on-chip ESD protection circuitry rated to ±2 kV per MIL-STD-883D Method 3015.7 (Human Body Model). While this provides baseline robustness, standard ESD handling precautions-including grounded workstations, ionizers, and shielded packaging-are still required. The SL2FCS2001DV/DH is not intended for uncontrolled static environments such as non-EPA assembly floors.