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NXP Semiconductors SL2ICS5301EW/V7:00
- Part No.:
- SL2ICS5301EW/V7:00
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- Die
- Datasheet:
-
SL2ICS5301EW/V7:00.pdf
- Description:
- IC RFID TRANSP 13.56MHZ DIE
- Quantity:
- Payment:
- Shipping:
Inventory:1,848
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Product details
Overview
SL2ICS5301EW/V7:00 from NXP Semiconductors is an I•CODE SLI-S Label IC in bumped wafer form, designed for contactless RFID tag applications operating at 13.56 MHz per ISO/IEC 15693. It features 10-year EEPROM data retention, 100,000 write cycles, and 2.5–2.7 Vrms minimum supply voltage. The die measures 940 × 900 µm² with Au bumps (60 × 60 µm²) on LA/LB/VSS/TEST pads for flip-chip assembly into smart labels.
For engineers reviewing the SL2ICS5301EW/V7:00 datasheet, SL2ICS5301EW/V7:00 pinout, SL2ICS5301EW/V7:00 application, or SL2ICS5301EW/V7:00 equivalent, this page delivers verified wafer-level specifications-including bump geometry, RF electrical characteristics, absolute maximum ratings, and ISO/IEC 15693-2/3 compliance-critical for high-yield label module integration and antenna coupling design.
Technical Context
The SL2ICS5301EW/V7:00 implements a passive 13.56 MHz RFID transponder IC compliant with ISO/IEC 15693-2 and -3, using on-chip rectification and demodulation to power and communicate via magnetic field coupling. Its input capacitance (22.3–24.7 pF) and modulation response (≥10% m, tD ≤ 10 µs) are calibrated for standard reader coil designs.
It integrates 1 kbit EEPROM with error detection, operates over –25 °C to +85 °C junction temperature, and uses TiW under-bump metallization with 18 µm Au bumps rated for >70 MPa shear strength. No inkdot marking is applied; failure mapping follows SECS II format.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Operating Frequency | 13.553–13.567 MHz - Matches ISM band ±7 kHz tolerance for global ISO/IEC 15693 reader interoperability. |
| Min Supply Voltage | 2.5 Vrms - Minimum RF field strength required to power internal circuitry and enable read/write operations. |
| EEPROM Retention | 10 years at Tamb ≤ 55 °C - Guaranteed non-volatile data storage lifetime under typical label environmental conditions. |
| Write Endurance | 100,000 cycles - Maximum number of guaranteed EEPROM rewrites before parametric degradation. |
| Input Capacitance | 22.3–24.7 pF at 13.56 MHz - Critical value for resonant tank tuning with external capacitor and antenna coil. |
| Au Bump Height | 18 µm ± 2 µm (die), ± 3 µm (wafer) - Ensures consistent mechanical standoff and solder joint reliability in flip-chip bonding. |
| Bump Shear Strength | >70 MPa - Validates mechanical robustness of interconnects during thermal cycling and lamination stress. |
Pinout & Package
SL2ICS5301EW/V7:00 is supplied as an 8-inch bumped sawn wafer on UV-tape, with individual dies measuring 940 × 900 µm² and scribe lines of 50 µm. Passivation uses a PSG/Nitride sandwich structure (500 nm / 600 nm). Backside is ground Si with Ra ≤ 0.5 µm roughness.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| LA | RF Antenna Input (Anode) | Primary AC input terminal for magnetic field coupling; connects to one side of resonant LC tank. |
| LB | RF Antenna Input (Cathode) | Secondary AC input terminal completing RF loop; differential input enables balanced demodulation. |
| VSS | Ground Reference | Internal substrate reference; disconnected after dicing per specification footnote 1. |
| TEST | Test Pad | Factory test access point; electrically isolated post-dicing per specification footnote 1. |
Key Features
| Feature | Design Value |
|---|---|
| ISO/IEC 15693-2/3 Compliance | Fully implements air interface protocol including pulse shape, timing tolerances, and load modulation response. |
| On-Chip Voltage Limitation | ILA-LB current limiting (30 mArms) protects internal rectifier and logic from overvoltage during strong RF fields. |
| Flip-Chip Ready Bumps | 60 × 60 µm² Au bumps with TiW UBM ensure reliable thermocompression bonding to flexible substrates. |
| High-Yield Wafer Test | Minimum 30% functional die yield per wafer (29,941 potential dies) verified via electronic SECS II mapping. |
| ESD Robustness | ±2 kV HBM (MIL-STD-883D Method 3015.7) enables handling in standard cleanroom environments without special precautions. |
Applications
| Smart Retail Labels | Library Asset Tags |
|---|---|
|
Use Scenario: Reusable price tags and inventory labels attached to clothing, electronics, or books using conductive adhesive or lamination. IC Role / Device Role / Timing Role: Passive RFID transponder providing unique ID and user memory for item-level identification and stock tracking. Use Value: Enables battery-free operation with 10-year data retention and 100,000 rewrite cycles for dynamic pricing and loan management. |
Use Scenario: Book and media check-in/out systems where tags endure repeated handling and shelf exposure. IC Role / Device Role / Timing Role: ISO/IEC 15693-compliant transponder interfacing with fixed or handheld readers at library circulation desks. Use Value: Delivers robust 13.56 MHz communication with <10 µs demodulator response time for fast multi-tag interrogation in dense stacks. |
| Pharmaceutical Packaging | Industrial Tool Tracking |
|
Use Scenario: Tamper-evident blister packs or vial labels requiring regulatory-compliant serialization and audit trail storage. IC Role / Device Role / Timing Role: Secure, low-power memory node storing batch numbers, expiry dates, and authentication keys. Use Value: Meets medical device traceability requirements with guaranteed 10-year EEPROM retention at ≤55 °C ambient. |
Use Scenario: Metal-embedded tool tags in manufacturing cells subjected to vibration, thermal cycling, and ESD events. IC Role / Device Role / Timing Role: Ruggedized RFID tag IC with >70 MPa bump shear strength and ±2 kV HBM ESD rating. Use Value: Maintains reliable read performance after 30% minimum wafer yield validation and mechanical stress release backside treatment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RFID transponder applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SL2ICS5302EW/V7:00 | Same die, higher EEPROM capacity (2 kbit vs. 1 kbit); identical bump layout, frequency, and voltage specs. | Required when extended user memory space is needed for firmware versioning or multi-language text. | Select SL2ICS5302EW/V7:00 only if additional 1 kbit EEPROM is confirmed necessary; otherwise SL2ICS5301EW/V7:00 minimizes cost and layout footprint. |
| SL2ICS5201EW/V7:00 | Based on earlier C075E process; same 1 kbit EEPROM but lower min. supply voltage (2.2 Vrms) and reduced bump height (15 µm). | Suitable for ultra-low-field environments (e.g., near-metal surfaces) where margin below 2.5 Vrms is critical. | Choose SL2ICS5201EW/V7:00 only for legacy compatibility or sub-2.5 Vrms field strength constraints; SL2ICS5301EW/V7:00 offers improved bump reliability and newer process consistency. |
Compared with SL2ICS5301EW/V7:00, SL2ICS5302EW/V7:00 adds memory without changing RF behavior or mechanical interface, while SL2ICS5201EW/V7:00 trades bump robustness for lower voltage sensitivity-making SL2ICS5301EW/V7:00 the optimal balance of reliability, compliance, and cost for mainstream ISO/IEC 15693 label production.
Availability
SL2ICS5301EW/V7:00 is available at Aetrix Electronics and suitable for smart retail labels, library asset tags, and pharmaceutical packaging requiring stable component supply, wafer-level traceability, and ISO/IEC 15693-2/3 certification support.
Supply support for SL2ICS5301EW/V7:00 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The SL2ICS53 series belongs to NXP's I•CODE SLI-S product line, engineered specifically for high-volume, cost-sensitive RFID label applications demanding ISO/IEC 15693 compliance, long-term data integrity, and flip-chip manufacturability.
FAQ
What is the physical form of SL2ICS5301EW/V7:00?
SL2ICS5301EW/V7:00 is delivered as an 8-inch silicon wafer with sawn, Au-bumped dies on UV-tape. Each die measures 940 × 900 µm² and features four 60 × 60 µm² Au bumps (LA, LB, VSS, TEST) for flip-chip assembly. No packaging or singulation is performed by NXP; end users perform die attach and lamination.
Does SL2ICS5301EW/V7:00 include integrated EEPROM memory?
Yes, SL2ICS5301EW/V7:00 integrates 1 kbit of EEPROM memory with guaranteed 10-year data retention at ≤55 °C ambient and 100,000 write endurance cycles. Memory is accessed via ISO/IEC 15693 commands and supports block write, read, and lock functions per the I•CODE SLI-S functional specification.
What RF standards does SL2ICS5301EW/V7:00 comply with?
SL2ICS5301EW/V7:00 complies fully with ISO/IEC 15693-2 (air interface) and ISO/IEC 15693-3 (anti-collision and command set), including specified pulse shapes, timing tolerances, and load modulation response. It operates at 13.56 MHz with ±7 kHz bandwidth per ISM regulations.
How is wafer-level quality assurance handled for SL2ICS5301EW/V7:00?
Each SL2ICS5301EW/V7:00 wafer undergoes full electrical testing with ≥30% minimum yield per wafer (29,941 potential dies) and ≥30% per lot. Failed die locations are provided electronically in SECS II format on floppy disk-no inkdot marking is used-and include both electrical and mechanical/visual inspection results.
What are the bump mechanical specifications for SL2ICS5301EW/V7:00?
SL2ICS5301EW/V7:00 features 99.9% pure Au bumps with 18 µm nominal height, ±2 µm uniformity within a die, ±3 µm across a wafer, and ±4 µm wafer-to-wafer. Bump shear strength exceeds 70 MPa, and flatness is controlled to ±1.5 µm-validated for thermocompression bonding to flexible substrates.
SL2ICS5301EW/V7:00 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- I-Code
- Package/Case:
- Die
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- RFID Transponder
- Frequency:
- 13.56MHz
- Standards:
- EPC, ISO 15693
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
SL2ICS5301EW/V7:00 FAQ
1.How can I place an order for SL2ICS5301EW/V7:00 through Aetrix?
Please submit a Request for Quotation (RFQ) for SL2ICS5301EW/V7:00 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SL2ICS5301EW/V7:00 reliable?
The price and inventory of SL2ICS5301EW/V7:00 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SL2ICS5301EW/V7:00 is usually 5 days.
3.What payment methods are accepted for SL2ICS5301EW/V7:00?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SL2ICS5301EW/V7:00 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SL2ICS5301EW/V7:00?
SL2ICS5301EW/V7:00 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SL2ICS5301EW/V7:00 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SL2ICS5301EW/V7:00?
For technical support, including SL2ICS5301EW/V7:00 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SL2ICS5301EW/V7:00 requirements.
6.How does Aetrix verify that SL2ICS5301EW/V7:00 is sourced from the original manufacturer or authorized distributors?
All SL2ICS5301EW/V7:00 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SL2ICS5301EW/V7:00 meets industry standards.
7.What is the process for return or replacement of SL2ICS5301EW/V7:00?
All SL2ICS5301EW/V7:00 units undergo pre-shipment inspection (PSI). If there is an issue with SL2ICS5301EW/V7:00, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SL2ICS5301EW/V7:00 part is unused and in its original packaging.
Return procedure for SL2ICS5301EW/V7:00:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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