NXP Semiconductors SL2S2602FUD2/BGA

Overview

SL2S2602FUD2/BGA from NXP Semiconductors is an ISO/IEC 15693-compliant contactless RFID IC in bare-die wafer form, designed for high-speed inventory, extended read range up to 1.5 m, and robust anti-collision operation in multi-tag environments. It integrates 2.5 kbit EEPROM user memory, 32-byte ECC-based originality signature, and password-protected privacy/destroy/EAS/AFI functions - deployed in pharmaceutical item-level tagging and library asset tracking.

For engineers reviewing the SL2S2602FUD2/BGA datasheet, SL2S2602FUD2/BGA pinout, SL2S2602FUD2/BGA application, or SL2S2602FUD2/BGA equivalent, key selection considerations include its 13.56 MHz RF interface, 4-terminal bump configuration (LA/LB/GND/TEST), 120 μm die thickness with 7 μm polyimide spacer, and support for fast inventory, persistent quiet mode, and 16-bit counter with optional password protection.

Technical Context

The SL2S2602FUD2/BGA implements a fully integrated analog RF front-end with resonant demodulation and load modulation, enabling battery-free operation via inductive coupling at 13.56 MHz. Its digital controller executes ISO/IEC 15693-2/3 protocol stack, including true anti-collision, extended inventory commands, and custom NXP commands like READ_SIGNATURE and ENABLE PRIVACY.

Memory architecture separates 2528-bit user-accessible EEPROM (79 blocks × 4 bytes) from protected configuration space containing UID, passwords, DSFID, AFI, EAS, and originality signature. The 16-bit counter resides in block 79 and supports increment/reset with optional read/write password enforcement.

Key Specifications

Pinout & Package

SL2S2602FUD2/BGA is supplied as a bumped 200 mm wafer with 120 μm thickness, 7 μm polyimide spacer, and Au bumps on four bonding pads: LA, LB, GND, and TEST. Die size is 540 μm × 543 μm; bump dimensions are 80 μm × 80 μm (LA/LB) and 60 μm × 60 μm (GND/TEST).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar RFID transponder applications.

Compared with SL2S2602FTB and SL2S2602FA8, the SL2S2602FUD2/BGA offers full wafer-level flexibility - including GND and TEST pads for validation, 120 μm thinness for flexible substrate embedding, and direct bump bonding - making it the only choice for custom antenna-integrated smart labels requiring electrical debug access and mechanical thinness.

Availability

SL2S2602FUD2/BGA is available at Aetrix Electronics and suitable for pharmaceutical serialization, library automation, industrial asset tracking, and anti-counterfeiting applications requiring stable component supply, long-term lifecycle support, and wafer-level customization capability.

Supply support for SL2S2602FUD2/BGA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with core expertise in RFID, NFC, and secure microcontrollers.

The ICODE SLIX2 product line - including SL2S2602FUD2/BGA - was engineered specifically for high-reliability, high-security HF RFID applications demanding extended read range, cryptographic authenticity, and field-upgradeable memory protection in logistics and identity-sensitive environments.

FAQ

What is the primary function of the SL2S2602FUD2/BGA in an RFID system?

The SL2S2602FUD2/BGA serves as a contactless ISO/IEC 15693-compliant RFID transponder IC, converting RF energy from a reader's magnetic field into operating power and bidirectional data communication. It stores 2.5 kbit of user data, executes secure commands (e.g., ENABLE PRIVACY, DESTROY SLIX2), and delivers NXP's 32-byte originality signature - all without an internal battery. Its role is foundational in item-level identification and authentication systems.

Does the SL2S2602FUD2/BGA support password-protected memory access, and how many distinct passwords does it implement?

Yes, the SL2S2602FUD2/BGA implements five independent 32-bit password protections: Read, Write, Privacy, Destroy, and EAS/AFI. Each is enforced via dedicated password identifiers (01h–10h) and requires prior transmission using the SET PASSWORD command with XOR obfuscation. Passwords can be locked permanently with LOCK PASSWORD, and the 64-bit mode enforces dual-password access for enhanced security - all confirmed in the official Rev. 4.2 datasheet.

What are the physical dimensions and bump specifications of the SL2S2602FUD2/BGA die?

The SL2S2602FUD2/BGA die measures 540 μm × 543 μm with 120 μm thickness and a 7 μm polyimide spacer. It features four Au bumps: LA and LB (80 μm × 80 μm), plus GND and TEST (60 μm × 60 μm). Bump height is 25 μm with ±2 μm uniformity per die, and shear strength exceeds 70 MPa - specifications explicitly defined in Section 8.1 of the SL2S2602 datasheet.

How does the 16-bit counter in the SL2S2602FUD2/BGA operate, and where is it located in memory?

The 16-bit counter resides exclusively in block 79 (the final 4-byte EEPROM block) of the SL2S2602FUD2/BGA. It increments by one on each WRITE command to that block and resets to a user-defined value using the write password. The counter password protection flag is stored in byte 3 of block 79 (PROT byte), and the counter value occupies bytes 0–1 (C0/C1). This design prevents use of block 79 for general data storage.

Is the SL2S2602FUD2/BGA compatible with standard ISO/IEC 15693 readers, and what custom commands does it add?

Yes, the SL2S2602FUD2/BGA is fully compliant with ISO/IEC 15693-2/3 and interoperable with all standard HF RFID readers. Beyond mandatory commands (INVENTORY, READ SINGLE BLOCK), it adds NXP-specific custom commands including GET RANDOM NUMBER (B2h), READ_SIGNATURE (B6h), ENABLE PRIVACY (B7h), and DESTROY SLIX2 (B8h) - all documented in Section 9.5.3 of the datasheet and enabled by NXP's manufacturer code 04h.