NXP Semiconductors SL2S5002FUD,003

Overview

SL2S5002FUD,003 from NXP Semiconductors is an ISO/IEC 15693–compliant contactless RFID IC designed for smart label applications requiring privacy protection, lean command sets, and compact memory. It delivers 512-bit EEPROM, 13.56 MHz operation, up to 1.5 m read range, and password-protected Privacy Mode, Destroy Mode, and EAS/AFI functions - deployed in industrial laundry tracking and asset management systems.

For engineers reviewing the SL2S5002FUD,003 datasheet, SL2S5002FUD,003 pinout, SL2S5002FUD,003 application, or SL2S5002FUD,003 equivalent, key selection considerations include its wafer-level packaging (520 µm × 484 µm), 4-bond-pad layout with LA/LB antenna inputs, 32-bit password security architecture, and compliance with ISO/IEC 18000-3 Mode 1.

Technical Context

The SL2S5002FUD,003 integrates an analog RF interface (13.56 MHz resonant coupling), digital controller with anticollision state machine, and 512-bit EEPROM organized into 16 blocks of 4 bytes each. Its RF interface supports high-speed 53 kbit/s data transfer using ASK modulation and 16-bit CRC error detection.

It implements true ISO/IEC 15693–compliant anticollision, ENABLE PRIVACY (BCh) and DESTROY SLIX-L (B9h) custom commands, and password-protected access control for AFI, DSFID, EAS, and memory blocks - all executed via LA/LB antenna terminals without internal power supply.

Key Specifications

Pinout & Package

SL2S5002FUD,003 is supplied as a bare die on film frame carrier: 520 µm × 484 µm, 120 µm thickness, CMOS 0.14 µm process, with four bonding pads (LA, LB, GND, TEST). It has no leads or molded package - intended for flip-chip or wire-bond integration onto inlay antennas.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar RFID transponder applications.

Compared with SL2S5102FUD and SL2S5002FTB, SL2S5002FUD,003 offers the smallest footprint and lowest input capacitance - making it the most suitable choice for high-density, thin-film smart labels where antenna miniaturization and impedance matching precision are critical.

Availability

SL2S5002FUD,003 is available at Aetrix Electronics and suitable for industrial laundry tracking, factory asset management, and library media circulation requiring stable component supply, long-term lifecycle support, and wafer-level customization capability.

Supply support for SL2S5002FUD,003 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in RFID and NFC technologies.

The ICODE SLIX-L product line - including SL2S5002FUD,003 - was engineered specifically for privacy-aware, high-volume smart label deployments in logistics, retail, and industrial automation, balancing memory efficiency, security granularity, and ISO/IEC 15693 interoperability.

FAQ

What is the primary function of SL2S5002FUD,003 in an RFID system?

The SL2S5002FUD,003 is a contactless RFID transponder IC that functions as a passive, battery-free data carrier compliant with ISO/IEC 15693. It stores a unique 64-bit identifier and up to 256 bits of user data, responds to reader commands via inductive coupling at 13.56 MHz, and executes security features like Privacy Mode and irreversible Destroy - all within its 520 µm × 484 µm bare-die form factor.

How does SL2S5002FUD,003 achieve 1.5 m read range without a battery?

The SL2S5002FUD,003 achieves up to 1.5 m read range through highly efficient 13.56 MHz inductive coupling: its LA and LB terminals connect to a tuned LC antenna (Ci = 23.5 pF typical), converting reader field energy into regulated VDD for the analog/digital circuitry. This enables full 53 kbit/s communication and EEPROM access at gate-width distances - verified under standardized ISO/IEC 10373-6 test conditions.

Can SL2S5002FUD,003 be used on metal surfaces?

Yes, SL2S5002FUD,003 can be deployed on metal surfaces when integrated into purpose-designed metal-mount inlays - typically using ferrite-backing or distance spacers to mitigate eddy current losses. Its 23.5 pF input capacitance and small die size allow precise antenna tuning to maintain resonance and read performance; however, direct die attachment to bare metal without isolation will detune the LC circuit and impair operation.

What security mechanisms does SL2S5002FUD,003 implement to protect user data?

The SL2S5002FUD,003 implements three independent 32-bit password protections (Privacy, Destroy, EAS/AFI), per-block write locks, and immutable 64-bit UID. Privacy Mode suppresses all responses except GET RANDOM NUMBER until the correct password is presented; Destroy Mode permanently disables the IC after successful authentication; EAS/AFI password lock prevents unauthorized changes to surveillance or classification flags - all enforced in hardware without firmware dependencies.

Is SL2S5002FUD,003 pin-compatible with other ICODE SLIX-L variants?

No - SL2S5002FUD,003 is a bare die with four bonding pads (LA, LB, GND, TEST), while SL2S5002FTB uses a 3-pin XSON3 package (LA, LB, n.c.) and SL2S5102FUD has different pad spacing and capacitance. Though functionally identical in command set and memory, their physical interfaces are not interchangeable; board or inlay redesign is required when substituting between wafer, XSON3, or alternate wafer variants.