NXP Semiconductors SL3S1013FUD/BG,003

Overview

SL3S1013FUD/BG,003 from NXP Semiconductors is a UHF RFID Gen2 transponder IC (UCODE G2iM+) in bare die form, designed for item-level tagging and secure wireless identification. It delivers -27 dBm sensitivity under external supply mode, supports up to 448-bit EPC memory and 640-bit segmented user memory (open/protected/private), and integrates tag tamper alarm, digital switch, and conditional real read range reduction - enabling applications in electronic device activation, PCB tagging, and anti-counterfeiting.

For engineers reviewing the SL3S1013FUD/BG,003 datasheet, SL3S1013FUD/BG,003 pinout, SL3S1013FUD/BG,003 application, or SL3S1013FUD/BG,003 equivalent, this page provides verified technical context, wafer-level package details, memory segmentation behavior, tamper-detection logic, and validated alternative options aligned with EPCglobal v1.2.0 compliance and industrial deployment requirements.

Technical Context

The SL3S1013FUD/BG,003 implements a passive UHF RFID air interface compliant with EPCglobal Class-1 Generation-2 (v1.2.0) across 840–960 MHz, with optional external VDD supply enabling boosted sensitivity (-27 dBm). Its analog RF interface includes rectification, voltage regulation, and backscatter modulation via RFP/RFN antenna terminals, while the digital control block handles anti-collision, protocol state machines, and EEPROM access.

Memory organization follows four banks: Reserved (64-bit), EPC (up to 448-bit), TID (96-bit + 112-bit User TID), and User Memory (640-bit configurable). Configuration is managed via two dedicated 16-bit words at EPC bank addresses 1F0h (Mem-Config-Word) and 200h (Config-Word), supporting password-protected features including PSF, tamper alarm, and conditional read range reduction without custom command dependency.

Key Specifications

Pinout & Package

Bare die package: 0.615 mm × 0.475 mm (0.292 mm²) CMOS 0.14 μm die on 200 mm wafer with 7 μm polyimide spacer; four gold bumps (RFP, RFN, OUT, VDD), each 60 × 60 μm, height 25 μm (18 μm protruding above spacer).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar UHF RFID transponder applications.

Compared with SL3S1013FTB0, SL3S1013FUD/BG,003 offers superior bump uniformity and wafer-level process control for high-reliability inlays; compared with SL3S1003FUD/BG, it adds critical security primitives - making it the sole option for applications requiring hardware-enforced privacy or wireless seal functionality.

Availability

SL3S1013FUD/BG,003 is available at Aetrix Electronics and suitable for electronic device activation, PCB tagging, wireless safety seals, and supply chain authentication requiring stable component supply across global manufacturing programs.

Supply support for SL3S1013FUD/BG,003 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions, with core expertise in RFID, NFC, and secure authentication ICs deployed across automotive, industrial, and consumer markets.

The UCODE G2iM+ product line - including SL3S1013FUD/BG,003 - was engineered specifically for high-security, high-reliability UHF RFID applications demanding tamper evidence, remote configuration, and extended memory architecture in minimal footprint.

FAQ

What is the primary function of the OUT pin on SL3S1013FUD/BG,003?

The OUT pin on SL3S1013FUD/BG,003 serves dual roles: as a digital output switch (latching VDD or GND when externally powered) and as a tamper-sense terminal. Its connection state to VDD determines activation of conditional read range reduction and tag tamper alarm flags stored in the Config-Word at address 200h. This dual functionality is exclusive to the G2iM+ variant and requires external VDD supply to engage.

Does SL3S1013FUD/BG,003 support EPCglobal Gen2 v2.0 or later?

No - SL3S1013FUD/BG,003 is certified for EPCglobal UHF RFID Protocol Class-1 Generation-2 v1.2.0 only, as confirmed in Section 10.1 of its official datasheet. It does not implement Gen2 v2.0 features such as dense-reader mode enhancements, session parameter persistence, or extended channel agility. System designs must rely on v1.2.0-compliant readers and middleware.

How is memory segmentation implemented in SL3S1013FUD/BG,003?

SL3S1013FUD/BG,003 implements memory segmentation exclusively in its 640-bit User Memory bank (Bank 11), dividing it into open, protected, and private segments via the Mem-Config-Word at EPC bank address 1F0h. Access to protected/private segments requires valid Access Password or User Password, respectively - enforced at protocol level during READ/WRITE commands. Segmentation is not supported in EPC or TID banks.

Can SL3S1013FUD/BG,003 operate without external power?

Yes - SL3S1013FUD/BG,003 operates passively using RF energy harvested from the reader's field via RFP/RFN, achieving -17.5 dBm sensitivity. External VDD supply is optional and only required to activate enhanced features: -27 dBm sensitivity, digital switch output, and conditional read range reduction. Passive operation retains full EPC/TID read/write, PSF, and memory protection functions.

What distinguishes SL3S1013FUD/BG,003 from SL3S1003FUD/BG?

SL3S1013FUD/BG,003 is the G2iM+ variant featuring VDD/OUT terminals, 448-bit EPC, 640-bit segmentable user memory, tag tamper alarm, digital switch, external supply mode, and conditional read range reduction. SL3S1003FUD/BG is the base G2iM variant lacking these terminals and features - limited to 256-bit EPC, fixed 512-bit user memory, and no tamper or I/O capabilities. Their TID model numbers (E200680B vs E200680A) are hardware-distinguishable.