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NXP Semiconductors SL3S1204FUD2/BG1BZ
- Part No.:
- SL3S1204FUD2/BG1BZ
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- -
- Datasheet:
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SL3S1204FUD2/BG1BZ.pdf
- Description:
- IC UCODE SMART LABEL UNCASED
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Product details
Overview
SL3S1204FUD2/BG1BZ from NXP Semiconductors is a UCODE 7 EPC Gen2 v2.0-compliant UHF RFID IC in bumped die form on a 12-inch, 120 μm-thick wafer with 7 μm polyimide spacer. It delivers -21 dBm read sensitivity, -16 dBm write sensitivity, and supports parallel encoding of 100 items in 60 ms for high-speed retail inventory tagging.
For engineers reviewing the SL3S1204FUD2/BG1BZ datasheet, SL3S1204FUD2/BG1BZ pinout, SL3S1204FUD2/BG1BZ application, or SL3S1204FUD2/BG1BZ equivalent, this page provides verified technical context, memory architecture details, antenna interface specifications, EAS-ready Product Status Flag implementation, and wafer-level mechanical validation per Rev. 4.0 (5 March 2019).
Technical Context
The SL3S1204FUD2/BG1BZ implements a passive UHF RFID transponder architecture compliant with EPCglobal Class-1 Generation-2 (860–960 MHz), featuring analog RF interface with rectification and voltage regulation, digital control logic for anticollision and protocol handling, and EEPROM-based memory banks for EPC, TID, and reserved data. Its CMOS 0.14 μm process enables stable operation across -40 °C to +85 °C.
It supports mandatory EPC Gen2 v1.2.0 commands (Kill, PermaLock) and optional commands (Access, BlockWrite), plus UCODE 7–specific features activated via standard SELECT/READ/WRITE operations on the Configuration Word at EPC bank address 200h - including Tag Power Indicator (bit 204h) and Parallel Encoding (bit 202h), both requiring no custom firmware.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Standard | EPCglobal UHF Class-1 Gen2 v1.2.0 & v2.0 ready; full compliance with mandatory and selected optional commands |
| Read Sensitivity | -21 dBm - enables longest possible read range under regulatory limits for dense tag populations |
| Write Sensitivity | -16 dBm - allows reliable encoding at greater distances or through low-conductivity materials |
| Parallel Encoding Speed | 100 tags in 60 ms - reduces bulk initialization time by >90% vs. sequential encoding |
| EPC Memory Size | Up to 128 bits - supports extended EPC formats while retaining pre-serialized 96-bit EPC capability |
| TID Structure | 96-bit factory-locked TID with 48-bit unique serial number - ensures unalterable device identity for traceability |
| Operating Temperature | -40 °C to +85 °C - validated for industrial labeling, warehouse logistics, and apparel hangtag environments |
| Write Endurance | Minimum 100,000 cycles - sufficient for reprogrammable asset tracking and reusable container applications |
Pinout & Package
SL3S1204FUD2/BG1BZ is supplied as a bare die on a 300 mm (12-inch) wafer, 120 μm thick, with 7 μm polyimide spacer and gold bumps. Die dimensions are 0.490 mm × 0.445 mm. Four terminals are arranged non-diagonally in chip corners: RF1 and RF2 serve as differential antenna connections; TP1 and TP2 are test pads electrically disconnected after dicing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RF1 | Antenna connector 1 | Differential RF input/output terminal; forms half of impedance-matched antenna interface for UHF backscatter modulation |
| RF2 | Antenna connector 2 | Differential RF input/output terminal; enables loop antenna designs and single-slit antenna tuning via controlled input capacitance |
| TP1 | Test pad 1 | Pre-dicing probe point for wafer-level functional test; electrically isolated post-dicing and not used in final inlay |
| TP2 | Test pad 2 | Pre-dicing probe point for wafer-level functional test; electrically isolated post-dicing and not used in final inlay |
Key Features
| Feature | Design Value |
|---|---|
| Tag Power Indicator | Enables reader-side power qualification before WRITE - prevents failed encoding attempts in marginal RF fields |
| Pre-serialized 96-bit EPC | Reduces in-line encoding overhead by eliminating full EPC programming; only SKU portion (58 bits) requires field writing |
| Product Status Flag (PSF) | Single-bit EAS alarm flag in TID bank - allows standalone electronic article surveillance without backend database lookup |
| Parallel Encoding Mode | Brings multiple tags to OPEN state simultaneously using SELECT on bit 202h - cuts bulk encoding time by orders of magnitude |
| Broadband Antenna Compatibility | Supports single-slit antenna design with tunable input capacitance - simplifies global label manufacturing across regional frequency bands |
Applications
| Retail Inventory Management | Supply Chain Visibility |
|---|---|
Use Scenario: High-speed scanning of apparel SKUs during receiving, floor replenishment, and cycle counts in multi-level retail distribution centers. IC Role / Device Role / Timing Role: Passive UHF RFID transponder providing EPC-encoded item-level identification and anti-collision response in dense reader environments. Use Value: Achieves >99.9% inventory accuracy at 3–5 m read distance using standard gate readers, enabled by -21 dBm sensitivity and broadband antenna compatibility. |
Use Scenario: Real-time pallet and case tracking across cross-dock facilities, 3PL warehouses, and import/export customs checkpoints. IC Role / Device Role / Timing Role: Gen2-compliant tag IC enabling standardized EPC data exchange between ERP, WMS, and RFID middleware systems. Use Value: Delivers deterministic read performance in metal-rich and high-interference logistics zones due to high interference rejection and stable TID serialization. |
| Loss Prevention (EAS) | Asset Tracking |
Use Scenario: Exit gate detection of unauthorized removal of high-value cosmetics, electronics, or luxury goods in brick-and-mortar stores. IC Role / Device Role / Timing Role: Electronic Article Surveillance tag leveraging integrated Product Status Flag (PSF) bit for local alarm triggering without cloud dependency. Use Value: Eliminates need for separate EAS hard tags - PSF bit activation enables dual-use RFID/EAS functionality on single inlay. |
Use Scenario: Reusable IT equipment tagging (laptops, monitors, docking stations) across corporate campuses with multi-year lifecycle requirements. IC Role / Device Role / Timing Role: Industrial-grade RFID IC supporting 100,000+ write cycles and -40 °C to +85 °C operation for repeated checkout/check-in events. Use Value: Ensures long-term data integrity and mechanical reliability in high-handling-volume environments, validated by 120 μm die thickness and Au bump shear strength >70 MPa. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar UHF RFID transponder applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SL3S1204FUD/BG1 | Identical die design but on 8-inch wafer; same 120 μm thickness, 7 μm polyimide spacer, and 60 × 60 μm Au bumps | Lower die yield per wafer (126,524 vs. 264,696); suitable for lower-volume or legacy 8-inch fabrication lines | Select SL3S1204FUD/BG1 only when existing tooling or supply chain constraints require 8-inch wafer format |
| SL3S1204FTB0/1 | Same UCODE 7 core in SOT886 plastic package (1 × 1.45 × 0.5 mm); includes RF1/RF2 pins plus four n.c. terminals | Enables direct PCB mounting or module integration; eliminates wafer dicing and antenna bonding steps required for SL3S1204FUD2/BG1BZ | Choose SL3S1204FTB0/1 for prototyping, embedded modules, or applications needing mechanical robustness over inlay flexibility |
Compared with SL3S1204FUD/BG1 and SL3S1204FTB0/1, SL3S1204FUD2/BG1BZ offers highest die throughput (264,696 good dies/wafer), optimized for high-volume inlay production on 12-inch lines, while retaining identical RF performance, memory structure, and feature set - making it the preferred choice for global RFID label manufacturers scaling retail apparel deployments.
Availability
SL3S1204FUD2/BG1BZ is available at Aetrix Electronics and suitable for retail inventory management, supply chain visibility, and loss prevention applications requiring stable component supply, wafer-level traceability, and long-term EPC Gen2 compliance.
Supply support for SL3S1204FUD2/BG1BZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions, with core expertise in RFID, NFC, automotive MCUs, and secure authentication ICs.
The UCODE product line delivers high-performance, standards-compliant UHF RFID ICs designed specifically for demanding item-level tagging in retail, logistics, and industrial asset tracking - emphasizing sensitivity, encoding speed, and global regulatory adaptability.
FAQ
What is the wafer specification for SL3S1204FUD2/BG1BZ?
SL3S1204FUD2/BG1BZ is supplied on a 300 mm (12-inch) silicon wafer, 120 μm ± 15 μm thick, with 7 μm ± 1 μm polyimide spacer. It features four gold bumps (60 × 60 μm) at chip corners: RF1, RF2, TP1, and TP2. The die size is 0.490 mm × 0.445 mm, and potential good die count per wafer is 264,696. SL3S1204FUD2/BG1BZ uses CMOS 0.14 μm technology and includes scribe line widths of 35 μm.
Does SL3S1204FUD2/BG1BZ support EPC Gen2 v2.0?
Yes, SL3S1204FUD2/BG1BZ is EPC Gen2 v2.0 ready and fully implements all mandatory commands from EPCglobal UHF Class-1 Generation-2 v1.2.0, including Kill and (Perma)Lock. It also supports optional commands Access and BlockWrite (32-bit), and its UCODE 7–specific features - such as Tag Power Indicator and Parallel Encoding - operate via standard EPC READ/WRITE/SELECT commands without requiring custom firmware.
How does the Tag Power Indicator function in SL3S1204FUD2/BG1BZ?
The Tag Power Indicator in SL3S1204FUD2/BG1BZ is activated by issuing a SELECT command to address 204h in the EPC memory bank. Upon execution, the IC performs an internal power check: if received RF power exceeds nominal write sensitivity minus 1 dB, the SELECT matches and the tag proceeds; otherwise, it does not match. This allows readers to filter tags with insufficient power before attempting WRITE, preventing encoding failures in weak-field zones.
What memory banks and capacities does SL3S1204FUD2/BG1BZ provide?
SL3S1204FUD2/BG1BZ implements three EPCglobal-defined memory banks: Bank 00 (64-bit reserved memory for KILL and ACCESS passwords), Bank 01 (128-bit EPC memory plus 16-bit UCODE 7 Configuration Word), and Bank 10 (96-bit factory-locked TID containing a 48-bit unique serial number). No user memory is provided. The EPC bank supports up to 128 bits, and the TID is permanently locked at wafer sort.
Can SL3S1204FUD2/BG1BZ be used for Electronic Article Surveillance (EAS)?
Yes, SL3S1204FUD2/BG1BZ includes an integrated Product Status Flag (PSF) bit located in the TID bank. When set, this permanent bit enables the tag to function as an EAS device without requiring backend database lookup or external alarm logic - ideal for exit gate detection in retail loss prevention systems. The PSF bit is toggled using standard EPC WRITE commands and remains persistent after power cycling.
SL3S1204FUD2/BG1BZ Specifications
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SL3S1204FUD2/BG1BZ FAQ
1.How can I place an order for SL3S1204FUD2/BG1BZ through Aetrix?
Please submit a Request for Quotation (RFQ) for SL3S1204FUD2/BG1BZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SL3S1204FUD2/BG1BZ reliable?
The price and inventory of SL3S1204FUD2/BG1BZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SL3S1204FUD2/BG1BZ is usually 5 days.
3.What payment methods are accepted for SL3S1204FUD2/BG1BZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SL3S1204FUD2/BG1BZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SL3S1204FUD2/BG1BZ?
SL3S1204FUD2/BG1BZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SL3S1204FUD2/BG1BZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SL3S1204FUD2/BG1BZ?
For technical support, including SL3S1204FUD2/BG1BZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SL3S1204FUD2/BG1BZ requirements.
6.How does Aetrix verify that SL3S1204FUD2/BG1BZ is sourced from the original manufacturer or authorized distributors?
All SL3S1204FUD2/BG1BZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SL3S1204FUD2/BG1BZ meets industry standards.
7.What is the process for return or replacement of SL3S1204FUD2/BG1BZ?
All SL3S1204FUD2/BG1BZ units undergo pre-shipment inspection (PSI). If there is an issue with SL3S1204FUD2/BG1BZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SL3S1204FUD2/BG1BZ part is unused and in its original packaging.
Return procedure for SL3S1204FUD2/BG1BZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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