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NXP Semiconductors SL3S1204FUD/BG1V
- Part No.:
- SL3S1204FUD/BG1V
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- -
- Datasheet:
-
SL3S1204FUD/BG1V.pdf
- Description:
- IC UCODE SMART LABEL UNCASED
- Quantity:
- Payment:
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Inventory:2,153
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Product details
Overview
SL3S1204FUD/BG1V from NXP Semiconductors is a UCODE 7 EPC Gen2 v2.0-compliant UHF RFID IC in bumped die wafer form, designed for high-performance retail and fashion inventory tagging. It delivers -21 dBm read sensitivity, -16 dBm write sensitivity, pre-serialized 96-bit EPC with factory-locked 48-bit TID serial number, and supports parallel encoding of 100 items in 60 ms for dense-label initialization.
For engineers reviewing the SL3S1204FUD/BG1V datasheet, SL3S1204FUD/BG1V pinout, SL3S1204FUD/BG1V application, or SL3S1204FUD/BG1V equivalent, this page provides verified technical context, wafer-level packaging details, memory architecture, EAS-ready Product Status Flag functionality, and real-world deployment guidance for apparel logistics and supply chain management systems.
Technical Context
The SL3S1204FUD/BG1V implements a fully compliant EPCglobal Class-1 Generation-2 UHF RFID air interface (860–960 MHz), with analog RF front-end optimized for broadband global operation and high interference rejection. Its digital control block executes mandatory commands (Kill, PermaLock) and optional ones (Access, BlockWrite), while supporting standard FM0 and Miller subcarrier modulation schemes.
Memory is organized across three banks: 64-bit reserved (kill/access passwords), 128-bit EPC (including configuration word at 200h), and 96-bit permalocked TID with extended 48-bit serial number. Feature activation-including Tag Power Indicator and Parallel Encoding-is performed via SELECT commands targeting specific bits (202h, 204h) in the EPC bank configuration word, requiring no custom firmware.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Read sensitivity | -21 dBm: enables longest possible read range under low-field conditions in retail environments |
| Write sensitivity | -16 dBm: allows reliable encoding at greater distances or through challenging materials |
| EPC memory size | Up to 128 bits: supports full EPC Gen2 v2.0 data structures including extended headers and SKU fields |
| TID structure | 96-bit factory-locked: includes 48-bit unique serial number for unalterable product traceability |
| Parallel encoding speed | 100 items in 60 ms: reduces bulk tag initialization time by >90% vs. sequential encoding |
| Operating temperature | -40 °C to +85 °C: ensures stable performance across warehouse, distribution, and retail point-of-sale conditions |
| Write endurance | 100,000 cycles: supports repeated re-encoding during asset lifecycle without memory degradation |
Pinout & Package
SL3S1204FUD/BG1V is supplied as a bumped die on an 8-inch, 120 μm-thick silicon wafer with 7 μm polyimide spacer. Die dimensions are 0.490 mm × 0.445 mm; four gold bumps (RF1, RF2, TP1, TP2) are located at chip corners. TP1 and TP2 are electrically disconnected after dicing and serve only for wafer-level test.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RF1 | Antenna connector 1 | Primary RF input/output terminal for bidirectional UHF communication; forms half of differential antenna interface |
| RF2 | Antenna connector 2 | Secondary RF input/output terminal; enables loop antenna designs and impedance tuning flexibility |
| TP1 | Test pad 1 | Wafer-level probe point for electrical testing; electrically isolated post-dicing |
| TP2 | Test pad 2 | Wafer-level probe point for electrical testing; electrically isolated post-dicing |
Key Features
| Feature | Design Value |
|---|---|
| Tag Power Indicator | Enables reader-side power-aware selection: tags respond only when sufficient RF field strength exists for reliable write operations |
| Pre-serialized 96-bit EPC | Reduces encoder overhead by shipping with EPC pre-loaded using TID's 48-bit serial number-only SKU header requires field programming |
| Product Status Flag (PSF) | Single-bit EAS alarm flag in TID bank allows electronic article surveillance without backend database lookup or external sensors |
| Single-slit antenna compatibility | Supports mechanically robust, process-tolerant antenna attachment-ideal for high-speed label conversion lines |
| Symmetric RF inputs | Minimizes sensitivity to antenna alignment variation during inlay lamination, improving yield in mass production |
Applications
| Retail Inventory Management | Supply Chain Visibility |
|---|---|
Use Scenario: Real-time stock counting across multi-level apparel racks in fast-fashion stores using handheld UHF readers. IC Role / Device Role / Timing Role: Passive UHF RFID tag IC providing EPC-based item identification and anti-collision response during dense population reads. Use Value: Achieves >99.5% inventory accuracy at 3–5 m range due to -21 dBm read sensitivity and broadband RF design. | Use Scenario: Pallet-level tracking from distribution center to store backroom using fixed-mount gate readers. IC Role / Device Role / Timing Role: EPC Gen2 v2.0-compliant transponder enabling simultaneous interrogation of 200+ tagged SKUs per second. Use Value: Parallel encoding cuts pallet labeling time from minutes to seconds, accelerating outbound logistics throughput. |
| Loss Prevention (EAS) | Asset Lifecycle Tracking |
Use Scenario: Exit gate detection in cosmetics retail where unauthorized removal triggers audible alarm. IC Role / Device Role / Timing Role: Electronic Article Surveillance tag leveraging integrated Product Status Flag bit for local alarm state storage. Use Value: Eliminates need for separate EAS hard tags or backend database queries-alarm status persists independently. | Use Scenario: Reusable garment hangers tracked across multiple seasons in rental fashion services. IC Role / Device Role / Timing Role: High-endurance RFID IC supporting 100,000+ write cycles for repeated checkout/check-in logging. Use Value: Factory-locked 48-bit TID serial number ensures immutable identity across 5+ years of reuse and cleaning cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar UHF RFID tag IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SL3S1204FTB0/1 | Same UCODE 7 core but in SOT886 plastic package (1 × 1.45 × 0.5 mm); RF1/RF2 routed to pins 6/1; no test pads | Designed for surface-mount assembly on printed labels or flexible PCBs-not wafer-level inlay integration | Select SL3S1204FTB0/1 for pre-packaged, ready-to-mount solutions; SL3S1204FUD/BG1V for custom antenna bonding on foil or film substrates |
| SL900A | Temperature/ambient sensor-enabled RFID IC with 128-bit user memory; lower read sensitivity (-18 dBm); different memory map and command set | Targeted at cold-chain monitoring and condition-sensitive logistics-not optimized for pure high-speed inventory | Choose SL900A only when environmental sensing is required; SL3S1204FUD/BG1V remains superior for pure speed, range, and EAS functionality |
Compared with SL3S1204FTB0/1, SL3S1204FUD/BG1V offers direct wafer-level integration for maximum antenna design freedom and cost efficiency in high-volume label production; compared with SL900A, it delivers 3 dB better read sensitivity and dedicated EAS features without sensor overhead-making it the optimal choice for retail inventory and loss prevention.
Availability
SL3S1204FUD/BG1V is available at Aetrix Electronics and suitable for retail inventory management, supply chain visibility, and electronic article surveillance applications requiring stable component supply across global manufacturing sites.
Supply support for SL3S1204FUD/BG1V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 30 years of RFID innovation.
The UCODE product line was engineered specifically for high-throughput, high-reliability UHF RFID tagging in apparel, retail, and logistics-prioritizing read range, encoding speed, and mechanical robustness in thin-film inlays.
FAQ
What is the primary function of the SL3S1204FUD/BG1V in an RFID system?
The SL3S1204FUD/BG1V serves as a passive UHF RFID transponder IC compliant with EPC Gen2 v2.0 standards. It receives power and commands wirelessly from an interrogator, stores and returns EPC and TID data, and supports advanced features like parallel encoding and electronic article surveillance. Its role is foundational in enabling item-level visibility across retail and supply chain applications.
Does the SL3S1204FUD/BG1V include user-programmable memory beyond EPC and TID?
No, the SL3S1204FUD/BG1V does not include user memory. Its memory is strictly allocated to reserved space (64-bit kill/access passwords), EPC (up to 128 bits), and TID (96-bit factory-locked identifier). All memory banks follow EPCglobal Class-1 Generation-2 specifications, and no additional user-accessible memory is implemented in the SL3S1204FUD/BG1V design.
How is the Product Status Flag (PSF) implemented in the SL3S1204FUD/BG1V?
The Product Status Flag is a permanent bit (bit 15) located in the UCODE 7 Configuration Word at EPC memory address 20Fh. When set to "1", it signals active EAS alarm state. The SL3S1204FUD/BG1V stores this flag locally-no backend database or network connection is required for exit gate detection or theft deterrence functionality.
Can the SL3S1204FUD/BG1V be used with single-slit antennas, and why is that beneficial?
Yes, the SL3S1204FUD/BG1V is explicitly designed for single-slit antenna compatibility. This configuration improves mechanical stability during high-speed label conversion, reduces sensitivity to process variation in antenna alignment, and simplifies impedance tuning-directly increasing yield and consistency in mass-produced RFID inlays.
What wafer-level specifications define the SL3S1204FUD/BG1V's physical integration?
The SL3S1204FUD/BG1V is delivered on an 8-inch, 120 μm-thick silicon wafer with 7 μm polyimide spacer. It features four 60 × 60 μm gold bumps (RF1, RF2, TP1, TP2) at chip corners, 403 μm RF1–RF2 pitch, and CMOS 0.14 μm process technology. TP1/TP2 are electrically disconnected after dicing and serve wafer-probe-only functions.
SL3S1204FUD/BG1V Specifications
- Product attributes
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- NXP Semiconductors
- Series:
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- Bulk
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- Last Time Buy
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SL3S1204FUD/BG1V FAQ
1.How can I place an order for SL3S1204FUD/BG1V through Aetrix?
Please submit a Request for Quotation (RFQ) for SL3S1204FUD/BG1V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SL3S1204FUD/BG1V reliable?
The price and inventory of SL3S1204FUD/BG1V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SL3S1204FUD/BG1V is usually 5 days.
3.What payment methods are accepted for SL3S1204FUD/BG1V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SL3S1204FUD/BG1V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SL3S1204FUD/BG1V?
SL3S1204FUD/BG1V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SL3S1204FUD/BG1V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SL3S1204FUD/BG1V?
For technical support, including SL3S1204FUD/BG1V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SL3S1204FUD/BG1V requirements.
6.How does Aetrix verify that SL3S1204FUD/BG1V is sourced from the original manufacturer or authorized distributors?
All SL3S1204FUD/BG1V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SL3S1204FUD/BG1V meets industry standards.
7.What is the process for return or replacement of SL3S1204FUD/BG1V?
All SL3S1204FUD/BG1V units undergo pre-shipment inspection (PSI). If there is an issue with SL3S1204FUD/BG1V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SL3S1204FUD/BG1V part is unused and in its original packaging.
Return procedure for SL3S1204FUD/BG1V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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