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NXP Semiconductors SL3S1204FUD/BG1Z
- Part No.:
- SL3S1204FUD/BG1Z
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- -
- Datasheet:
-
SL3S1204FUD/BG1Z.pdf
- Description:
- IC UCODE SMART LABEL UNCASED
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Inventory:4,482
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Product details
Overview
SL3S1204FUD/BG1Z from NXP Semiconductors is a UCODE 7 EPC Gen2 v2.0–compliant passive UHF RFID IC in bumped die wafer form, featuring -21 dBm read sensitivity, -16 dBm write sensitivity, pre-serialized 96-bit EPC, and integrated Tag Power Indicator for optimized tag initialization in high-density encoding environments.
For engineers reviewing the SL3S1204FUD/BG1Z datasheet, SL3S1204FUD/BG1Z pinout, SL3S1204FUD/BG1Z application, or SL3S1204FUD/BG1Z equivalent, this page delivers verified technical context, wafer-level package mapping, memory architecture details, EAS-ready Product Status Flag support, and real-world retail inventory and loss prevention implementation guidance - all grounded in NXP's Rev. 4.0 product data sheet.
Technical Context
The SL3S1204FUD/BG1Z implements a CMOS 0.14 μm analog/digital/EEPROM architecture with RF1/RF2 antenna interface, rectifier-based power harvesting, and backscatter modulation compliant with EPCglobal Class-1 Generation-2 (860–960 MHz). Its digital control block handles anticollision, protocol state machines, and EEPROM access for EPC, TID, and configuration word operations.
It supports mandatory EPC Gen2 v1.2.0 commands (Kill, (Perma)Lock), optional BlockWrite (32-bit), ACCESS, and reader-triggered features via standard SELECT on EPC bank address 200h–20Fh - including Parallel Encoding (bit 202h) and Tag Power Indicator (bit 204h), both requiring no custom firmware but reader-side EPC Gen2 v2.0 readiness for full utilization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Read sensitivity | -21 dBm: enables longest possible read range under regulatory limits for compact retail tags |
| Write sensitivity | -16 dBm: allows reliable encoding at lower field strength, reducing reader power requirements |
| EPC memory size | Up to 128 bits: supports full EPC Gen2 v2.0 encoding including extended headers and SKU fields |
| TID memory | 96-bit factory-locked: includes 48-bit unique serial number for unalterable device traceability |
| Operating temperature | -40 °C to +85 °C: validated for warehouse, logistics, and retail shelf environments |
| Write endurance | 100,000 cycles: ensures reliability across repeated re-encoding in reusable asset tagging |
| Die size | 0.490 mm × 0.445 mm: ultra-small footprint enabling high-density wafer-level packaging and thin label integration |
Pinout & Package
SL3S1204FUD/BG1Z is supplied as a 120 μm-thick bumped die on an 8-inch sawn wafer with 7 μm polyimide spacer, four gold bumps (RF1, RF2, TP1, TP2), and non-diagonal corner pad placement. TP1 and TP2 are electrically disconnected after dicing and serve only for wafer-level test.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RF1 | Antenna connector 1 | Main RF input/output terminal; connects to one side of loop or dipole antenna structure |
| RF2 | Antenna connector 2 | Second RF terminal enabling DC-coupled loop antenna designs and impedance tuning flexibility |
| TP1 | Test pad 1 | Wafer-level probe point; electrically isolated post-dicing and not used in final tag assembly |
| TP2 | Test pad 2 | Wafer-level probe point; electrically isolated post-dicing and not used in final tag assembly |
Key Features
| Feature | Design Value |
|---|---|
| Parallel encoding mode | Encodes 100 tags in 60 ms by synchronizing OPEN-state transition via SELECT on bit 202h - eliminates sequential timing overhead |
| Tag Power Indicator | Enables reader-side power screening before WRITE: SELECT on bit 204h returns match/non-match based on real-time chip voltage margin |
| Pre-serialized 96-bit EPC | Factory-programmed EPC includes 48-bit TID serial number, reducing on-site encoding to SKU-only writes and accelerating label personalization |
| Product Status Flag (PSF) | Single-bit EAS alarm flag (bit 20Fh) allows standalone electronic article surveillance without backend database lookup |
| Single-slit antenna compatibility | Optimized input capacitance enables mechanically stable, low-cost antenna bonding with reduced process variation sensitivity |
Applications
| Apparel Retail Inventory | FMCG Supply Chain Tracking |
|---|---|
Use Scenario: High-speed scanning of garment racks containing 50+ tagged items per shelf during stock audits. IC Role / Device Role / Timing Role: Passive UHF RFID transponder providing EPC Gen2-compliant backscatter response with anti-collision handling. Use Value: -21 dBm read sensitivity enables detection through folded fabric layers; pre-serialized EPC cuts encoding time by >60% during label-on-tag personalization. |
Use Scenario: Bulk pallet-level identification at distribution center gates with mixed-SKU cartons. IC Role / Device Role / Timing Role: EPC memory host storing GS1-compliant GTIN + batch/lot data; TID provides immutable origin traceability. Use Value: Parallel encoding allows simultaneous initialization of 100+ tags on a roll; PSF bit enables EAS activation at packing line without ERP integration. |
| Electronic Article Surveillance | Reusable Asset Management |
Use Scenario: Exit gate monitoring in jewelry stores where high-value items require real-time theft deterrence. IC Role / Device Role / Timing Role: Standalone EAS tag using Product Status Flag (bit 20Fh) to signal alarm state without cloud or database dependency. Use Value: Eliminates need for separate EAS hard tags; PSF bit toggles via standard EPC WRITE command, enabling remote deactivation at checkout. |
Use Scenario: Reusable plastic totes moving between manufacturing cells with repeated wash/disinfection cycles. IC Role / Device Role / Timing Role: Robust UHF transponder surviving 100,000 write cycles and -40 °C to +85 °C thermal cycling. Use Value: 120 μm die thickness with 7 μm polyimide spacer reduces antenna coupling drift; symmetric RF inputs maintain read reliability after mechanical stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar UHF RFID IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SL3S1204FTB0/1 | XSON6 packaged version (1.0 × 1.45 × 0.5 mm); includes same UCODE 7 core, memory map, and features but in ready-to-mount plastic package | Suitable for discrete tag assembly with pick-and-place; requires no wafer dicing or bumping process | Select SL3S1204FTB0/1 when prototyping or low-volume tag production demands surface-mount simplicity over wafer-level cost optimization. |
| SL900A | Temperature-sensing RFID IC with integrated sensor, 2 kB user EEPROM, and different memory map; lacks PSF and parallel encoding features | Targeted at cold-chain monitoring and condition-based asset tracking, not pure inventory or EAS use cases | Choose SL900A only when ambient temperature logging is required; SL3S1204FUD/BG1Z remains optimal for high-speed retail encoding and EAS functionality. |
Compared with SL3S1204FTB0/1, SL3S1204FUD/BG1Z offers wafer-level cost efficiency and design flexibility for high-volume label converters, while SL900A trades EPC Gen2 optimization for sensor integration - making SL3S1204FUD/BG1Z the sole choice for EAS-enabled, bulk-encoded retail RFID deployments.
Availability
SL3S1204FUD/BG1Z is available at Aetrix Electronics and suitable for retail inventory management, supply chain tracking, electronic article surveillance, and reusable asset tagging requiring stable component supply across global wafer fabrication and label conversion programs.
Supply support for SL3S1204FUD/BG1Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions, with core expertise in RFID, NFC, automotive MCUs, and secure authentication ICs.
The UCODE product line - including SL3S1204FUD/BG1Z - is engineered specifically for high-performance, globally compliant UHF RFID tagging in demanding retail, logistics, and loss prevention applications.
FAQ
What is the primary function of the SL3S1204FUD/BG1Z in an RFID system?
The SL3S1204FUD/BG1Z serves as a passive UHF RFID transponder IC that receives power and commands from an interrogator via RF field coupling, executes EPC Gen2 v1.2.0/v2.0 protocols, stores EPC and TID data in factory-locked memory, and backscatters responses for identification, inventory, and EAS functions. Its role is strictly defined by its analog interface, digital control logic, and EEPROM architecture - no microcontroller or active circuitry is present.
Does the SL3S1204FUD/BG1Z include user-accessible memory beyond EPC and TID banks?
No, the SL3S1204FUD/BG1Z does not include user memory. Its memory organization consists solely of three EPCglobal-defined banks: Bank 00 (64-bit reserved for kill/access passwords), Bank 01 (128-bit EPC plus 16-bit configuration word), and Bank 10 (96-bit factory-locked TID). All memory is accessed exclusively via standard EPC READ/WRITE/ACCESS commands - no additional user RAM or flash is implemented.
How is the Product Status Flag (PSF) implemented in the SL3S1204FUD/BG1Z?
The Product Status Flag is a single permanent bit located at EPC bank address 20Fh. It is toggled using a standard EPC WRITE command (not BlockWrite) when the EPC memory is unlocked or in SECURED state. Once set, it signals EAS alarm status to compatible readers without requiring backend database lookup - enabling true standalone electronic article surveillance functionality directly within the SL3S1204FUD/BG1Z.
What wafer specifications define the SL3S1204FUD/BG1Z physical form factor?
The SL3S1204FUD/BG1Z is delivered as a 120 μm ± 15 μm thick silicon die on an 8-inch sawn wafer with 7 μm polyimide spacer, 60 × 60 μm gold bumps (RF1, RF2, TP1, TP2), 403.0 μm RF1–RF2 pad-to-pad distance, and 0.490 mm × 0.445 mm die dimensions. TP1 and TP2 are electrically disconnected after dicing and serve wafer-probe only.
Is the SL3S1204FUD/BG1Z compatible with EPC Gen2 v2.0 standards?
Yes, the SL3S1204FUD/BG1Z is explicitly EPC Gen2 v2.0 ready per NXP's Rev. 4.0 datasheet. It supports all mandatory v1.2.0 commands and implements v2.0–enhanced features including Parallel Encoding (via SELECT on address 202h) and Tag Power Indicator (via SELECT on address 204h), both operable using standard EPCglobal READ/WRITE/ACCESS/SELECT commands without proprietary extensions.
SL3S1204FUD/BG1Z Specifications
- Product attributes
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- Manufacturer:
- NXP Semiconductors
- Series:
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- Bulk
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- Last Time Buy
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SL3S1204FUD/BG1Z FAQ
1.How can I place an order for SL3S1204FUD/BG1Z through Aetrix?
Please submit a Request for Quotation (RFQ) for SL3S1204FUD/BG1Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SL3S1204FUD/BG1Z reliable?
The price and inventory of SL3S1204FUD/BG1Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SL3S1204FUD/BG1Z is usually 5 days.
3.What payment methods are accepted for SL3S1204FUD/BG1Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SL3S1204FUD/BG1Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SL3S1204FUD/BG1Z?
SL3S1204FUD/BG1Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SL3S1204FUD/BG1Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SL3S1204FUD/BG1Z?
For technical support, including SL3S1204FUD/BG1Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SL3S1204FUD/BG1Z requirements.
6.How does Aetrix verify that SL3S1204FUD/BG1Z is sourced from the original manufacturer or authorized distributors?
All SL3S1204FUD/BG1Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SL3S1204FUD/BG1Z meets industry standards.
7.What is the process for return or replacement of SL3S1204FUD/BG1Z?
All SL3S1204FUD/BG1Z units undergo pre-shipment inspection (PSI). If there is an issue with SL3S1204FUD/BG1Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SL3S1204FUD/BG1Z part is unused and in its original packaging.
Return procedure for SL3S1204FUD/BG1Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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