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NXP Semiconductors SL3S1204FUD/BGZ
- Part No.:
- SL3S1204FUD/BGZ
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- Die
- Datasheet:
-
SL3S1204FUD/BGZ.pdf
- Description:
- IC RFID TRANSP 840-960MHZ WAFER
- Quantity:
- Payment:
- Shipping:
Inventory:3,441
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Product details
Overview
SL3S1204FUD/BGZ from NXP Semiconductors is a UCODE 7 EPC Gen2 v2.0-compliant passive UHF RFID IC in bumped die wafer form, designed for high-density retail and fashion inventory tagging. It delivers -21 dBm read sensitivity, -16 dBm write sensitivity, pre-serialized 96-bit EPC with factory-locked 48-bit TID serial number, and supports parallel encoding of up to 100 tags in 60 ms.
For engineers reviewing the SL3S1204FUD/BGZ datasheet, SL3S1204FUD/BGZ pinout, SL3S1204FUD/BGZ application, or SL3S1204FUD/BGZ equivalent, this page provides verified technical context, wafer-level packaging details, memory architecture, EAS-enabling Product Status Flag, and reader-side feature activation requirements for bulk encoding and power-aware initialization.
Technical Context
The SL3S1204FUD/BGZ implements a CMOS 0.14 μm analog/digital/EEPROM architecture with RF1 and RF2 antenna terminals, integrated charge pump, and demodulator for passive operation at 860–960 MHz. Its memory map includes Bank 00 (64-bit passwords), Bank 01 (128-bit EPC + 16-bit config word), and Bank 10 (96-bit TID with 48-bit factory-locked serial number).
It supports all mandatory EPCglobal Class-1 Gen2 v1.2.0 commands (Kill, (Perma)Lock) plus optional Access and BlockWrite, with feature control via action bits (202h Parallel Encoding, 204h Tag Power Indicator) and permanent bits (209h max backscatter strength, 20Fh PSF alarm flag) in the EPC bank configuration word.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Read sensitivity | -21 dBm: enables longest possible read range under regulatory limits for dense tag populations |
| Write sensitivity | -16 dBm: allows reliable encoding at lower field strength, reducing reader power requirements |
| EPC memory size | Up to 128 bits: supports full EPC Gen2 v2.0 encoding including extended header and user-defined fields |
| TID structure | 96-bit factory-locked: includes 48-bit unique serial number compliant with GS1 EPC Tag Data Standard 1.6 |
| Parallel encoding speed | 100 items in 60 ms: reduces bulk tag initialization time by >90% vs. sequential encoding |
| Operating temperature | -40 °C to +85 °C: ensures reliability across warehouse, retail, and logistics environments |
| Write endurance | 100,000 cycles: supports repeated re-encoding in reusable asset tracking applications |
Pinout & Package
Bare die in 8-inch wafer format (120 μm thickness) with 4-terminal bump configuration: RF1 and RF2 serve as symmetric antenna connection points; TP1 and TP2 are test pads electrically disconnected after dicing. Polyimide spacer (7 μm) isolates active circuitry from antenna coupling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RF1 | Antenna connector 1 | Primary RF input/output terminal; symmetric with RF2 for balanced impedance matching to single-slit antennas |
| RF2 | Antenna connector 2 | Secondary RF input/output terminal; enables loop antenna designs and improves mechanical stability |
| TP1 | Test pad 1 | Pre-dicing probe point for wafer-level functional testing; electrically isolated post-dicing |
| TP2 | Test pad 2 | Pre-dicing probe point for wafer-level functional testing; electrically isolated post-dicing |
Key Features
| Feature | Design Value |
|---|---|
| Tag Power Indicator | Enables reader-side power validation before write: SELECT on bit 204h returns match only if chip has ≥1 dB margin above -16 dBm write threshold |
| Product Status Flag (PSF) | Single-bit EAS alarm flag (20Fh) allows standalone electronic article surveillance without backend database lookup |
| Pre-serialized 96-bit EPC | Factory-programmed EPC incorporates 48-bit TID serial number, reducing SKU encoding to 58-bit header only |
| Parallel encoding mode | SELECT on bit 202h places multiple tags into OPEN state with handle AAAAh, enabling simultaneous WRITE operations |
| Single-slit antenna compatibility | Symmetric RF1/RF2 inputs and large pad-to-pad distance (403 μm) simplify low-cost, mechanically robust antenna integration |
Applications
| Retail Inventory Management | Supply Chain Visibility |
|---|---|
Use Scenario: High-speed scanning of apparel racks with 50+ tagged items per shelf. IC Role / Device Role / Timing Role: Passive UHF RFID transponder providing EPC Gen2 v2.0 air interface compliance and fast anti-collision response. Use Value: -21 dBm read sensitivity enables reliable detection at >7 m in multi-path retail environments, reducing manual stock checks by 85%. |
Use Scenario: Real-time pallet-level tracking across distribution centers using fixed-mount readers. IC Role / Device Role / Timing Role: Factory-pre-serialized EPC tag enabling zero-configuration deployment and deterministic read/write timing. Use Value: Parallel encoding cuts pallet commissioning time from 120 s to <60 ms per 100 tags, accelerating warehouse throughput. |
| Loss Prevention (EAS) | Asset Lifecycle Tracking |
Use Scenario: Exit gate monitoring in luxury goods stores using dual-antenna EAS portals. IC Role / Device Role / Timing Role: RFID tag with integrated Product Status Flag (PSF) acting as self-contained alarm trigger. Use Value: PSF bit (20Fh) eliminates need for real-time backend database lookup, enabling sub-100 ms alarm decision latency. |
Use Scenario: Reusable tool tagging in automotive manufacturing with 5+ year service life. IC Role / Device Role / Timing Role: High-endurance (100,000 write cycles) UHF tag supporting firmware updates and maintenance logging. Use Value: 48-bit factory-locked TID serial number ensures unambiguous asset identity across ERP, MES, and maintenance systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar UHF RFID IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SL3S1204FTB0/1 | Same UCODE 7 die in SOT886 plastic package (1 × 1.45 × 0.5 mm); RF1/RF2 routed to pins 6/1; 3 n.c. pins | Requires PCB mounting instead of inlay bonding; suited for module integration or prototyping | Select when needing standardized surface-mount footprint rather than wafer-level die attach |
| SL900A | Active sensor RFID IC with integrated temperature sensor, 12-bit ADC, and configurable logging; no pre-serialized EPC | Supports environmental monitoring and event-triggered data capture; not optimized for pure inventory speed | Select when requiring on-tag sensing or data logging beyond EPC/ID storage |
Compared with SL3S1204FTB0/1, SL3S1204FUD/BGZ offers direct wafer-level integration for ultra-thin inlays and lower antenna coupling loss; compared with SL900A, it prioritizes Gen2 read/write speed and EAS functionality over sensor capability-making it optimal for high-volume retail tagging where cost, thinness, and encoding velocity are critical.
Availability
SL3S1204FUD/BGZ is available at Aetrix Electronics and suitable for retail inventory management, supply chain visibility, loss prevention, and asset lifecycle tracking requiring stable component supply across global UHF RFID label production.
Supply support for SL3S1204FUD/BGZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions, with leadership in RFID, NFC, automotive, and secure authentication ICs.
The UCODE product line targets high-performance UHF RFID tagging for retail, logistics, and industrial asset tracking, emphasizing read range, encoding speed, and global regulatory compliance.
FAQ
What is the exact wafer specification for SL3S1204FUD/BGZ?
SL3S1204FUD/BGZ is supplied as a bumped die on an 8-inch, 120 μm thick silicon wafer with 7 μm polyimide spacer. Die dimensions are 0.490 mm × 0.445 mm; RF1–RF2 pad spacing is 403.0 μm; Au bumps measure 60 × 60 μm with 25 μm height (18 μm protruding above spacer). The wafer uses CMOS 0.14 μm process and contains ~126,524 good dies per batch.
Does SL3S1204FUD/BGZ support EPC Gen2 v2.0 fully?
Yes, SL3S1204FUD/BGZ is EPC Gen2 v2.0 ready and implements all mandatory commands (Kill, (Perma)Lock) and optional commands (Access, BlockWrite) per EPCglobal Class-1 Generation-2 v1.2.0 specification. Its 128-bit EPC memory, TID structure, and configuration word enable full v2.0 feature set activation via standard READ/WRITE/SELECT commands.
How does the Tag Power Indicator work in SL3S1204FUD/BGZ?
The Tag Power Indicator in SL3S1204FUD/BGZ is controlled by bit 204h in the EPC configuration word. When a SELECT command targets this bit, the IC performs an internal power check: it returns a match only if received RF power exceeds the nominal -16 dBm write sensitivity by ≥1 dB. This enables readers to filter tags with insufficient power before attempting writes.
Can SL3S1204FUD/BGZ be used for Electronic Article Surveillance (EAS)?
Yes, SL3S1204FUD/BGZ supports EAS via its Product Status Flag (PSF), implemented as permanent bit 20Fh in the EPC configuration word. When set, this flag allows the tag to trigger alarms in EAS portals without requiring real-time backend database queries-enabling standalone, low-latency loss prevention in retail exits.
What is required to enable parallel encoding on SL3S1204FUD/BGZ?
To enable parallel encoding on SL3S1204FUD/BGZ, the reader must issue a SELECT command targeting bit 202h (Parallel Encoding bit) in the EPC configuration word. This places all responding SL3S1204FUD/BGZ tags into OPEN state with handle AAAAh, allowing subsequent WRITE commands to apply simultaneously-reducing bulk encoding time by orders of magnitude.
SL3S1204FUD/BGZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- Die
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- RFID Transponder
- Frequency:
- 840MHz ~ 960MHz
- Standards:
- -
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Wafer
SL3S1204FUD/BGZ FAQ
1.How can I place an order for SL3S1204FUD/BGZ through Aetrix?
Please submit a Request for Quotation (RFQ) for SL3S1204FUD/BGZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SL3S1204FUD/BGZ reliable?
The price and inventory of SL3S1204FUD/BGZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SL3S1204FUD/BGZ is usually 5 days.
3.What payment methods are accepted for SL3S1204FUD/BGZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SL3S1204FUD/BGZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SL3S1204FUD/BGZ?
SL3S1204FUD/BGZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SL3S1204FUD/BGZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SL3S1204FUD/BGZ?
For technical support, including SL3S1204FUD/BGZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SL3S1204FUD/BGZ requirements.
6.How does Aetrix verify that SL3S1204FUD/BGZ is sourced from the original manufacturer or authorized distributors?
All SL3S1204FUD/BGZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SL3S1204FUD/BGZ meets industry standards.
7.What is the process for return or replacement of SL3S1204FUD/BGZ?
All SL3S1204FUD/BGZ units undergo pre-shipment inspection (PSI). If there is an issue with SL3S1204FUD/BGZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SL3S1204FUD/BGZ part is unused and in its original packaging.
Return procedure for SL3S1204FUD/BGZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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