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NXP Semiconductors SL3S1214FUD/BG1Z
- Part No.:
- SL3S1214FUD/BG1Z
- Manufacturer:
- NXP Semiconductors
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- -
- Datasheet:
-
SL3S1214FUD/BG1Z.pdf
- Description:
- IC UCODE SMART LABEL UNCASED
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Inventory:2,364
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Product details
Overview
SL3S1214FUD/BG1Z from NXP Semiconductors is a UHF RFID IC compliant with EPC Gen2 v2.0, designed for passive UHF tag inlays in retail and fashion inventory systems. It delivers -21 dBm read sensitivity, -16 dBm write sensitivity, 32-bit user memory, pre-serialized 96-bit EPC, and integrated Tag Power Indicator for optimized encoding in dense tag environments.
For engineers reviewing the SL3S1214FUD/BG1Z datasheet, SL3S1214FUD/BG1Z pinout, SL3S1214FUD/BG1Z application, or SL3S1214FUD/BG1Z equivalent, this page provides verified technical context, wafer-level package details, memory architecture, parallel encoding behavior, and EAS-ready Product Status Flag implementation - all specific to the SL3S1214FUD/BG1Z bumped die variant on 120 μm wafer with 7 μm polyimide spacer.
Technical Context
The SL3S1214FUD/BG1Z implements a fully EPCglobal Class-1 Generation-2 (v1.2.0) compliant air interface with FM0 and Miller subcarrier modulation support, operating across 840–960 MHz. Its analog front-end includes RF rectification, voltage regulation, and backscatter modulation via dual RF terminals (RF1/RF2), enabling loop antenna designs.
Digital control logic handles anticollision, memory access, and protocol state machines, while EEPROM stores 96-bit TID (with factory-locked 48-bit serial number), up to 128-bit EPC, 32-bit user memory, and a 16-bit configuration word at EPC bank address 200h - where bits 202h (Parallel Encoding) and 204h (Tag Power Indicator) serve as action-triggered features.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Read sensitivity | -21 dBm - enables longest possible read range under standard 2 dBi antenna conditions |
| Write sensitivity | -16 dBm - supports reliable encoding at lower field strength than competing Gen2 chips |
| Memory organization | 96-bit TID (factory locked), 128-bit EPC, 32-bit User Memory, 32-bit Access Password - all mapped per EPCglobal memory bank addressing |
| Parallel encoding speed | 100 items in 60 ms - reduces bulk encoding time by >90% vs. sequential Gen2 writes |
| Tag Power Indicator threshold | -15 dBm - selects only tags receiving sufficient power for successful write, eliminating retries in high-density label rolls |
| Operating temperature | -40 °C to +85 °C - qualified for industrial labeling, warehouse, and apparel logistics environments |
| Write endurance | 100,000 cycles - ensures longevity in reusable asset tracking or reprogrammable packaging applications |
Pinout & Package
SL3S1214FUD/BG1Z is supplied as a bumped bare die on 200 mm (8") wafer, 120 μm thick, with 7 μm polyimide spacer. Die size is 0.490 mm × 0.445 mm. Four gold bumps (60 × 60 μm) are located at chip corners: RF1, RF2, TP1, TP2. TP1 and TP2 are physically disconnected test pads; RF1 and RF2 are symmetric antenna connection terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RF1 | Antenna connector 1 | Primary RF input/output terminal; forms half of differential RF interface for impedance matching to antenna |
| RF2 | Antenna connector 2 | Secondary RF input/output terminal; enables loop antenna design and single-slit assembly when shorted to RF1 via TP1/TP2 |
| TP1 | Test pad 1 | Non-functional mechanical pad; electrically isolated, used for wafer probing and alignment - may be shorted to RF1 without impact |
| TP2 | Test pad 2 | Non-functional mechanical pad; electrically isolated, used for wafer probing and alignment - may be shorted to RF2 without impact |
Key Features
| Feature | Design Value |
|---|---|
| Pre-serialized 96-bit EPC | Factory-programmed with unique 48-bit serial number from TID - eliminates SKU-only encoding step during label personalization |
| Parallel encoding mode | Enables simultaneous write to ≥100 tags using SELECT + QUERY OPEN state - cuts encoding time from seconds to milliseconds |
| Tag Power Indicator | Hardware-based power check triggered at 204h config word - filters out underpowered tags before write attempts, reducing printer timeout errors |
| Product Status Flag (PSF) | Configurable bit at 20Fh - supports EAS alarm activation without backend database lookup or custom reader firmware |
| Single-slit antenna compatibility | TP1/TP2 isolation allows RF1–RF2 shorting - simplifies inlay manufacturing and improves mechanical stability over dual-slit designs |
Applications
| Retail Inventory Management | Supply Chain Visibility |
|---|---|
|
Use Scenario: High-speed scanning of apparel hangtags on moving conveyor belts in distribution centers. IC Role / Device Role / Timing Role: Passive UHF tag IC providing EPC Gen2-compliant identification and fast bulk-write capability. Use Value: Parallel encoding reduces per-tag encoding time from ~100 ms to <1 ms, enabling full carton encoding in under 2 seconds. |
Use Scenario: Real-time pallet-level tracking across multi-tier logistics networks with mixed-reader environments. IC Role / Device Role / Timing Role: EPC Gen2 v1.2.0-compliant transponder with extended TID and robust interference rejection. Use Value: -21 dBm read sensitivity and high interference rejection ensure reliable reads in noisy warehouse RF environments. |
| Electronic Article Surveillance (EAS) | Asset Lifecycle Tracking |
|
Use Scenario: Exit-gate detection of unauthorized merchandise removal in fashion retail stores. IC Role / Device Role / Timing Role: RFID IC with configurable Product Status Flag (PSF) bit for local EAS flagging. Use Value: PSF bit at 20Fh enables EAS activation/deactivation via standard EPC SELECT - no custom command or backend integration required. |
Use Scenario: Reusable textile asset tagging in hospital linen or rental uniform programs. IC Role / Device Role / Timing Role: UHF tag IC with 100,000 write cycles and extended temperature range (-40 °C to +85 °C). Use Value: Industrial-grade endurance and thermal tolerance support >500 wash/dry cycles and autoclave-compatible labeling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar UHF RFID tag IC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SL3S1214FTB0/1 | Same die, packaged in SOT886 (XSON6) with 6-pin layout; RF1/RF2 routed to pins 6/1, four NC pins | Requires PCB mounting instead of inlay bonding; unsuitable for thin-film or paper-based labels | Select SL3S1214FTB0/1 only when surface-mount assembly, automated optical inspection, or reworkability are required |
| SL3S1215FUD/BG1Z | UCODE 7m successor with identical pinout and memory map but enhanced -22 dBm read sensitivity and improved PSF reliability | Backward-compatible drop-in replacement; validated for same antenna designs and encoding workflows | Choose SL3S1215FUD/BG1Z for new designs targeting highest read range or stricter EAS false-alarm requirements |
Compared with SL3S1214FTB0/1, the SL3S1214FUD/BG1Z enables direct wafer-level inlay bonding with no PCB footprint, while SL3S1215FUD/BG1Z offers measurable sensitivity gain without changing antenna tuning or reader firmware - making it the preferred upgrade path for performance-critical deployments.
Availability
SL3S1214FUD/BG1Z is available at Aetrix Electronics and suitable for retail inventory management, supply chain visibility, and electronic article surveillance requiring stable component supply across global wafer fab cycles and long-term inlay production programs.
Supply support for SL3S1214FUD/BG1Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with core expertise in RFID, NFC, and secure authentication ICs.
The UCODE 7m product line - including SL3S1214FUD/BG1Z - was engineered specifically for high-volume, cost-sensitive UHF RFID inlay manufacturing, emphasizing read/write sensitivity, encoding speed, and mechanical robustness in thin-film label formats.
FAQ
What is the primary function of the SL3S1214FUD/BG1Z in an RFID system?
The SL3S1214FUD/BG1Z serves as a passive UHF RFID tag IC compliant with EPC Gen2 v1.2.0, providing wireless identification, data storage (96-bit TID, 128-bit EPC, 32-bit user memory), and advanced features like parallel encoding and Tag Power Indicator. It operates without onboard power, drawing energy from the reader's RF field via its RF1/RF2 terminals.
Does the SL3S1214FUD/BG1Z support EPC Gen2 v2.0?
Yes, the SL3S1214FUD/BG1Z is explicitly documented as "EPC Gen2 v2.0 ready" in its official product data sheet (Rev. 3.4, March 2019). It implements all mandatory commands of EPCglobal Class-1 Generation-2 v1.2.0 and supports optional features including ACCESS, BlockWrite, and Product Status Flag - foundational for v2.0 interoperability.
How does the Tag Power Indicator feature work in the SL3S1214FUD/BG1Z?
The Tag Power Indicator in the SL3S1214FUD/BG1Z is activated by issuing a SELECT command to address 204h in the EPC memory bank. The IC performs an internal power check against a threshold set at -15 dBm (nominal write sensitivity minus 1 dB). Tags with sufficient power respond to the SELECT; others do not - enabling selective encoding in dense label rolls without reader-side signal adjustment.
Can the SL3S1214FUD/BG1Z be used with a single-slit antenna design?
Yes, the SL3S1214FUD/BG1Z supports single-slit antenna assembly because its test pads TP1 and TP2 are physically disconnected. This allows RF1 and RF2 to be shorted together through the antenna structure - simplifying inlay manufacturing, improving mechanical stability, and enabling finer impedance tuning via increased input capacitance (13.5-j195 Ω at 915 MHz).
What is the memory structure of the SL3S1214FUD/BG1Z?
The SL3S1214FUD/BG1Z organizes memory into four EPCglobal-defined banks: Bank 00 (64-bit reserved, including zero-valued kill password), Bank 01 (128-bit EPC + 16-bit configuration word), Bank 10 (96-bit TID with factory-locked 48-bit serial number), and Bank 11 (32-bit user memory). The configuration word at address 200h controls features like parallel encoding (bit 202h) and Tag Power Indicator (bit 204h).
SL3S1214FUD/BG1Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- -
- Frequency:
- -
- Standards:
- -
- Interface:
- -
- Voltage - Supply:
- -
- Operating Temperature:
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- Supplier Device Package:
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SL3S1214FUD/BG1Z FAQ
1.How can I place an order for SL3S1214FUD/BG1Z through Aetrix?
Please submit a Request for Quotation (RFQ) for SL3S1214FUD/BG1Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SL3S1214FUD/BG1Z reliable?
The price and inventory of SL3S1214FUD/BG1Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SL3S1214FUD/BG1Z is usually 5 days.
3.What payment methods are accepted for SL3S1214FUD/BG1Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SL3S1214FUD/BG1Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SL3S1214FUD/BG1Z?
SL3S1214FUD/BG1Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SL3S1214FUD/BG1Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SL3S1214FUD/BG1Z?
For technical support, including SL3S1214FUD/BG1Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SL3S1214FUD/BG1Z requirements.
6.How does Aetrix verify that SL3S1214FUD/BG1Z is sourced from the original manufacturer or authorized distributors?
All SL3S1214FUD/BG1Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SL3S1214FUD/BG1Z meets industry standards.
7.What is the process for return or replacement of SL3S1214FUD/BG1Z?
All SL3S1214FUD/BG1Z units undergo pre-shipment inspection (PSI). If there is an issue with SL3S1214FUD/BG1Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SL3S1214FUD/BG1Z part is unused and in its original packaging.
Return procedure for SL3S1214FUD/BG1Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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