My Inquiry
My Account
onsemi SMS12CT1G
- Part No.:
- SMS12CT1G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- SOT-23-6 Thin, TSOT-23-6
- Datasheet:
-
SMS12CT1G.pdf
- Description:
- TVS DIODE 12VWM 23VC 6TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,085
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SMS12CT1G from onsemi is a 5-line monolithic ESD protection diode array in TSOP-6 package, featuring 12 V reverse working voltage, 15 A peak pulse current (8 × 20 µs), and 19 V clamping voltage at 5 A - designed for transient suppression on high-speed data lines in automotive infotainment and industrial USB/UART interfaces.
For engineers reviewing the SMS12CT1G datasheet, pinout, applications, or equivalent options, key selection criteria include line-to-ground capacitance (120–150 pF), IEC 61000-4-2 compliance (15 kV air / 8 kV contact), common-anode topology, and AEC-Q101 qualification for automotive-grade reliability.
Technical Context
The SMS12CT1G implements a single common-anode, five-cathode ESD protection structure optimized for bidirectional transient suppression across five independent signal lines. Its monolithic silicon design ensures matched clamping characteristics and low leakage (<1 µA at 12 V).
It operates within −40 °C to +150 °C junction temperature range and delivers 350 W peak power dissipation under standardized 8 × 20 µs surge waveforms. The device meets Class 3B HBM (>8 kV) and Class C MM (>400 V) ESD ratings per JEDEC standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRWM | 12 V - maximum continuous DC or peak AC voltage the device blocks without conduction; sets minimum operating voltage margin for protected lines. |
| VBR (min) | 13.3 V - breakdown begins at this voltage under 1 mA test current; defines onset of clamping behavior during transients. |
| VC @ IPP = 5 A | 19 V - clamping voltage measured at 5 A surge current; determines maximum voltage seen by downstream IC during ESD event. |
| IPP (max) | 15 A - maximum non-repetitive peak pulse current survivable under 8 × 20 µs waveform; defines surge energy handling capability. |
| CJ (max) | 150 pF - maximum line-to-ground capacitance at 0 V bias and 1 MHz; impacts signal integrity on high-speed interfaces like USB 2.0. |
| ESD Rating (HBM) | >8000 V - exceeds JEDEC JS-001 Class 3B; qualifies for use in handheld and automotive electronics with human-handling exposure. |
| IEC 61000-4-2 | 15 kV air / 8 kV contact - certified for system-level ESD immunity testing per international EMC standard. |
Pinout & Package
TSOP-6 package (Case 318G), 3.00 mm × 1.50 mm × 0.90 mm body, 0.95 mm lead pitch, Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode (Line 1) | Protected signal path #1; connects to I/O line requiring ESD clamping to common anode (Pin 2). |
| 2 | Anode (Common) | Shared anode node tied to ground or low-impedance return path; enables compact 5-line protection in one package. |
| 3 | Cathode (Line 2) | Protected signal path #2; electrically isolated cathode with matched VBR and VC to Pin 1. |
| 4 | Cathode (Line 3) | Protected signal path #3; identical electrical specs to Pins 1 and 3; supports multi-line interface protection. |
| 5 | Cathode (Line 4) | Protected signal path #4; maintains ≤150 pF capacitance to minimize signal distortion on high-speed traces. |
| 6 | Cathode (Line 5) | Protected signal path #5; completes full 5-line protection set; all cathodes share same VRWM and clamping profile. |
Key Features
| Feature | Design Value |
|---|---|
| Monolithic common-anode architecture | Enables five independent line protections in single TSOP-6 footprint - reduces PCB area vs. discrete diode arrays. |
| 350 W peak power rating (8 × 20 µs) | Supports robust surge immunity in automotive load-dump and industrial EFT environments without thermal runaway. |
| AEC-Q101 qualified | Validated for automotive electronics applications including infotainment, ADAS sensors, and body control modules. |
| UL 94 V-0 flammability rating | Meets safety requirements for enclosed consumer and industrial enclosures where flame propagation must be prevented. |
| Pb-free and RoHS compliant | Complies with global environmental regulations and enables drop-in replacement in legacy and new designs. |
Applications
| Automotive Infotainment Interfaces | Industrial RS-485/UART Ports |
|---|---|
|
Use Scenario: Protecting HDMI, USB, and CAN FD data lines in head unit and display modules against ESD from user interaction and cable hot-plug events. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed between connector and PHY IC; no timing function - purely protective. Use Value: Limits clamped voltage to ≤23 V at 15 A surge, preventing latch-up or gate oxide damage in downstream SerDes and transceivers. |
Use Scenario: Safeguarding RS-485 transceivers and UART lines in programmable logic controllers (PLCs) exposed to field wiring surges and maintenance ESD. IC Role / Device Role / Timing Role: Line-level ESD clamp on differential pair inputs/outputs; zero propagation delay, no signal conditioning. Use Value: Maintains signal integrity with ≤150 pF capacitance while meeting IEC 61000-4-2 Level 4 (8 kV contact) immunity requirements. |
| Notebook Internal I/O Buses | Networking Equipment SFP+ Connectors |
|
Use Scenario: Shielding internal LPC, SMBus, and debug interfaces in thin-and-light notebooks from assembly-line ESD and end-user handling. IC Role / Device Role / Timing Role: Low-capacitance ESD shunt on multi-drop bus lines; operates passively during normal operation. Use Value: Adds <1 µA leakage at 12 V, avoiding bus contention or false wake-up in always-on low-power states. |
Use Scenario: Protecting SFP+ module host-side TX/RX lanes and I2C management bus in 10 GbE switches and routers. IC Role / Device Role / Timing Role: Per-lane ESD protection element placed immediately adjacent to edge connector; no active circuitry. Use Value: Enables 5-line coverage (e.g., TX+, TX−, RX+, RX−, SCL/SDA) in single TSOP-6, saving >2.5 mm² board space vs. discrete solutions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SP1003-01UTG | Single-line TVS (SOD-323), 12 V VRWM, 30 A IPP, 25 pF typical capacitance - lower capacitance but requires five devices for same coverage. | Higher board area, more solder joints, less matched clamping; suitable when ultra-low capacitance (<30 pF) is mandatory per line. | Select SP1003-01UTG only if line-to-line capacitance budget is <30 pF and layout allows discrete placement per line. |
| SMAJ12A | Single-line SMA package TVS, 12 V VRWM, 27.2 V VC @ 10 A, 1000 pF typical CJ - higher clamping voltage and much higher capacitance. | Not suitable for high-speed data lines; used for power rail or low-frequency signal protection only. | Choose SMAJ12A only for DC power input protection or low-bandwidth analog sensor lines where capacitance is not critical. |
Compared with SP1003-01UTG and SMAJ12A, SMS12CT1G uniquely delivers five-line protection with matched parameters, AEC-Q101 qualification, and 120–150 pF capacitance - making it optimal for space-constrained, high-reliability data interface designs.
Availability
SMS12CT1G is available at Aetrix Electronics and suitable for automotive infotainment systems, industrial PLC communication ports, and notebook internal I/O buses requiring stable component supply and long-term lifecycle support.
Supply support for SMS12CT1G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power management, analog, sensing, and connectivity solutions for automotive, industrial, and computing markets.
The SMSxxC series is part of onsemi's transient protection portfolio, engineered specifically for compact, high-density ESD protection of multi-line serial interfaces in harsh electromagnetic environments.
FAQ
What is the maximum operating temperature for SMS12CT1G?
The SMS12CT1G has an operating junction temperature range of −40 °C to +150 °C, enabling reliable operation in under-hood automotive environments and thermally constrained industrial enclosures. This specification is validated per AEC-Q101 stress testing protocols and confirmed in the official onsemi datasheet revision 12.
Does SMS12CT1G support IEC 61000-4-2 Level 4 ESD immunity?
Yes, SMS12CT1G is certified to IEC 61000-4-2 with 15 kV air discharge and 8 kV contact discharge - exceeding Level 4 (8 kV contact) requirements. This rating is explicitly stated in the "Features" section and verified in the "Maximum Ratings" table of the onsemi datasheet.
Can SMS12CT1G be used on USB 2.0 data lines?
Yes, SMS12CT1G is suitable for USB 2.0 D+ and D− lines due to its 120–150 pF line-to-ground capacitance and 19 V clamping voltage at 5 A, which preserves signal integrity while providing robust ESD protection. Its common-anode configuration allows simultaneous protection of both differential lines plus auxiliary signals.
Is SMS12CT1G pin-compatible with other SMSxxCT1G variants?
No - SMS12CT1G shares the same TSOP-6 package and pinout (Pins 1–6 cathodes/anode) with SMS05CT1G, SMS15CT1G, and SMS24CT1G, but VRWM, clamping voltage, and peak current differ per variant. Electrical substitution requires verification of system-level surge margin and capacitance tolerance.
What does the "T1G" suffix indicate in SMS12CT1G?
The "T1G" suffix denotes tape-and-reel packaging (3000 units per reel), Pb-free construction ("G"), and standard TSOP-6 orientation (Pin 1 at lower-left corner). This matches onsemi's ordering convention defined in the "Ordering Information" section of the datasheet.
SMS12CT1G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- SOT-23-6 Thin, TSOT-23-6
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 5
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 12V (Max)
- Voltage - Breakdown (Min):
- 13.3V
- Voltage - Clamping (Max) @ Ipp:
- 23V
- Current - Peak Pulse (10/1000µs):
- 15A (8/20µs)
- Power - Peak Pulse:
- 350W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 120pF @ 1MHz
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-TSOP
SMS12CT1G FAQ
1.How can I place an order for SMS12CT1G through Aetrix?
Please submit a Request for Quotation (RFQ) for SMS12CT1G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SMS12CT1G reliable?
The price and inventory of SMS12CT1G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SMS12CT1G is usually 5 days.
3.What payment methods are accepted for SMS12CT1G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SMS12CT1G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SMS12CT1G?
SMS12CT1G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SMS12CT1G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SMS12CT1G?
For technical support, including SMS12CT1G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SMS12CT1G requirements.
6.How does Aetrix verify that SMS12CT1G is sourced from the original manufacturer or authorized distributors?
All SMS12CT1G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SMS12CT1G meets industry standards.
7.What is the process for return or replacement of SMS12CT1G?
All SMS12CT1G units undergo pre-shipment inspection (PSI). If there is an issue with SMS12CT1G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SMS12CT1G part is unused and in its original packaging.
Return procedure for SMS12CT1G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SMS12CT1G Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
