Infineon Technologies SPB03N60C3ATMA1
- Part No.:
- SPB03N60C3ATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
SPB03N60C3ATMA1.pdf
- Description:
- MOSFET N-CH 650V 3.2A TO263-3
- Quantity:
- Payment:

- Shipping:

Inventory:6,891
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SPB03N60C3ATMA1 from Infineon Technologies is a 600 V, 3.3 A N-channel CoolMOS™ C3 power MOSFET in TO-220FP package, featuring RDS(on) = 1.4 Ω (typ @ Tj = 25°C), ultra-low gate charge (Qg = 12 nC), and 100% avalanche-rated operation; used as a high-voltage switching device in offline SMPS primary-side switches and PFC circuits.
For engineers reviewing the SPB03N60C3ATMA1 datasheet, SPB03N60C3ATMA1 pinout, SPB03N60C3ATMA1 application, or SPB03N60C3ATMA1 equivalent, key selection criteria include its 600 V VDSS, 1.4 Ω RDS(on), 12 nC total gate charge, 100% unclamped inductive switching capability, and thermal resistance RthJC = 2.5 K/W - all critical for high-efficiency, compact AC/DC adapter and industrial power supply designs.
Technical Context
This MOSFET employs Infineon's 3rd-generation CoolMOS™ superjunction technology, enabling high voltage blocking with reduced specific on-resistance and optimized charge profile. Its gate threshold voltage (VGS(th) = 2.5–4.5 V) supports standard 10 V gate drive, while the low Qgd/Qgs ratio improves hard-switching robustness.
The device is fully characterized for repetitive avalanche energy (EAR = 79 mJ @ VDD = 400 V) and features fast body diode recovery (trr = 180 ns, Qrr = 0.52 µC), making it suitable for continuous conduction mode (CCM) PFC and resonant LLC topologies where diode commutation stress is critical.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 600 V - supports universal input (85–265 VAC) offline converters with sufficient margin against line surges and ringing. |
| RDS(on) max | 1.7 Ω @ Tj = 100°C - enables low conduction loss in 30–60 W SMPS primary switches at full load. |
| Qg | 12 nC @ VGS = 0–10 V - reduces gate driver power loss and allows use of low-cost, low-current drivers in cost-sensitive adapters. |
| EAS | 520 mJ - rated for single-pulse unclamped inductive switching, supporting reliable operation without external snubbers in flyback designs. |
| tr/tf | 12/22 ns @ ID = 1.5 A - enables high-frequency switching (>100 kHz) with minimal overlap loss in quasi-resonant controllers. |
| RthJC | 2.5 K/W - allows 3.3 A continuous current with ≤50 K temperature rise over case when mounted on ≥10 cm² copper area. |
Pinout & Package
SPB03N60C3ATMA1 is housed in a TO-220FP (Full-Pak) package with insulated flange, offering creepage/clearance compliance for reinforced insulation in Class II systems. The drain is connected to the flange for direct heatsinking; source and gate are on leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Flange) | High-voltage power output node | Electrically connected to metal flange; must be isolated from chassis unless system ground reference permits. |
| Source | Power return and gate reference | Serves as common reference for gate drive; requires low-inductance layout to minimize dV/dt coupling during switching. |
| Gate | Control terminal | High-impedance input requiring <12 nC charge for full enhancement; sensitive to ESD and requires series gate resistor (≥10 Ω) for oscillation damping. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low gate charge | Qg = 12 nC enables efficient 65–130 kHz operation with minimal driver loss in compact adapters. |
| 100% avalanche-rated | Guaranteed single-pulse EAS = 520 mJ ensures reliability under transient overloads without derating. |
| Optimized body diode | trr = 180 ns and Qrr = 0.52 µC reduce commutation loss and EMI in CCM PFC stages. |
| Thermally enhanced TO-220FP | Insulated flange supports safe mounting on heatsinks without additional isolation pads in double-insulated designs. |
Applications
| AC/DC Adapter Primary Switch | Industrial SMPS Main Switch |
|---|---|
Use Scenario: 36 W universal-input offline flyback converter for medical auxiliary supplies. IC Role / Device Role / Timing Role: High-side main switch operating in DCM/QR mode, switching at 65–100 kHz with peak drain voltage up to 520 V. Use Value: Low RDS(on) and Qg reduce conduction and switching losses, enabling >88% efficiency at full load without active cooling. | Use Scenario: 48 V/5 A industrial open-frame power supply with active PFC front-end. IC Role / Device Role / Timing Role: PFC boost switch in CCM, driven by UCC28070, operating continuously at 65 kHz. Use Value: Fast, soft-recovery body diode minimizes reverse recovery spikes and EMI filter size; 600 V rating accommodates 400 V DC bus with surge margin. |
| LED Driver Primary Switch | UPS Inverter Half-Bridge |
Use Scenario: 25 W constant-current LED driver for street lighting with TRIAC dimming compatibility. IC Role / Device Role / Timing Role: Primary-side switch in quasi-resonant flyback, handling 265 VAC peaks and phase-cut waveforms. Use Value: Avalanche ruggedness prevents failure during dimmer-induced line transients; low Qgd improves zero-voltage switching consistency. | Use Scenario: 1 kVA online UPS inverter stage using discrete half-bridge configuration. IC Role / Device Role / Timing Role: Low-side switch in 16 kHz PWM inverter leg, paired with complementary high-side device. Use Value: 3.3 A continuous rating and 2.5 K/W RthJC support sustained 100% load with passive heatsinking; TO-220FP flange simplifies thermal interface. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP3NK60ZFP | RDS(on) = 2.2 Ω (max), Qg = 14 nC, no specified EAS rating | Lacks guaranteed avalanche ruggedness; less suitable for unclamped inductive loads | Prefer SPB03N60C3ATMA1 where surge immunity and snubberless operation are required. |
| IPP60R190C6 | RDS(on) = 0.19 Ω, Qg = 22 nC, 650 V rating, higher current (6.5 A) | Higher conduction efficiency but larger gate drive demand; over-specified for ≤3.3 A applications | Choose SPB03N60C3ATMA1 for cost-optimized 3–4 A designs where gate drive simplicity and thermal footprint matter. |
Compared with STP3NK60ZFP and IPP60R190C6, SPB03N60C3ATMA1 delivers optimal balance of avalanche ruggedness, gate drive efficiency, and thermal performance in sub-4 A, 600 V primary-side switching - avoiding both under-ruggedness and unnecessary gate drive overhead.
Availability
SPB03N60C3ATMA1 is available at Aetrix Electronics and suitable for AC/DC adapters, industrial SMPS, LED drivers, and UPS inverters requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for SPB03N60C3ATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global manufacturing and R&D infrastructure.
The CoolMOS™ C3 product line targets high-efficiency, high-reliability offline power conversion, emphasizing low gate charge, avalanche robustness, and thermal performance for consumer and industrial SMPS.
FAQ
Is SPB03N60C3ATMA1 suitable for hard-switched PFC applications?
Yes - its 600 V VDSS, 1.4 Ω RDS(on) (typ), and 180 ns body diode trr make it appropriate for continuous conduction mode (CCM) PFC stages up to 100 kHz. The low Qgd/Qgs ratio also improves voltage-dependent switching behavior under high dv/dt conditions typical in boost converters.
What is the maximum continuous drain current at 100°C case temperature?
The datasheet specifies ID = 3.3 A at TC = 100°C. This rating assumes proper PCB copper area (≥10 cm²) and mounting to an adequately sized heatsink. Derating is not required below this temperature, but ambient airflow or thermal interface quality directly impacts achievable current.
Does SPB03N60C3ATMA1 require a negative gate turn-off voltage?
No - its gate threshold voltage (2.5–4.5 V) and positive-only gate drive specification mean it operates reliably with 0 V to +10 V or +12 V gate drive. A negative turn-off voltage is unnecessary and not recommended, as the device lacks negative VGS rating beyond –20 V.
Can SPB03N60C3ATMA1 replace older CoolMOS™ C2 devices in existing designs?
Yes - it is a direct drop-in replacement for SPB03N60C2ATMA1, offering identical pinout, voltage rating, and thermal footprint, plus improved RDS(on) (1.4 Ω vs. 1.6 Ω typ) and lower Qg (12 nC vs. 14 nC). No layout or drive circuit changes are needed for migration.
SPB03N60C3ATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- CoolMOS™
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 650 V
- Current - Continuous Drain (Id) @ 25°C:
- 3.2A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 1.4Ohm @ 2A, 10V
- Vgs(th) (Max) @ Id:
- 3.9V @ 135µA
- Gate Charge (Qg) (Max) @ Vgs:
- 17 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 400 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 38W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TO263-3-2
SPB03N60C3ATMA1 FAQ
1.How can I place an order for SPB03N60C3ATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for SPB03N60C3ATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SPB03N60C3ATMA1 reliable?
The price and inventory of SPB03N60C3ATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SPB03N60C3ATMA1 is usually 5 days.
3.What payment methods are accepted for SPB03N60C3ATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SPB03N60C3ATMA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SPB03N60C3ATMA1?
SPB03N60C3ATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SPB03N60C3ATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SPB03N60C3ATMA1?
For technical support, including SPB03N60C3ATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SPB03N60C3ATMA1 requirements.
6.How does Aetrix verify that SPB03N60C3ATMA1 is sourced from the original manufacturer or authorized distributors?
All SPB03N60C3ATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SPB03N60C3ATMA1 meets industry standards.
7.What is the process for return or replacement of SPB03N60C3ATMA1?
All SPB03N60C3ATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with SPB03N60C3ATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SPB03N60C3ATMA1 part is unused and in its original packaging.
Return procedure for SPB03N60C3ATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SPB03N60C3ATMA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

