STMicroelectronics SPMB250-A1

Overview

SPMB250-A1 from STMicroelectronics is a ready-to-use IEEE 802.15.4-compliant wireless acceleration sensor board integrating the SPZB250 ZigBee® module (based on SN250 SoC) and LIS3LV02DL 3-axis MEMS accelerometer. It delivers ±2 g / ±6 g selectable measurement range, 12-bit digital output, onboard antenna, and operates from 3.6–6 V with standby current as low as 16 μA. Used for remote motion monitoring in industrial wireless sensor networks.

For engineers reviewing the SPMB250-A1 datasheet, SPMB250-A1 pinout, SPMB250-A1 application, or SPMB250-A1 equivalent, this page provides verified board-level specifications, SIF programming interface details, GPIO mapping, RF performance (−92 dBm RX sensitivity, 0 dBm TX power), and mechanical dimensions (49 × 27 × 5 mm) to support rapid prototyping and integration into vibration monitoring systems.

Technical Context

The SPMB250-A1 implements a complete wireless sensing node: the SN250 SoC handles IEEE 802.15.4 PHY/MAC, EMZNET ZigBee® stack execution, and sensor data processing, while the LIS3LV02DL provides configurable full-scale ranges (±2 g / ±6 g) and programmable output data rates up to 40 Hz. All signal conditioning and RF transmission are performed on-board without external components.

Power management includes dedicated ON/OFF switch (SW2), reset push button (SW1), and dual LEDs (L2/L3) driven by SPZB250 GPIOs (P8, P10). The SIF connector (10-pin) exposes SPI signals (MISO/MOSI/CLK), load/reset controls, and PTI debug interface - enabling firmware updates and custom application deployment without soldering.

Key Specifications

Availability

SPMB250-A1 is available at Aetrix Electronics and suitable for industrial predictive maintenance, structural health monitoring, equipment vibration analysis, and wireless condition-based monitoring requiring stable component supply and legacy design continuity.

Supply support for SPMB250-A1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, sensors, power ICs, and wireless solutions for industrial, automotive, and consumer markets.

The SPMB250-A1 belongs to ST's MOTIONBEE™ family of ready-to-use wireless sensor boards, engineered specifically to accelerate development of IEEE 802.15.4-based motion monitoring systems without RF or embedded firmware expertise.

FAQ

What programming interface does SPMB250-A1 use?

The SPMB250-A1 uses the 10-pin SIF connector (J2) to expose SPI signals (SIF_MISO, SIF_MOSI, SIF_CLK), reset (RSTB), load (SIF_LOADB), and PTI debug lines (PTI_EN, PTI_DATA). This interface allows in-system programming of the SN250 SoC with EMZNET ZigBee® stack or custom firmware using Ember-compatible tools.

Does SPMB250-A1 require external antennas or RF components?

No. SPMB250-A1 integrates a Murata ANCV12G44SAA127 chip antenna directly on the PCB. No external RF matching components, baluns, or connectors are needed - the board is fully functional with only a DC power supply applied via J1 (two-pole connector).

How is motion data acquired and transmitted?

The LIS3LV02DL accelerometer digitizes 3-axis acceleration data and streams it to the SPZB250 module via I²C or SPI (per internal routing). The SN250 SoC processes the data and transmits it wirelessly using the EMZNET ZigBee® stack over IEEE 802.15.4, supporting mesh networking and application-layer customization.

What mechanical mounting options does SPMB250-A1 support?

SPMB250-A1 supports both screw-mounting (four corner holes) and SMD soldering via boundary pads (P1–P10). When mounted on metal surfaces, an insulating foil must be placed between board and base to prevent short circuits - per ST's mechanical recommendations in Doc ID 15179 Rev 2.