Vishay Siliconix SQD40N10-25-T4_GE3
- Part No.:
- SQD40N10-25-T4_GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
SQD40N10-25-T4_GE3.pdf
- Description:
- MOSFET N-CH 100V 40A TO252AA
- Quantity:
- Payment:

- Shipping:

Inventory:4,176
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Product details
Overview
SQD40N10-25-T4_GE3 from Vishay Siliconix is an automotive-grade N-channel TrenchFET® power MOSFET rated for 100 V drain-source voltage, 40 A continuous drain current at 25 °C, and 0.025 Ω RDS(on) at VGS = 10 V; it operates up to +175 °C junction temperature and is qualified to AEC-Q101 for engine control, DC-DC converters, and motor drive circuits.
For engineers reviewing the SQD40N10-25-T4_GE3 datasheet, SQD40N10-25-T4_GE3 pinout, SQD40N10-25-T4_GE3 application, or SQD40N10-25-T4_GE3 equivalent, this page delivers verified thermal resistance (RthJC = 1.1 °C/W), gate charge (Qg = 46–70 nC), avalanche energy rating (EAS = 80 mJ), and TO-252 package layout guidance for high-reliability automotive power switching design.
Technical Context
This MOSFET uses trench-gate silicon technology to achieve low on-resistance and fast switching with controlled Qgd/Qgs ratio (13 nC / 8.2 nC typical) for reduced Miller effect and improved hard-switching robustness. Its 100 % UIS-tested construction ensures single-pulse avalanche capability up to 40 A with 80 mJ energy absorption.
The device features a thermally enhanced TO-252 (DPAK) package with drain-connected tab, delivering RthJC = 1.1 °C/W and RthJA = 50 °C/W on 1"² FR4 PCB - enabling high-current operation in constrained under-hood environments without forced cooling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 100 V - supports 48 V and 60 V automotive bus systems with margin against load-dump transients. |
| RDS(on) @ VGS = 10 V | 0.025 Ω max - enables <1 W conduction loss at 20 A, critical for thermally limited ECUs. |
| ID (continuous, TC = 25 °C) | 40 A - sustains peak motor phase currents in 12 V/24 V brushless DC drivers. |
| EAS | 80 mJ - withstands inductive turn-off energy in solenoid and relay driving without snubbers. |
| Qg | 46–70 nC - balances switching speed and gate driver power demand in 20–100 kHz PWM applications. |
| TJ range | −55 to +175 °C - certified for under-hood placement in transmission control modules and battery disconnect units. |
| AEC-Q101 | Qualified - meets stress test requirements for automotive electronics per JESD22 and JESD47 standards. |
Pinout & Package
TO-252AA (DPAK) surface-mount package with exposed drain tab for direct thermal coupling to PCB copper pour; 3-terminal configuration optimized for high-current, low-inductance layouts in automotive power stages.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G (Gate) | Control input | Receives 4.5–20 V logic-level signal; 1.5–2.5 V threshold enables compatibility with 3.3 V and 5 V microcontrollers. |
| D (Drain) | High-side switch node | Connected internally to metal tab; must be soldered to large copper area for thermal and current path integrity. |
| S (Source) | Power return / reference | Serves as local ground reference for gate drive; requires low-impedance connection to minimize shoot-through risk. |
Key Features
| Feature | Design Value |
|---|---|
| TrenchFET® architecture | Delivers 25 % lower RDS(on) vs. planar MOSFETs at same die size, reducing conduction losses in space-constrained modules. |
| 100 % UIS tested | Guarantees avalanche ruggedness per JEDEC JESD24-11, eliminating need for external clamping in inductive load switching. |
| Low RthJC = 1.1 °C/W | Enables >90 % of rated power dissipation to transfer directly from die to heatsink via PCB, supporting compact thermal design. |
| AEC-Q101 qualification | Validated for automotive use including HTOL, TC, UHAST, and ESD testing - required for ASIL-B system components. |
| Drain-connected tab | Provides lowest possible source-to-heatsink thermal path and reduces parasitic inductance in high-di/dt gate drive loops. |
Applications
| Engine Control Unit (ECU) Fuel Injector Driver | Automotive DC-DC Converter Primary Switch |
|---|---|
Use Scenario: High-speed, high-current switching of 12 V fuel injectors with 2–5 ms pulse widths and 10–20 Hz repetition. IC Role / Device Role / Timing Role: Low-side power switch controlling injector coil current; handles repetitive UIS events during de-energization. Use Value: 80 mJ EAS and 175 °C TJ rating ensure reliable operation across ambient temperatures from −40 °C to +125 °C under hood. |
Use Scenario: 20–100 kHz synchronous rectification or primary-side switching in 12 V → 5 V/3.3 V buck converters for ADAS sensors. IC Role / Device Role / Timing Role: Main power switch in non-isolated buck topology; selected for low Qg and RDS(on) to minimize total losses. Use Value: 0.025 Ω RDS(on) at 10 V and 46 nC Qg enable >92 % efficiency at 15 A output with minimal gate drive power. |
| Electric Power Steering (EPS) Motor Phase Switch | 12 V Battery Disconnect Switch |
Use Scenario: Half-bridge leg in three-phase inverter driving 12 V brushed or BLDC assist motors (≤500 W). IC Role / Device Role / Timing Role: High-current, high-reliability N-channel switch operating in PWM mode with bidirectional current flow via body diode. Use Value: 40 A ID rating and 0.9–1.5 V VSD forward drop support regenerative braking and freewheeling without external diodes. |
Use Scenario: Solid-state replacement for mechanical relays in battery management systems, handling 30–40 A continuous load with fault protection. IC Role / Device Role / Timing Role: High-side or low-side main contactor switch; activated during ignition-on and disabled during sleep mode. Use Value: AEC-Q101 qualification and 100 % Rg testing ensure zero latent defects in safety-critical battery isolation functions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel automotive MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL135N10F7 | RDS(on) = 0.0095 Ω @ 10 V (lower), but only rated to 150 °C TJ and not AEC-Q101 qualified. | Preferred for industrial DC-DC where temperature derating is acceptable and automotive qualification is not mandated. | Select STL135N10F7 only if AEC-Q101 compliance is unnecessary and lower RDS(on) justifies higher cost and larger TO-220FP package. |
| IRF3205PbF | RDS(on) = 0.008 Ω @ 10 V, but lacks AEC-Q101 qualification, has higher Qg (71 nC), and only rated to 175 °C with no automotive stress validation. | Suitable for legacy 12 V automotive accessories where qualification documentation is not audited. | Choose IRF3205PbF only for cost-sensitive non-safety applications where full AEC-Q101 traceability is waived by OEM. |
Compared with STL135N10F7 and IRF3205PbF, SQD40N10-25-T4_GE3 uniquely combines AEC-Q101 qualification, 175 °C operation, and validated UIS performance - making it the only option approved for ASIL-B power switching in modern ECU and EPS designs.
Availability
SQD40N10-25-T4_GE3 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, and automotive DC-DC converters requiring stable component supply across extended vehicle lifecycles.
Supply support for SQD40N10-25-T4_GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-reliability MOSFETs, diodes, and optoelectronics for automotive, industrial, and computing markets.
SQD40N10-25-T4_GE3 belongs to Vishay's TrenchFET® Gen IV automotive MOSFET family, engineered specifically for high-current, high-temperature switching in engine bay and chassis-mounted electronic control modules.
FAQ
What is the maximum continuous drain current for SQD40N10-25-T4_GE3 at 125 °C case temperature?
The maximum continuous drain current for SQD40N10-25-T4_GE3 is 26 A at TC = 125 °C, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limitations of the TO-252 package and ensures safe operation within its 1.1 °C/W junction-to-case thermal resistance. Engineers must verify PCB copper area and airflow to sustain this current in real-world conditions.
Is SQD40N10-25-T4_GE3 suitable for high-frequency PWM applications above 50 kHz?
Yes, SQD40N10-25-T4_GE3 supports PWM frequencies up to 100 kHz due to its low total gate charge (46–70 nC) and fast switching times (td(on) = 11–17 ns, tf = 6–9 ns). However, gate driver strength and PCB layout inductance must be optimized to realize these speeds - especially given its 0.9–3.1 Ω gate resistance specification.
Does SQD40N10-25-T4_GE3 include integrated ESD protection on the gate terminal?
No, SQD40N10-25-T4_GE3 does not integrate ESD protection circuitry. Its gate-source leakage is specified at ±100 nA at ±20 V, and the absolute maximum VGS is ±20 V - indicating reliance on external gate resistors and TVS clamps for ESD robustness in automotive harness environments.
Can SQD40N10-25-T4_GE3 replace older Vishay SQD40N10-15 in existing designs?
No - SQD40N10-25-T4_GE3 has higher RDS(on) (0.025 Ω vs. 0.015 Ω) and different gate charge profile than SQD40N10-15. Substitution requires revalidation of thermal performance, switching losses, and gate drive capability; it is not a drop-in replacement despite identical package and pinout.
What is the recommended minimum PCB pad layout for SQD40N10-25-T4_GE3 in TO-252 package?
Vishay recommends a minimum 0.224" × 0.420" (5.69 mm × 10.67 mm) copper pad for the drain tab, with thermal vias spaced ≤1.5 mm apart and filled with solder. The Application Note 826 specifies 2 oz. copper on both sides of FR4, covering ≥75 % of the tab footprint to achieve the rated RthJA = 50 °C/W.
SQD40N10-25-T4_GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET®
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 40A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 25mOhm @ 40A, 10V
- Vgs(th) (Max) @ Id:
- 2.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 70 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3380 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 136W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252AA
SQD40N10-25-T4_GE3 FAQ
1.How can I place an order for SQD40N10-25-T4_GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SQD40N10-25-T4_GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SQD40N10-25-T4_GE3 reliable?
The price and inventory of SQD40N10-25-T4_GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SQD40N10-25-T4_GE3 is usually 5 days.
3.What payment methods are accepted for SQD40N10-25-T4_GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SQD40N10-25-T4_GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SQD40N10-25-T4_GE3?
SQD40N10-25-T4_GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SQD40N10-25-T4_GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SQD40N10-25-T4_GE3?
For technical support, including SQD40N10-25-T4_GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SQD40N10-25-T4_GE3 requirements.
6.How does Aetrix verify that SQD40N10-25-T4_GE3 is sourced from the original manufacturer or authorized distributors?
All SQD40N10-25-T4_GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SQD40N10-25-T4_GE3 meets industry standards.
7.What is the process for return or replacement of SQD40N10-25-T4_GE3?
All SQD40N10-25-T4_GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SQD40N10-25-T4_GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SQD40N10-25-T4_GE3 part is unused and in its original packaging.
Return procedure for SQD40N10-25-T4_GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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