Vishay Siliconix SQD50P03-07-T4_GE3
- Part No.:
- SQD50P03-07-T4_GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
SQD50P03-07-T4_GE3.pdf
- Description:
- MOSFET P-CH 30V 50A TO252AA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SQD50P03-07-T4_GE3 from Vishay Siliconix is an automotive-grade P-channel enhancement-mode MOSFET rated for -30 V drain-source voltage, 50 A continuous drain current at 25 °C, and 0.007 Ω RDS(on) at VGS = -10 V. It features trench-based silicon architecture, AEC-Q101 qualification, and a TO-252 (DPAK) package with drain-connected tab, designed for high-current DC load switching in engine control units and battery disconnect circuits.
For engineers reviewing the SQD50P03-07-T4_GE3 datasheet, SQD50P03-07-T4_GE3 pinout, SQD50P03-07-T4_GE3 application, or SQD50P03-07-T4_GE3 equivalent, key selection criteria include its -55 to +175 °C operating junction temperature range, 125 mJ single-pulse avalanche energy rating, 97 nC total gate charge, and verified 100 % Rg and UIS testing per production lot.
Technical Context
This MOSFET employs Vishay's TrenchFET® process to achieve low on-resistance and fast switching with controlled gate charge distribution. Its negative threshold voltage (-1.5 to -2.5 V) enables direct logic-level drive from 3.3 V or 5 V microcontrollers when used in high-side configurations with appropriate level shifting.
The device integrates a robust body diode with -0.85 V forward voltage at -30 A and supports synchronous rectification in bidirectional power paths. Thermal design is enabled by a 1.1 °C/W junction-to-case resistance and drain-tab thermal interface compatible with PCB copper pour or heatsink mounting.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | -30 V - Maximum blocking voltage in high-side switch applications with 12 V/24 V automotive systems |
| RDS(on) @ VGS = -10 V | 0.007 Ω - Enables <1.8 W conduction loss at 50 A, reducing thermal stress in compact layouts |
| ID (continuous) | -50 A @ TC = 25 °C - Supports high-current loads such as fuel pumps, radiator fans, and solenoid drivers |
| EAS | 125 mJ - Withstands inductive turn-off transients in motor and relay control without external snubbers |
| Qg | 97 nC - Determines gate driver power requirement; compatible with standard 1 A peak gate drivers |
| TJ range | -55 to +175 °C - Validated for under-hood operation in modern ICE and hybrid powertrain modules |
| Ciss | 4390 pF typical - Influences high-frequency switching behavior and EMI profile in PWM-controlled systems |
Pinout & Package
Package: TO-252AA (DPAK), surface-mount, thermally enhanced with exposed drain tab soldered to PCB copper pour. Dimensions: 6.22 mm × 6.73 mm × 2.38 mm (L × W × H); drain tab occupies full rear surface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Source (S) | Current return path for P-channel conduction | Connected to system ground or low-side reference; requires low-inductance routing for fast switching |
| Gate (G) | Control electrode for channel formation | High-impedance input requiring <100 nA leakage; sensitive to ESD and noise-needs local RC filtering |
| Drain (D) | Main current output terminal and thermal interface | Internally bonded to metal tab; must be soldered to ≥1 in² FR-4 copper area for 136 W power dissipation |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive electronics per stress test requirements including HTOL, TC, UHAST, and mechanical shock |
| 100 % Rg and UIS tested | Each production unit verified for gate resistance consistency and unclamped inductive switching robustness |
| TrenchFET® architecture | Delivers 30 % lower RDS(on) vs. planar P-channel MOSFETs of same die size and voltage rating |
| Drain-connected tab | Enables direct thermal coupling to PCB heatsinking-no separate thermal pad or standoff required |
| Lead (Pb)-free and halogen-free | Complies with RoHS Directive 2011/65/EU and JEDEC JS709E material definitions |
Applications
| Engine Control Module (ECM) Load Switching | 12 V Battery Disconnect Management |
|---|---|
Use Scenario: High-side switching of fuel injectors, ignition coils, and idle air control valves in gasoline/diesel ECUs. IC Role / Device Role / Timing Role: P-channel power switch controlling 12 V loads with microcontroller-compatible gate drive via discrete level shifter. Use Value: Low RDS(on) minimizes voltage drop during cranking (6.5–9 V battery), ensuring reliable actuator activation across cold-start conditions. | Use Scenario: Isolation of auxiliary battery banks or backup power domains during vehicle sleep mode or fault conditions. IC Role / Device Role / Timing Role: Bidirectional blocking element in smart battery junction boxes with reverse polarity and short-circuit protection. Use Value: 175 °C junction rating allows uninterrupted operation during under-hood thermal soak (>105 °C ambient), preventing false disconnects. |
| Electric Power Steering (EPS) Motor Driver | Commercial Vehicle HVAC Blower Control |
Use Scenario: Half-bridge high-side switch in EPS motor phase-legs where space-constrained packaging demands low-profile SMT devices. IC Role / Device Role / Timing Role: Complementary switch to N-channel low-side MOSFETs in 3-phase inverter stages driving brushless DC assist motors. Use Value: 125 mJ EAS withstands motor regeneration spikes during emergency stop events without clamping diodes or layout redesign. | Use Scenario: PWM-controlled blower motor speed regulation in Class 8 truck cab HVAC systems with wide input voltage range (9–32 V). IC Role / Device Role / Timing Role: High-current DC switch modulated at 20–25 kHz to reduce audible noise while maintaining torque linearity. Use Value: 97 nC Qg enables efficient gate drive with low-power 3.3 V MCU GPIOs using dual-stage buffer, minimizing driver BOM cost. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF4905PBF | RDS(on) = 0.02 Ω @ -10 V; 175 °C TJ max not AEC-Q101 qualified | Limited to industrial/commercial use; lacks automotive reliability validation and UIS screening | Acceptable for non-automotive prototypes or cost-sensitive non-safety systems where AEC-Q101 is not mandated |
| STP50P03LLH6 | RDS(on) = 0.0085 Ω @ -10 V; TO-220 package; no drain-tab thermal interface | Requires through-hole mounting and external heatsink; unsuitable for dense SMT automotive PCBs | Preferred only when legacy TO-220 footprint compatibility is mandatory and thermal performance via PCB copper is unavailable |
Compared with IRF4905PBF and STP50P03LLH6, SQD50P03-07-T4_GE3 delivers superior thermal efficiency in SMT automotive designs due to its TO-252 drain-tab construction, AEC-Q101 compliance, and lower RDS(on), enabling higher power density without derating.
Availability
SQD50P03-07-T4_GE3 is available at Aetrix Electronics and suitable for engine control modules, battery management systems, and electric power steering subsystems requiring stable component supply across extended automotive product lifecycles.
Supply support for SQD50P03-07-T4_GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-reliability MOSFETs, diodes, and optoelectronics for automotive, industrial, and computing markets.
The SQD50P03-07-T4_GE3 belongs to Vishay's TrenchFET® Automotive P-Channel family, engineered specifically for high-current, high-temperature switching in safety-critical vehicle subsystems where robustness and long-term parametric stability are mandatory.
FAQ
What is the maximum continuous drain current rating for SQD50P03-07-T4_GE3 at 125 °C case temperature?
The SQD50P03-07-T4_GE3 maintains a continuous drain current rating of -50 A at TC = 125 °C, as specified in the Absolute Maximum Ratings table. This reflects its ability to sustain full-load operation under elevated thermal conditions common in engine bay environments, provided the PCB thermal design meets the 1" square FR-4 copper requirement for junction-to-ambient heat dissipation.
Is SQD50P03-07-T4_GE3 suitable for synchronous rectification in a bidirectional DC-DC converter?
Yes, SQD50P03-07-T4_GE3 supports synchronous rectification due to its low RDS(on) and integrated body diode with -0.85 V forward voltage at -30 A. Its 175 °C junction rating and 125 mJ EAS allow safe operation during reverse current commutation transients, making it viable for 12 V/48 V bidirectional converters in mild-hybrid architectures when paired with appropriate gate timing control.
Does SQD50P03-07-T4_GE3 require a gate resistor for ESD protection in automotive applications?
While SQD50P03-07-T4_GE3 has built-in ESD protection per AEC-Q101, a series gate resistor (typically 10–47 Ω) is recommended to dampen ringing and limit peak gate current during fast edge transitions. This improves electromagnetic compatibility and prevents unintended turn-on from coupled noise in high-noise engine compartments-critical for reliable SQD50P03-07-T4_GE3 operation in real-world automotive harness environments.
How does the RDS(on) of SQD50P03-07-T4_GE3 change over temperature, and what is its value at 175 °C junction temperature?
Per the datasheet's "On-Resistance vs. Junction Temperature" curve, SQD50P03-07-T4_GE3 exhibits normalized RDS(on) ≈ 2.0× at TJ = 175 °C versus 25 °C. With a nominal RDS(on) of 0.007 Ω at 25 °C and -10 V VGS, its value rises to approximately 0.014 Ω at 175 °C-still well within design margins for most automotive load-switching applications when properly heatsinked.
Can SQD50P03-07-T4_GE3 be used in a high-side switch configuration with a 3.3 V microcontroller GPIO without level shifting?
No-SQD50P03-07-T4_GE3 has a VGS(th) range of -1.5 V to -2.5 V and requires sufficient negative gate drive to fully enhance. A 3.3 V GPIO cannot generate the necessary VGS ≤ -10 V for low RDS(on); a dedicated high-side gate driver or level-shifting circuit (e.g., charge pump or complementary N/P pair) is required to ensure reliable SQD50P03-07-T4_GE3 turn-on and minimize conduction losses in high-side applications.
SQD50P03-07-T4_GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET®
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 50A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 7mOhm @ 20A, 10V
- Vgs(th) (Max) @ Id:
- 2.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 146 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 5490 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 136W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252AA
SQD50P03-07-T4_GE3 FAQ
1.How can I place an order for SQD50P03-07-T4_GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SQD50P03-07-T4_GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SQD50P03-07-T4_GE3 reliable?
The price and inventory of SQD50P03-07-T4_GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SQD50P03-07-T4_GE3 is usually 5 days.
3.What payment methods are accepted for SQD50P03-07-T4_GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SQD50P03-07-T4_GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SQD50P03-07-T4_GE3?
SQD50P03-07-T4_GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SQD50P03-07-T4_GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SQD50P03-07-T4_GE3?
For technical support, including SQD50P03-07-T4_GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SQD50P03-07-T4_GE3 requirements.
6.How does Aetrix verify that SQD50P03-07-T4_GE3 is sourced from the original manufacturer or authorized distributors?
All SQD50P03-07-T4_GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SQD50P03-07-T4_GE3 meets industry standards.
7.What is the process for return or replacement of SQD50P03-07-T4_GE3?
All SQD50P03-07-T4_GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SQD50P03-07-T4_GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SQD50P03-07-T4_GE3 part is unused and in its original packaging.
Return procedure for SQD50P03-07-T4_GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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