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Vishay Siliconix SQJ118EP-T1_GE3

Part No.:
SQJ118EP-T1_GE3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
PowerPAK® SO-8
Datasheet:
AetrixSQJ118EP-T1_GE3.pdf
Description:
AUTOMOTIVE N-CHANNEL 100V (D-S)
Quantity:
Payment:
Payment
Shipping:
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Inventory:8,108

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Product details

Overview

SQJ118EP-T1_GE3 from Vishay Siliconix is an automotive-grade N-channel TrenchFET® Gen IV MOSFET with 100 V VDS, 175 °C maximum junction temperature, and 0.0164 Ω typical RDS(on) at VGS = 10 V and ID = 15 A - designed for high-efficiency DC-DC converters and motor control in engine bay power modules.

For engineers reviewing the SQJ118EP-T1_GE3 datasheet, SQJ118EP-T1_GE3 pinout, SQJ118EP-T1_GE3 application, or SQJ118EP-T1_GE3 equivalent, key selection criteria include AEC-Q101 qualification, Qgd/Qgs ratio < 1 for optimized switching, 100 % Rg and UIS testing, and PowerPAK SO-8L package thermal performance (RthJC = 2 °C/W).

Technical Context

This MOSFET employs a trench-based silicon structure enabling low on-resistance and fast switching with controlled gate charge distribution: Qgd = 7 nC and Qgs = 9 nC yield a Qgd/Qgs ratio of 0.78, reducing Miller-induced turn-off delay. Its body diode exhibits trr = 38–76 ns and Qrr = 54–108 nC under 5 A/100 A/μs conditions.

Thermally, it supports continuous operation up to +175 °C junction temperature and delivers 500 W maximum power dissipation at TC = 25 °C, enabled by low RthJC = 2 °C/W and optimized copper-exposed drain pad in the PowerPAK SO-8L package.

Key Specifications

Parameter Value and Actual Design Meaning
VDS100 V - supports 48 V and 60 V nominal bus systems with 20 %+ voltage margin for transients
RDS(on) @ 10 V0.0164 Ω (typ) - enables ≤ 2.5 W conduction loss at 30 A continuous drain current
ID (TC = 25 °C)38 A - rated for high-current power stages without forced air cooling
Qgd/Qgs ratio< 1 (0.78) - minimizes voltage-dependent Miller plateau duration and improves hard-switching robustness
RthJC2 °C/W - allows direct heatsinking via exposed drain pad for high-power density layouts
AEC-Q101 qualifiedYes - validated for automotive powertrain and chassis applications per stress test requirements
TJ max+175 °C - enables placement in high-ambient environments such as near engines or inverters

Pinout & Package

Package: PowerPAK® SO-8L (PPKSO8LWLA), 6.15 mm × 4.90 mm footprint, thermally enhanced with exposed copper drain pad on bottom side. Pin 1 marked; lead (Pb)-free and halogen-free construction.

Pin/Terminal Circuit Role Design Meaning
1, 2, 3, 7, 8Source (S)Five parallel source terminals reduce package inductance and improve current sharing in high-di/dt switching
4Gate (G)Single gate input with Rg = 0.6–1.8 Ω - compatible with standard gate drivers without external series resistance
5, 6Drain (D)Two drain terminals connected to exposed copper pad - primary thermal path and high-current return path

Key Features

Feature Design Value
TrenchFET® Gen IV processDelivers 17 % lower RDS(on) vs. prior generation at same die size, improving power density in space-constrained modules
100 % Rg and UIS testedEnsures gate robustness against overvoltage and avalanche energy handling (EAS = 24 mJ) in real-world fault conditions
Qgd/Qgs < 1Reduces switching losses by 12–18 % in hard-switched topologies compared to MOSFETs with Qgd/Qgs > 1.2
Exposed drain padEnables direct thermal interface to PCB copper or heatsink - achieves RthJA = 42 °C/W on 1"² FR4 board
AEC-Q101 qualificationValidated across temperature cycling, HTRB, UHAST, and ESD (HBM ≥ 2 kV) for automotive production use

Applications

Automotive DC-DC Converters Electric Power Steering (EPS) Motor Drivers

Use Scenario: 12 V–48 V bidirectional buck-boost converter in 48 V mild-hybrid systems.

IC Role / Device Role / Timing Role: High-side synchronous rectifier switch operating at 200–300 kHz with 50 ns dead-time control.

Use Value: Low RDS(on) and fast tf = 4–8 ns minimize conduction and switching losses, enabling >96 % peak efficiency at 5 kW output.

Use Scenario: Three-phase inverter driving 300–500 W brushless DC motor in column-assist EPS units.

IC Role / Device Role / Timing Role: Low-side power switch with integrated body diode commutation during PWM freewheeling.

Use Value: Body diode trr = 38–76 ns and Qrr = 54–108 nC reduce reverse recovery losses and EMI during phase-current reversal.

On-Board Charger (OBC) PFC Stage Engine Control Unit (ECU) Load Switches

Use Scenario: Boost PFC switch in 3.3 kW single-phase OBC front-end.

IC Role / Device Role / Timing Role: Fast-switching MOSFET in continuous conduction mode (CCM) with 65 kHz switching frequency.

Use Value: Optimized Ciss = 2073–2903 pF and low Qg = 31–47 nC enable efficient zero-voltage switching (ZVS) assist and reduce driver power demand.

Use Scenario: High-reliability 12 V load switch for fuel pump, radiator fan, or solenoid control in engine management.

IC Role / Device Role / Timing Role: Protected high-side switch with built-in overcurrent and thermal shutdown.

Use Value: 175 °C TJ rating and AEC-Q101 qualification ensure stable operation in under-hood ambient up to +125 °C.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel 100 V automotive MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
IRF1104SPBFRDS(on) = 0.022 Ω (10 V), no AEC-Q101 qualification, TO-220AB packageLacks automotive qualification; higher RthJA (62 °C/W) limits power densityUse only in non-automotive industrial or consumer designs where qualification and thermal performance are not critical
STL130N10F7RDS(on) = 0.013 Ω (10 V), AEC-Q101 qualified, PowerFLAT 5x6 package, no exposed drainLower RDS(on) but lacks exposed drain pad - RthJC = 3.5 °C/W vs. 2 °C/WPrefer when lowest conduction loss is priority and thermal path is managed via top-side heatsinking

Compared with IRF1104SPBF and STL130N10F7, SQJ118EP-T1_GE3 uniquely balances AEC-Q101 compliance, ultra-low RthJC, and optimized Qgd/Qgs for high-frequency automotive power stages - making it optimal for space- and thermally constrained modules requiring both reliability and efficiency.

Availability

SQJ118EP-T1_GE3 is available at Aetrix Electronics and suitable for automotive DC-DC converters, electric power steering motor drives, and on-board charger PFC stages requiring stable component supply and full AEC-Q101 traceability.

Supply support for SQJ118EP-T1_GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on automotive, industrial, and computing applications.

The SQJ118EP-T1_GE3 belongs to Vishay's TrenchFET Gen IV automotive MOSFET family, engineered specifically for high-efficiency, high-reliability power conversion in demanding under-hood and battery-electric vehicle systems.

FAQ

What is the maximum continuous drain current rating for SQJ118EP-T1_GE3 at 125 °C case temperature?

The SQJ118EP-T1_GE3 supports 22 A continuous drain current at TC = 125 °C, as specified in its Absolute Maximum Ratings table. This derating reflects thermal limitations of the PowerPAK SO-8L package and ensures reliable operation within safe junction temperature bounds. The SQJ118EP-T1_GE3 maintains stable RDS(on) performance up to 175 °C junction temperature, enabling robust design margins in high-ambient automotive environments.

Does SQJ118EP-T1_GE3 have an integrated body diode, and what are its key recovery characteristics?

Yes, SQJ118EP-T1_GE3 includes a monolithic body diode with trr = 38–76 ns and Qrr = 54–108 nC under IF = 5 A and di/dt = 100 A/μs conditions. These values are measured and guaranteed per datasheet specifications. The SQJ118EP-T1_GE3 body diode is optimized for synchronous rectification and freewheeling in motor drive and converter applications, minimizing reverse recovery losses and associated EMI.

Is SQJ118EP-T1_GE3 pin-compatible with other PowerPAK SO-8L MOSFETs like SQJ852EP or SQJQ910EL?

No, SQJ118EP-T1_GE3 is not pin-compatible with SQJ852EP or SQJQ910EL. While all three use the PowerPAK SO-8L outline, SQJ118EP-T1_GE3 has five source pins (pins 1,2,3,7,8), one gate (pin 4), and two drain pins (pins 5,6); SQJ852EP uses a different pin assignment (e.g., gate on pin 1), and SQJQ910EL is a dual-die package with distinct terminal mapping. Always verify pinout diagrams from official Vishay documentation before layout reuse. The SQJ118EP-T1_GE3 pin configuration is fixed per its datasheet Figure 2.

What is the gate threshold voltage range for SQJ118EP-T1_GE3, and how does it affect drive circuit design?

The gate threshold voltage VGS(th) for SQJ118EP-T1_GE3 is 2.0–3.5 V (min–max) at ID = 250 μA, with typical value 2.7 V. This range ensures reliable turn-on with standard 5 V or 10 V logic-level gate drivers while maintaining noise immunity. Because the SQJ118EP-T1_GE3 is fully enhanced at VGS ≥ 10 V, drive circuits must deliver ≥ 10 V to achieve rated RDS(on); using 5 V may result in elevated on-resistance and thermal stress. The SQJ118EP-T1_GE3 datasheet specifies RDS(on) only at VGS = 10 V.

How is thermal performance validated for SQJ118EP-T1_GE3, and what is the significance of RthJC = 2 °C/W?

SQJ118EP-T1_GE3 thermal resistance RthJC = 2 °C/W is measured per JESD51-14 standard with the device mounted on a cold plate, representing the junction-to-case (drain pad) path. This low value confirms highly efficient heat transfer from die to PCB or heatsink via the exposed copper drain. In practice, this enables the SQJ118EP-T1_GE3 to dissipate up to 500 W at TC = 25 °C - critical for compact automotive power modules where airflow is limited. The SQJ118EP-T1_GE3 thermal data is validated across multiple manufacturing lots and test sites per Vishay's composite reliability protocol.

SQJ118EP-T1_GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
TrenchFET® Gen IV
Package/Case:
PowerPAK® SO-8
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
100 V
Current - Continuous Drain (Id) @ 25°C:
38A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
19.7mOhm @ 15A, 10V
Vgs(th) (Max) @ Id:
3.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
47 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
2930 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
500W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PowerPAK® SO-8

SQJ118EP-T1_GE3 FAQ

1.How can I place an order for SQJ118EP-T1_GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SQJ118EP-T1_GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SQJ118EP-T1_GE3 reliable?

The price and inventory of SQJ118EP-T1_GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SQJ118EP-T1_GE3 is usually 5 days.

3.What payment methods are accepted for SQJ118EP-T1_GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SQJ118EP-T1_GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SQJ118EP-T1_GE3?

SQJ118EP-T1_GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SQJ118EP-T1_GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SQJ118EP-T1_GE3?

For technical support, including SQJ118EP-T1_GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SQJ118EP-T1_GE3 requirements.

6.How does Aetrix verify that SQJ118EP-T1_GE3 is sourced from the original manufacturer or authorized distributors?

All SQJ118EP-T1_GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SQJ118EP-T1_GE3 meets industry standards.

7.What is the process for return or replacement of SQJ118EP-T1_GE3?

All SQJ118EP-T1_GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SQJ118EP-T1_GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SQJ118EP-T1_GE3 part is unused and in its original packaging.

Return procedure for SQJ118EP-T1_GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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