Vishay Siliconix SQJ118EP-T1_GE3
- Part No.:
- SQJ118EP-T1_GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- PowerPAK® SO-8
- Datasheet:
-
SQJ118EP-T1_GE3.pdf
- Description:
- AUTOMOTIVE N-CHANNEL 100V (D-S)
- Quantity:
- Payment:

- Shipping:

Inventory:8,108
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SQJ118EP-T1_GE3 from Vishay Siliconix is an automotive-grade N-channel TrenchFET® Gen IV MOSFET with 100 V VDS, 175 °C maximum junction temperature, and 0.0164 Ω typical RDS(on) at VGS = 10 V and ID = 15 A - designed for high-efficiency DC-DC converters and motor control in engine bay power modules.
For engineers reviewing the SQJ118EP-T1_GE3 datasheet, SQJ118EP-T1_GE3 pinout, SQJ118EP-T1_GE3 application, or SQJ118EP-T1_GE3 equivalent, key selection criteria include AEC-Q101 qualification, Qgd/Qgs ratio < 1 for optimized switching, 100 % Rg and UIS testing, and PowerPAK SO-8L package thermal performance (RthJC = 2 °C/W).
Technical Context
This MOSFET employs a trench-based silicon structure enabling low on-resistance and fast switching with controlled gate charge distribution: Qgd = 7 nC and Qgs = 9 nC yield a Qgd/Qgs ratio of 0.78, reducing Miller-induced turn-off delay. Its body diode exhibits trr = 38–76 ns and Qrr = 54–108 nC under 5 A/100 A/μs conditions.
Thermally, it supports continuous operation up to +175 °C junction temperature and delivers 500 W maximum power dissipation at TC = 25 °C, enabled by low RthJC = 2 °C/W and optimized copper-exposed drain pad in the PowerPAK SO-8L package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 100 V - supports 48 V and 60 V nominal bus systems with 20 %+ voltage margin for transients |
| RDS(on) @ 10 V | 0.0164 Ω (typ) - enables ≤ 2.5 W conduction loss at 30 A continuous drain current |
| ID (TC = 25 °C) | 38 A - rated for high-current power stages without forced air cooling |
| Qgd/Qgs ratio | < 1 (0.78) - minimizes voltage-dependent Miller plateau duration and improves hard-switching robustness |
| RthJC | 2 °C/W - allows direct heatsinking via exposed drain pad for high-power density layouts |
| AEC-Q101 qualified | Yes - validated for automotive powertrain and chassis applications per stress test requirements |
| TJ max | +175 °C - enables placement in high-ambient environments such as near engines or inverters |
Pinout & Package
Package: PowerPAK® SO-8L (PPKSO8LWLA), 6.15 mm × 4.90 mm footprint, thermally enhanced with exposed copper drain pad on bottom side. Pin 1 marked; lead (Pb)-free and halogen-free construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 7, 8 | Source (S) | Five parallel source terminals reduce package inductance and improve current sharing in high-di/dt switching |
| 4 | Gate (G) | Single gate input with Rg = 0.6–1.8 Ω - compatible with standard gate drivers without external series resistance |
| 5, 6 | Drain (D) | Two drain terminals connected to exposed copper pad - primary thermal path and high-current return path |
Key Features
| Feature | Design Value |
|---|---|
| TrenchFET® Gen IV process | Delivers 17 % lower RDS(on) vs. prior generation at same die size, improving power density in space-constrained modules |
| 100 % Rg and UIS tested | Ensures gate robustness against overvoltage and avalanche energy handling (EAS = 24 mJ) in real-world fault conditions |
| Qgd/Qgs < 1 | Reduces switching losses by 12–18 % in hard-switched topologies compared to MOSFETs with Qgd/Qgs > 1.2 |
| Exposed drain pad | Enables direct thermal interface to PCB copper or heatsink - achieves RthJA = 42 °C/W on 1"² FR4 board |
| AEC-Q101 qualification | Validated across temperature cycling, HTRB, UHAST, and ESD (HBM ≥ 2 kV) for automotive production use |
Applications
| Automotive DC-DC Converters | Electric Power Steering (EPS) Motor Drivers |
|---|---|
Use Scenario: 12 V–48 V bidirectional buck-boost converter in 48 V mild-hybrid systems. IC Role / Device Role / Timing Role: High-side synchronous rectifier switch operating at 200–300 kHz with 50 ns dead-time control. Use Value: Low RDS(on) and fast tf = 4–8 ns minimize conduction and switching losses, enabling >96 % peak efficiency at 5 kW output. |
Use Scenario: Three-phase inverter driving 300–500 W brushless DC motor in column-assist EPS units. IC Role / Device Role / Timing Role: Low-side power switch with integrated body diode commutation during PWM freewheeling. Use Value: Body diode trr = 38–76 ns and Qrr = 54–108 nC reduce reverse recovery losses and EMI during phase-current reversal. |
| On-Board Charger (OBC) PFC Stage | Engine Control Unit (ECU) Load Switches |
Use Scenario: Boost PFC switch in 3.3 kW single-phase OBC front-end. IC Role / Device Role / Timing Role: Fast-switching MOSFET in continuous conduction mode (CCM) with 65 kHz switching frequency. Use Value: Optimized Ciss = 2073–2903 pF and low Qg = 31–47 nC enable efficient zero-voltage switching (ZVS) assist and reduce driver power demand. |
Use Scenario: High-reliability 12 V load switch for fuel pump, radiator fan, or solenoid control in engine management. IC Role / Device Role / Timing Role: Protected high-side switch with built-in overcurrent and thermal shutdown. Use Value: 175 °C TJ rating and AEC-Q101 qualification ensure stable operation in under-hood ambient up to +125 °C. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel 100 V automotive MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF1104SPBF | RDS(on) = 0.022 Ω (10 V), no AEC-Q101 qualification, TO-220AB package | Lacks automotive qualification; higher RthJA (62 °C/W) limits power density | Use only in non-automotive industrial or consumer designs where qualification and thermal performance are not critical |
| STL130N10F7 | RDS(on) = 0.013 Ω (10 V), AEC-Q101 qualified, PowerFLAT 5x6 package, no exposed drain | Lower RDS(on) but lacks exposed drain pad - RthJC = 3.5 °C/W vs. 2 °C/W | Prefer when lowest conduction loss is priority and thermal path is managed via top-side heatsinking |
Compared with IRF1104SPBF and STL130N10F7, SQJ118EP-T1_GE3 uniquely balances AEC-Q101 compliance, ultra-low RthJC, and optimized Qgd/Qgs for high-frequency automotive power stages - making it optimal for space- and thermally constrained modules requiring both reliability and efficiency.
Availability
SQJ118EP-T1_GE3 is available at Aetrix Electronics and suitable for automotive DC-DC converters, electric power steering motor drives, and on-board charger PFC stages requiring stable component supply and full AEC-Q101 traceability.
Supply support for SQJ118EP-T1_GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on automotive, industrial, and computing applications.
The SQJ118EP-T1_GE3 belongs to Vishay's TrenchFET Gen IV automotive MOSFET family, engineered specifically for high-efficiency, high-reliability power conversion in demanding under-hood and battery-electric vehicle systems.
FAQ
What is the maximum continuous drain current rating for SQJ118EP-T1_GE3 at 125 °C case temperature?
The SQJ118EP-T1_GE3 supports 22 A continuous drain current at TC = 125 °C, as specified in its Absolute Maximum Ratings table. This derating reflects thermal limitations of the PowerPAK SO-8L package and ensures reliable operation within safe junction temperature bounds. The SQJ118EP-T1_GE3 maintains stable RDS(on) performance up to 175 °C junction temperature, enabling robust design margins in high-ambient automotive environments.
Does SQJ118EP-T1_GE3 have an integrated body diode, and what are its key recovery characteristics?
Yes, SQJ118EP-T1_GE3 includes a monolithic body diode with trr = 38–76 ns and Qrr = 54–108 nC under IF = 5 A and di/dt = 100 A/μs conditions. These values are measured and guaranteed per datasheet specifications. The SQJ118EP-T1_GE3 body diode is optimized for synchronous rectification and freewheeling in motor drive and converter applications, minimizing reverse recovery losses and associated EMI.
Is SQJ118EP-T1_GE3 pin-compatible with other PowerPAK SO-8L MOSFETs like SQJ852EP or SQJQ910EL?
No, SQJ118EP-T1_GE3 is not pin-compatible with SQJ852EP or SQJQ910EL. While all three use the PowerPAK SO-8L outline, SQJ118EP-T1_GE3 has five source pins (pins 1,2,3,7,8), one gate (pin 4), and two drain pins (pins 5,6); SQJ852EP uses a different pin assignment (e.g., gate on pin 1), and SQJQ910EL is a dual-die package with distinct terminal mapping. Always verify pinout diagrams from official Vishay documentation before layout reuse. The SQJ118EP-T1_GE3 pin configuration is fixed per its datasheet Figure 2.
What is the gate threshold voltage range for SQJ118EP-T1_GE3, and how does it affect drive circuit design?
The gate threshold voltage VGS(th) for SQJ118EP-T1_GE3 is 2.0–3.5 V (min–max) at ID = 250 μA, with typical value 2.7 V. This range ensures reliable turn-on with standard 5 V or 10 V logic-level gate drivers while maintaining noise immunity. Because the SQJ118EP-T1_GE3 is fully enhanced at VGS ≥ 10 V, drive circuits must deliver ≥ 10 V to achieve rated RDS(on); using 5 V may result in elevated on-resistance and thermal stress. The SQJ118EP-T1_GE3 datasheet specifies RDS(on) only at VGS = 10 V.
How is thermal performance validated for SQJ118EP-T1_GE3, and what is the significance of RthJC = 2 °C/W?
SQJ118EP-T1_GE3 thermal resistance RthJC = 2 °C/W is measured per JESD51-14 standard with the device mounted on a cold plate, representing the junction-to-case (drain pad) path. This low value confirms highly efficient heat transfer from die to PCB or heatsink via the exposed copper drain. In practice, this enables the SQJ118EP-T1_GE3 to dissipate up to 500 W at TC = 25 °C - critical for compact automotive power modules where airflow is limited. The SQJ118EP-T1_GE3 thermal data is validated across multiple manufacturing lots and test sites per Vishay's composite reliability protocol.
SQJ118EP-T1_GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET® Gen IV
- Package/Case:
- PowerPAK® SO-8
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 38A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 19.7mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 3.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 47 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2930 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 500W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerPAK® SO-8
SQJ118EP-T1_GE3 FAQ
1.How can I place an order for SQJ118EP-T1_GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SQJ118EP-T1_GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SQJ118EP-T1_GE3 reliable?
The price and inventory of SQJ118EP-T1_GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SQJ118EP-T1_GE3 is usually 5 days.
3.What payment methods are accepted for SQJ118EP-T1_GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SQJ118EP-T1_GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SQJ118EP-T1_GE3?
SQJ118EP-T1_GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SQJ118EP-T1_GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SQJ118EP-T1_GE3?
For technical support, including SQJ118EP-T1_GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SQJ118EP-T1_GE3 requirements.
6.How does Aetrix verify that SQJ118EP-T1_GE3 is sourced from the original manufacturer or authorized distributors?
All SQJ118EP-T1_GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SQJ118EP-T1_GE3 meets industry standards.
7.What is the process for return or replacement of SQJ118EP-T1_GE3?
All SQJ118EP-T1_GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SQJ118EP-T1_GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SQJ118EP-T1_GE3 part is unused and in its original packaging.
Return procedure for SQJ118EP-T1_GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SQJ118EP-T1_GE3 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

