Vishay Siliconix SQJ152ELP-T1_GE3
- Part No.:
- SQJ152ELP-T1_GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- PowerPAK® SO-8
- Datasheet:
-
SQJ152ELP-T1_GE3.pdf
- Description:
- MOSFET N-CH 40V 123A PPAK SO-8
- Quantity:
- Payment:

- Shipping:

Inventory:6,838
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SQJ152ELP-T1_GE3 from Vishay Siliconix is an automotive-grade N-channel TrenchFET® Gen IV MOSFET rated for 40 V drain-source voltage, 123 A continuous drain current at 25 °C, and 0.0050 Ω RDS(on) at VGS = 10 V. It serves as a high-current power switch in 12 V/24 V automotive subsystems including motor control, DC-DC conversion, and battery protection circuits.
For engineers reviewing the SQJ152ELP-T1_GE3 datasheet, SQJ152ELP-T1_GE3 pinout, SQJ152ELP-T1_GE3 application, or SQJ152ELP-T1_GE3 equivalent, key selection criteria include its AEC-Q101 qualification, 175 °C junction temperature rating, low gate charge (22.5 nC typ.), and PowerPAK SO-8L package thermal performance (RthJC = 1.1 °C/W).
Technical Context
This MOSFET employs trench-based silicon architecture optimized for low conduction loss and fast switching in high-reliability automotive power stages. Its gate threshold voltage (1.2–2.2 V) enables robust drive compatibility with standard 3.3 V and 5 V logic controllers, while the 100 % Rg and UIS testing ensures production-level ruggedness under transient stress.
The device integrates a co-packaged body diode with 1.1 V forward voltage at 15 A and 28–42 ns reverse recovery time, supporting synchronous rectification and freewheeling in buck converters and H-bridge motor drivers. Thermal design is anchored by a low junction-to-case resistance (1.1 °C/W) and validated PCB-mount thermal resistance (42 °C/W).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 40 V - Maximum blocking voltage compatible with 24 V automotive systems and transient surge tolerance up to ISO 7637-2 Pulse 5a. |
| RDS(on) @ 10 V | 0.0050 Ω - Enables ≤ 7.6 W conduction loss at 123 A, critical for high-efficiency 12 V starter relays and solenoid drivers. |
| ID (continuous) | 123 A @ TC = 25 °C - Supports high-current loads without external heatsinking when mounted on 1"² FR4 PCB. |
| Qg | 22.5 nC (typ.) - Reduces gate drive power and switching losses in 100–500 kHz DC-DC applications. |
| TJ range | –55 to +175 °C - Certified for under-hood operation in engine control units and transmission control modules. |
| AEC-Q101 | Qualified - Meets automotive stress test requirements for temperature cycling, humidity bias, and mechanical shock. |
| RthJC | 1.1 °C/W - Enables direct thermal coupling to metal-core PCBs or heatsinks for sustained high-power operation. |
Pinout & Package
Package: PowerPAK® SO-8L (PPKSO8LWLA), surface-mount, thermally enhanced leadless package with exposed drain paddle on bottom side. Dimensions: 6.15 mm × 4.90 mm × 1.05 mm (E × D1 × A).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 7, 8 | Source (S) | Five parallel source terminals reduce source inductance and improve current sharing in high-di/dt switching. |
| 4 | Gate (G) | Single gate input with 2.5–7.4 Ω gate resistance - supports stable gate drive without external damping in PWM motor control. |
| 5, 6 | Drain (D) | Two drain terminals connected to internal copper paddle - provides low-inductance, high-current path to PCB ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| TrenchFET® Gen IV process | Delivers 25 % lower RDS(on) vs. prior generation at same die size - improves power density in space-constrained ECUs. |
| 100 % Rg and UIS tested | Ensures gate robustness against ESD and avalanche energy handling (EAS = 9.8 mJ) without derating in real-world transients. |
| Exposed drain paddle | Enables direct thermal interface to PCB copper - achieves 1.1 °C/W junction-to-case resistance for compact thermal design. |
| Body diode Qrr | 12–18 nC - Minimizes reverse recovery losses in synchronous buck topologies operating above 200 kHz. |
| Low Ciss/Coss ratio | 1166 pF / 412 pF - Improves hard-switching efficiency and reduces EMI in high-frequency DC-DC converters. |
Applications
| Engine Start-Stop System | Automotive HVAC Blower Control |
|---|---|
|
Use Scenario: High-current solenoid and pre-charge switching during engine cranking and restart cycles. IC Role / Device Role / Timing Role: Main power switch controlling 12 V battery-to-starter circuit with <100 ns turn-on delay and 6.1 ns rise time. Use Value: Low RDS(on) (0.0050 Ω) limits voltage drop to <0.6 V at 120 A, preserving cranking torque and meeting ISO 16750-2 cold-cranking requirements. |
Use Scenario: PWM-controlled DC motor driver for cabin air blower in electric and hybrid vehicles. IC Role / Device Role / Timing Role: Low-side switching element in half-bridge configuration, operating at 20–30 kHz with 25 ns fall time. Use Value: Fast switching (tf = 8.5–12 ns) and low Qgd (4.3 nC) minimize shoot-through risk and conduction losses across full speed range. |
| 12 V/48 V Bi-Directional DC-DC Converter | Automotive Battery Disconnect Unit (BDU) |
|
Use Scenario: Synchronous rectifier in high-efficiency bidirectional converter linking 12 V and 48 V domains. IC Role / Device Role / Timing Role: Secondary-side switch leveraging low VSD (1.1 V) and fast trr (28–42 ns) for zero-voltage switching assist. Use Value: Body diode soft recovery and low Qrr (12–18 nC) reduce switching losses by >30 % vs. standard MOSFETs in 48 V output stage. |
Use Scenario: Isolation switch between high-voltage traction battery and 12 V auxiliary system during crash or fault events. IC Role / Device Role / Timing Role: Fail-safe power disconnect with 168 A pulsed current capability and 14 A single-pulse avalanche rating. Use Value: AEC-Q101 qualification and 175 °C TJ rating ensure reliable operation during thermal runaway detection and forced shutdown sequences. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel automotive MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF1520PBF | Higher RDS(on) (0.027 Ω @ 10 V), TO-220 package, no AEC-Q101 qualification. | Limited to non-automotive industrial motor drives; lacks thermal performance and reliability validation for under-hood use. | Select only for cost-sensitive, non-automotive designs where 175 °C operation and AEC-Q101 are not required. |
| STL220N4F7AG | Same VDS (40 V), lower RDS(on) (0.0038 Ω), PowerFLAT 5x6 package, AEC-Q101 qualified. | Better conduction loss but higher Ciss (1900 pF) and slower switching - less optimal for >300 kHz DC-DC topologies. | Prefer for ultra-low-loss battery switches; choose SQJ152ELP-T1_GE3 when switching speed and gate drive efficiency are prioritized. |
Compared with IRF1520PBF and STL220N4F7AG, SQJ152ELP-T1_GE3 delivers balanced performance: superior thermal resistance (1.1 °C/W vs. ~2.5 °C/W for TO-220), faster switching than ST's PowerFLAT part, and AEC-Q101 compliance without trade-offs in gate drive simplicity or layout footprint.
Availability
SQJ152ELP-T1_GE3 is available at Aetrix Electronics and suitable for automotive power distribution, motor control, and DC-DC conversion requiring stable component supply, long-term lifecycle support, and traceable sourcing for Tier 1 OEM programs.
Supply support for SQJ152ELP-T1_GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics for automotive, industrial, and computing markets.
The SQJ152ELP-T1_GE3 belongs to Vishay's TrenchFET® Gen IV automotive MOSFET family, engineered specifically for high-current, high-temperature power switching in engine control, ADAS, and electrified vehicle subsystems.
FAQ
What is the maximum continuous drain current rating for SQJ152ELP-T1_GE3 at 125 °C case temperature?
The SQJ152ELP-T1_GE3 supports 71 A continuous drain current at TC = 125 °C, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limits of the PowerPAK SO-8L package under sustained high-temperature operation, and must be verified against actual PCB layout and ambient conditions in the final design. SQJ152ELP-T1_GE3 maintains full functionality across its –55 to +175 °C junction temperature range.
Is SQJ152ELP-T1_GE3 qualified for automotive applications per AEC-Q101 standards?
Yes, SQJ152ELP-T1_GE3 is explicitly AEC-Q101 qualified, as confirmed in the Features section of the official Vishay datasheet (S23-0044-Rev. C). This qualification covers stress tests including temperature cycling, high-temperature operating life, and unclamped inductive switching - validating its suitability for under-hood and safety-critical automotive systems. SQJ152ELP-T1_GE3 also undergoes 100 % Rg and UIS screening per lot.
What is the typical total gate charge (Qg) of SQJ152ELP-T1_GE3 and how does it impact gate driver selection?
The typical total gate charge (Qg) of SQJ152ELP-T1_GE3 is 22.5 nC at VGS = 10 V, VDS = 20 V, and ID = 15 A. This value directly determines peak gate current requirements: for a 20 ns turn-on time, a driver must supply ≥1.1 A peak. SQJ152ELP-T1_GE3's moderate Qg enables use of compact, low-cost gate drivers such as the Texas Instruments UCC27531 or Infineon 1EDN7512B.
Does SQJ152ELP-T1_GE3 include an integrated body diode, and what are its key characteristics?
Yes, SQJ152ELP-T1_GE3 integrates a parasitic body diode with a forward voltage (VSD) of ≤1.1 V at IF = 15 A and VGS = 0 V. Its reverse recovery time (trr) is 28–42 ns, and reverse recovery charge (Qrr) is 12–18 nC. These parameters make SQJ152ELP-T1_GE3 suitable for synchronous rectification and freewheeling in high-frequency DC-DC converters where low recovery loss is essential.
What is the thermal resistance from junction to ambient (RthJA) for SQJ152ELP-T1_GE3 under standard mounting conditions?
The junction-to-ambient thermal resistance (RthJA) of SQJ152ELP-T1_GE3 is 42 °C/W when mounted on a 1" square FR4 PCB with 2 oz. copper on both sides, as defined in the Thermal Resistance Ratings table. This value assumes standard JEDEC test board conditions and serves as a baseline for thermal modeling; actual RthJA will improve with additional copper area, thermal vias, or heatsinking. SQJ152ELP-T1_GE3's RthJC of 1.1 °C/W further enables efficient heat extraction via the exposed drain paddle.
SQJ152ELP-T1_GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET®
- Package/Case:
- PowerPAK® SO-8
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 40 V
- Current - Continuous Drain (Id) @ 25°C:
- 123A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 5mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 2.2V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 34 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1633 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 136W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerPAK® SO-8
SQJ152ELP-T1_GE3 FAQ
1.How can I place an order for SQJ152ELP-T1_GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SQJ152ELP-T1_GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SQJ152ELP-T1_GE3 reliable?
The price and inventory of SQJ152ELP-T1_GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SQJ152ELP-T1_GE3 is usually 5 days.
3.What payment methods are accepted for SQJ152ELP-T1_GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SQJ152ELP-T1_GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SQJ152ELP-T1_GE3?
SQJ152ELP-T1_GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SQJ152ELP-T1_GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SQJ152ELP-T1_GE3?
For technical support, including SQJ152ELP-T1_GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SQJ152ELP-T1_GE3 requirements.
6.How does Aetrix verify that SQJ152ELP-T1_GE3 is sourced from the original manufacturer or authorized distributors?
All SQJ152ELP-T1_GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SQJ152ELP-T1_GE3 meets industry standards.
7.What is the process for return or replacement of SQJ152ELP-T1_GE3?
All SQJ152ELP-T1_GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SQJ152ELP-T1_GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SQJ152ELP-T1_GE3 part is unused and in its original packaging.
Return procedure for SQJ152ELP-T1_GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SQJ152ELP-T1_GE3 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

