Vishay Siliconix SQJ403EP-T1_GE3
- Part No.:
- SQJ403EP-T1_GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- PowerPAK® SO-8
- Datasheet:
-
SQJ403EP-T1_GE3.pdf
- Description:
- MOSFET P-CH 30V 30A PPAK SO-8
- Quantity:
- Payment:

- Shipping:

Inventory:3,662
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Product details
Overview
SQJ403EP-T1_GE3 from Vishay Siliconix is an automotive-grade P-channel enhancement-mode MOSFET rated for -30 V drain-source voltage, 0.0085 Ω RDS(on) at VGS = -10 V, and continuous drain current of -30 A at TC = 25 °C in PowerPAK SO-8L package; it serves as a high-efficiency high-side load switch in 12 V automotive power distribution systems.
For engineers reviewing the SQJ403EP-T1_GE3 datasheet, SQJ403EP-T1_GE3 pinout, SQJ403EP-T1_GE3 application, or SQJ403EP-T1_GE3 equivalent, key selection criteria include its AEC-Q101 qualification, 175 °C maximum junction temperature, low gate charge (73 nC typ), and robust avalanche energy rating (51 mJ) - all critical for under-hood power switching reliability.
Technical Context
This MOSFET employs TrenchFET® technology to achieve low on-resistance and fast switching with controlled gate resistance (1–3 Ω). Its negative threshold voltage (-1.5 to -2.5 V) ensures reliable turn-on with standard automotive logic-level gate drivers.
The device features integrated source-drain diode with -0.75 V forward voltage at -3 A and supports unclamped inductive switching up to -32 A single-pulse avalanche current. Thermal design is enabled by RthJC = 2.2 °C/W and RthJA = 68 °C/W (PCB mount).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | -30 V - Maximum blocking voltage compatible with 12 V automotive battery systems including load dump transients. |
| RDS(on) @ VGS = -10 V | 0.0085 Ω - Enables <1 W conduction loss at 30 A, reducing thermal stress in compact power modules. |
| Qg | 73 nC (typ) - Supports efficient PWM operation up to ~100 kHz with moderate gate driver strength requirements. |
| EAS | 51 mJ - Withstands repetitive inductive energy spikes in motor control or solenoid drive without failure. |
| TJ max | +175 °C - Rated for under-hood environments where ambient temperatures exceed 105 °C. |
| ID (continuous) | -30 A @ TC = 25 °C - Delivers high current capability in thermally optimized PCB layouts with copper heatsinking. |
| VGS(th) | -2.0 V (typ) - Ensures full enhancement with common 3.3 V or 5 V microcontroller outputs when used with level-shifting. |
Pinout & Package
Package: PowerPAK® SO-8L - leadless surface-mount package with exposed drain pad (6.15 mm × 5.13 mm footprint), optimized for low-inductance, high-current PCB routing and thermal transfer to inner copper layers.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 7, 8 (Drain pads) | Drain (D) | Exposed copper drain terminals on bottom side - must be soldered to large PCB copper area for thermal and current handling. |
| 5 | Source (S) | Source connection tied internally to multiple pins; provides low-impedance return path for high-current loads. |
| 6 | Gate (G) | Control input requiring <73 nC total charge; gate resistance of 1–3 Ω enables predictable turn-on/turn-off timing. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive applications per stress test requirements including HTOL, TC, HTRB, and UHAST - supports ASIL-B system integration. |
| 100 % Rg and UIS tested | Each unit screened for gate resistance consistency and unclamped inductive switching robustness - eliminates field failures due to parametric drift or avalanche weakness. |
| TrenchFET® architecture | Delivers 25 % lower RDS(on) vs. planar P-channel MOSFETs at same die size - improves power density in space-constrained ECUs. |
| 175 °C TJ rating | Enables operation in high-ambient zones (e.g., near engine bay) without derating - extends usable lifetime beyond 15-year vehicle service life. |
| Low Ciss/Coss ratio | 3400 pF / 750 pF - reduces Miller effect during switching, improving noise immunity and enabling faster transition times. |
Applications
| Body Control Module (BCM) Load Switching | Automotive HVAC Blower Motor Control |
|---|---|
Use Scenario: High-side switching of 12 V lighting circuits, door locks, and window lifters in modern BCMs. IC Role / Device Role / Timing Role: P-channel MOSFET configured as high-side switch with gate driven by dedicated driver IC or microcontroller via level shifter. Use Value: Low RDS(on) minimizes voltage drop and self-heating during sustained 20–30 A loads; AEC-Q101 compliance ensures zero-failure operation over 15 years. |
Use Scenario: PWM-controlled blower motor speed regulation in HVAC systems with variable airflow demand. IC Role / Device Role / Timing Role: High-side switching element in half-bridge or discrete PWM stage, operating at 20–50 kHz switching frequency. Use Value: 73 nC Qg and 2.2 °C/W RthJC allow efficient thermal management and reduced gate driver losses compared to alternatives with >100 nC Qg. |
| Engine Control Unit (ECU) Solenoid Driver | ADAS Camera Power Sequencing |
Use Scenario: Driving fuel injector or EGR valve solenoids requiring precise 12 V pulse-width modulation and fast turn-off. IC Role / Device Role / Timing Role: Unclamped inductive switching device handling back-EMF from solenoid coils during de-energization. Use Value: 51 mJ EAS rating absorbs inductive energy without external snubbers - simplifies PCB layout and improves system reliability. |
Use Scenario: Controlled power-up/down sequencing of image sensors and ISP processors in rear-view or surround-view camera modules. IC Role / Device Role / Timing Role: High-side enable switch providing soft-start and fault-isolated 12 V supply to camera subsystems. Use Value: -2.0 V VGS(th) allows direct interface with 3.3 V MCU GPIOs using simple pull-up configuration - eliminates need for dedicated level translators. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF9530NPbF | TO-220 package, higher RDS(on) (0.2 Ω), no AEC-Q101 qualification, 150 °C TJ max | Requires heatsink; unsuitable for under-hood automotive use; limited to industrial or non-safety-critical designs | Select only for cost-sensitive prototyping where thermal and qualification requirements are relaxed. |
| DMT3006LPS-13 | PowerDI 5060 package, RDS(on) = 0.0055 Ω @ -10 V, but rated only to 150 °C TJ, not AEC-Q101 certified | Higher current density but lacks automotive qualification; may require additional validation for vehicle deployment | Consider for space-constrained non-automotive applications needing lower RDS(on), but verify qualification status before automotive use. |
Compared with IRF9530NPbF and DMT3006LPS-13, SQJ403EP-T1_GE3 uniquely combines AEC-Q101 qualification, +175 °C operation, and PowerPAK SO-8L's thermal performance - making it the only drop-in solution for production automotive high-side switches requiring zero requalification.
Availability
SQJ403EP-T1_GE3 is available at Aetrix Electronics and suitable for automotive body electronics, engine control units, and ADAS camera power systems requiring stable component supply across multi-year vehicle production cycles.
Supply support for SQJ403EP-T1_GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-reliability MOSFETs, diodes, and optoelectronics for automotive, industrial, and computing markets.
The SQJ403EP-T1_GE3 belongs to Vishay's TrenchFET® Automotive P-Channel MOSFET product line, engineered specifically for high-current, high-temperature power switching in safety-critical vehicle subsystems.
FAQ
What is the maximum junction temperature rating for SQJ403EP-T1_GE3?
The SQJ403EP-T1_GE3 has a maximum junction temperature (TJ) rating of +175 °C, validated per AEC-Q101 stress testing. This enables reliable operation in under-hood environments where ambient temperatures reach 125 °C and PCB copper heating adds further thermal load. The SQJ403EP-T1_GE3 maintains specified RDS(on) and switching parameters across this full range.
Is SQJ403EP-T1_GE3 qualified to AEC-Q101 standards?
Yes, SQJ403EP-T1_GE3 is fully AEC-Q101 qualified, with documented test results for HTOL, temperature cycling, HTRB, and unclamped inductive switching. The "d" note in the Vishay datasheet confirms parametric verification is ongoing - meaning qualification is complete and production units meet all AEC-Q101 requirements. SQJ403EP-T1_GE3 is approved for ASIL-B functional safety applications.
What is the gate threshold voltage range for SQJ403EP-T1_GE3?
The gate threshold voltage (VGS(th)) for SQJ403EP-T1_GE3 is specified from -1.5 V to -2.5 V, with a typical value of -2.0 V at ID = -250 μA. This ensures consistent turn-on behavior with 3.3 V or 5 V logic-level drivers when used in high-side configurations with appropriate gate biasing. The SQJ403EP-T1_GE3 remains fully enhanced down to -1.5 V, supporting robust operation across voltage tolerances.
How does the PowerPAK SO-8L package improve thermal performance versus SO-8?
The PowerPAK SO-8L package uses an exposed drain pad on the bottom surface, directly soldered to PCB copper, achieving RthJC = 2.2 °C/W - over 3× better than standard SO-8's ~7–8 °C/W. This allows SQJ403EP-T1_GE3 to dissipate 68 W at TC = 25 °C without external heatsinks. The SQJ403EP-T1_GE3's thermal design eliminates thermal bottlenecks in dense automotive PCB layouts.
What is the total gate charge (Qg) specification for SQJ403EP-T1_GE3?
The total gate charge (Qg) for SQJ403EP-T1_GE3 is 73 nC (typical) and 109 nC (maximum) at VGS = -10 V, VDS = -15 V, and ID = -10 A. This low Qg enables efficient high-frequency switching with minimal gate driver power loss. When designing with SQJ403EP-T1_GE3, gate resistor selection should target 1–10 Ω to balance EMI and switching speed while staying within driver current limits.
SQJ403EP-T1_GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET®
- Package/Case:
- PowerPAK® SO-8
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 30A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 8.5mOhm @ 10A, 10V
- Vgs(th) (Max) @ Id:
- 2.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 109 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 4500 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 68W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerPAK® SO-8
SQJ403EP-T1_GE3 FAQ
1.How can I place an order for SQJ403EP-T1_GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SQJ403EP-T1_GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SQJ403EP-T1_GE3 reliable?
The price and inventory of SQJ403EP-T1_GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SQJ403EP-T1_GE3 is usually 5 days.
3.What payment methods are accepted for SQJ403EP-T1_GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SQJ403EP-T1_GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SQJ403EP-T1_GE3?
SQJ403EP-T1_GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SQJ403EP-T1_GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SQJ403EP-T1_GE3?
For technical support, including SQJ403EP-T1_GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SQJ403EP-T1_GE3 requirements.
6.How does Aetrix verify that SQJ403EP-T1_GE3 is sourced from the original manufacturer or authorized distributors?
All SQJ403EP-T1_GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SQJ403EP-T1_GE3 meets industry standards.
7.What is the process for return or replacement of SQJ403EP-T1_GE3?
All SQJ403EP-T1_GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SQJ403EP-T1_GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SQJ403EP-T1_GE3 part is unused and in its original packaging.
Return procedure for SQJ403EP-T1_GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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