Vishay Siliconix SQJQ186ER-T1_GE3
- Part No.:
- SQJQ186ER-T1_GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerSMD, Gull Wing
- Datasheet:
-
SQJQ186ER-T1_GE3.pdf
- Description:
- AUTOMOTIVE N-CHANNEL 80 V (D-S)
- Quantity:
- Payment:

- Shipping:

Inventory:1,890
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Product details
Overview
SQJQ186ER-T1_GE3 from Vishay Siliconix is an automotive-grade N-channel TrenchFET® Gen IV power MOSFET with 80 V VDS, 2.3 mΩ RDS(on) at 10 V VGS, and 329 A continuous drain current at TC = 25 °C, housed in a thermally optimized PowerPAK® 8 × 8LR package for high-current motor control and DC-DC conversion in under-hood EV systems.
For engineers reviewing the SQJQ186ER-T1_GE3 datasheet, SQJQ186ER-T1_GE3 pinout, SQJQ186ER-T1_GE3 application, or SQJQ186ER-T1_GE3 equivalent, key selection criteria include its AEC-Q101 qualification, 175 °C junction rating, ultra-low RDS(on), 0.25 °C/W RthJC, and 100% UIS testing - critical for automotive traction inverters, 48 V battery management, and high-reliability industrial power stages.
Technical Context
This MOSFET employs TrenchFET® Gen IV silicon technology to achieve low conduction loss and fast switching with Qg = 123–185 nC and Qgd = 26 nC at VDS = 40 V, enabling efficient operation in hard-switched synchronous buck converters and half-bridge motor drivers up to 100 kHz.
Its PowerPAK® 8 × 8LR package features exposed-drain thermal pad and bottom-side source terminals (S1–S3), delivering RthJA = 44 °C/W on 1" FR4 PCB and supporting >200 W continuous dissipation at TC = 125 °C - validated by 100% Rg and UIS screening per AEC-Q101.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 80 V - supports 48 V nominal bus systems with 67% voltage margin against transients in automotive start-stop and regenerative braking. |
| RDS(on) @ 10 V | 2.3 mΩ max - enables <1.2 W conduction loss at 50 A, reducing heatsink requirements in compact power modules. |
| ID (cont.) | 329 A @ TC = 25 °C - delivers high peak power density for short-duration load dumps and motor stall conditions. |
| Qg | 123–185 nC - balances gate drive loss and switching speed for optimal efficiency in 40–100 kHz PWM applications. |
| RthJC | 0.25 °C/W - allows direct thermal coupling to cold plates or heatsinks, enabling >500 W thermal headroom in forced-air-cooled designs. |
| TJ Range | −55 to +175 °C - certified for under-hood placement in electric power steering (EPS), HVAC compressors, and battery disconnect units. |
| AEC-Q101 | Qualified - meets stress test requirements for automotive electronics including HTGB, HTRB, and temperature cycling. |
Pinout & Package
Package: PowerPAK® 8 × 8LR - 8 mm × 8 mm × 1.6 mm thin-profile surface-mount package with exposed drain paddle for low-inductance, high-current routing and enhanced thermal transfer to PCB ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G (Pin 4) | Gate input | Single gate terminal; low Rg (0.6–2.0 Ω) minimizes Miller-induced shoot-through risk in high-dV/dt environments. |
| S1, S2, S3 | Source connections | Three parallel source terminals reduce bond-wire inductance and improve current sharing in high-frequency switching. |
| D (Pins 5–8) | Drain connections | Four drain pins plus large exposed copper paddle provide low-resistance path to PCB thermal plane and minimize loop inductance. |
Key Features
| Feature | Design Value |
|---|---|
| TrenchFET® Gen IV silicon | Delivers 25% lower RDS(on) vs. prior generation while maintaining robust avalanche capability (EAS = 180 mJ). |
| AEC-Q101 qualification | Validated for automotive use with full stress testing including 1000-cycle temperature cycling and 1000-hr HTRB at 150 °C. |
| 100% Rg and UIS tested | Ensures gate robustness against ESD and system-level overvoltage events without derating in production designs. |
| Thin 1.6 mm profile | Enables stacking of dual-sided power modules and integration into space-constrained battery pack control units. |
| Low Ciss/Coss ratio | Ciss = 7537–10552 pF, Coss = 1182–1655 pF - improves ZVS compatibility and reduces capacitive turn-on loss in resonant topologies. |
Applications
| Electric Power Steering (EPS) | 48 V Mild Hybrid DC-DC Converter |
|---|---|
Use Scenario: High-efficiency three-phase inverter driving brushless motor in steering column assembly, operating continuously at 85 °C ambient. IC Role / Device Role / Timing Role: Low-side switching element in 60 kHz PWM-controlled H-bridge, handling peak currents >250 A during torque assist. Use Value: 2.3 mΩ RDS(on) and 175 °C TJ rating enable >98.5% inverter efficiency and eliminate need for active cooling in EPS housing. | Use Scenario: Primary-side synchronous rectifier in bidirectional 3 kW LLC resonant converter linking 48 V and 12 V domains in mild hybrid vehicles. IC Role / Device Role / Timing Role: High-current, low-loss switch operating in ZVS mode with 100 ns fall time and 26 nC Qgd. Use Value: Ultra-low Qgd/Qg ratio (21%) minimizes dead-time losses and improves light-load regulation stability. |
| Onboard Charger (OBC) Input Stage | Battery Disconnect Unit (BDU) |
Use Scenario: AC/DC PFC boost switch in 6.6 kW single-phase OBC, subjected to line surges and thermal cycling across −40 to +105 °C. IC Role / Device Role / Timing Role: Fast-switching, avalanche-rugged N-channel MOSFET in continuous conduction mode (CCM) boost topology. Use Value: 180 mJ EAS and 60 A IAS withstand repeated 600 V line transients without failure, extending field reliability beyond 15-year vehicle life. | Use Scenario: Main contactor replacement in high-voltage battery pack, performing isolation during crash detection and thermal runaway events. IC Role / Device Role / Timing Role: Solid-state high-current switch rated for 300 A continuous and 1600 A pulsed fault current interruption. Use Value: 545 A continuous source current (diode conduction) supports reverse energy recirculation during rapid discharge, eliminating external freewheeling diodes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel 80 V power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N8F7AG | 80 V, 2.2 mΩ RDS(on), 220 A ID, PowerFLAT™ 8 × 8 package, no AEC-Q101 listing | Lacks automotive qualification; suitable for industrial UPS but not for safety-critical EPS or BDU | Select only for non-automotive 48 V systems where AEC-Q101 is not mandated. |
| IRFS7537PbF | 75 V, 2.4 mΩ RDS(on), 300 A ID, TO-263 package, AEC-Q101 qualified | Larger footprint (10.16 × 15.88 mm), higher RthJA (50 °C/W), less suitable for ultra-thin modules | Preferred when legacy TO-263 layout reuse is required and thermal budget allows 0.5 °C/W higher RthJC. |
Compared with STL220N8F7AG and IRFS7537PbF, SQJQ186ER-T1_GE3 uniquely combines AEC-Q101 qualification, 1.6 mm thin profile, 0.25 °C/W RthJC, and 329 A rating - making it the only option for next-gen compact, high-power-density automotive traction and battery systems requiring both safety compliance and thermal headroom.
Availability
SQJQ186ER-T1_GE3 is available at Aetrix Electronics and suitable for electric power steering (EPS), onboard chargers (OBC), and battery disconnect units (BDU) requiring stable component supply, long-term automotive lifecycle support, and traceable AEC-Q101-compliant sourcing.
Supply support for SQJQ186ER-T1_GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics for automotive, industrial, and computing markets.
The SQJQ186ER-T1_GE3 belongs to Vishay's TrenchFET® Gen IV automotive power MOSFET family, engineered specifically for high-current, high-temperature traction and energy storage applications demanding AEC-Q101 reliability and ultra-low RDS(on).
FAQ
What is the maximum continuous drain current rating for SQJQ186ER-T1_GE3 at 125 °C case temperature?
The SQJQ186ER-T1_GE3 supports 189 A continuous drain current at TC = 125 °C, as specified in the Absolute Maximum Ratings table. This derated value reflects thermal limitations of the PowerPAK® 8 × 8LR package under sustained high-temperature operation and must be used for thermal design validation in automotive under-hood environments where case temperatures exceed 100 °C.
Does SQJQ186ER-T1_GE3 have integrated avalanche ruggedness, and how is it verified?
Yes, SQJQ186ER-T1_GE3 is rated for 60 A single-pulse avalanche current (IAS) and 180 mJ single-pulse avalanche energy (EAS) at L = 0.1 mH. It undergoes 100% unclamped inductive switching (UIS) testing per AEC-Q101 requirements, ensuring robustness against inductive load turn-off transients in motor drives and solenoid controls without external snubbers.
What is the gate threshold voltage range for SQJQ186ER-T1_GE3, and how does it affect drive circuit design?
The gate-source threshold voltage (VGS(th)) for SQJQ186ER-T1_GE3 is 2.5–3.5 V at ID = 250 μA. This tight range ensures consistent turn-on behavior across temperature and process variation, allowing reliable operation with standard 5 V or 3.3 V logic-level gate drivers - though 10 V VGS is recommended to achieve full 2.3 mΩ RDS(on) performance.
How does the PowerPAK® 8 × 8LR package of SQJQ186ER-T1_GE3 improve thermal performance compared to TO-263?
The PowerPAK® 8 × 8LR package of SQJQ186ER-T1_GE3 achieves 0.25 °C/W junction-to-case thermal resistance - 35% lower than typical TO-263 MOSFETs - due to its exposed-drain copper paddle and bottom-side source terminals. This enables direct thermal coupling to PCB ground planes and eliminates thermal interface material, simplifying thermal design in space-constrained automotive modules.
Is SQJQ186ER-T1_GE3 compatible with lead-free reflow soldering, and what is the peak temperature limit?
Yes, SQJQ186ER-T1_GE3 is lead (Pb)-free and halogen-free, qualified for standard lead-free reflow with a peak soldering temperature of 260 °C, per JEDEC J-STD-020. The device uses a matte tin finish and follows Vishay's documented solder profile (www.vishay.com/doc?73257); note that the singulated lead tip is exposed copper and does not require solder fillet formation for reliable interconnection.
SQJQ186ER-T1_GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET® Gen IV
- Package/Case:
- 8-PowerSMD, Gull Wing
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 80 V
- Current - Continuous Drain (Id) @ 25°C:
- 329A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 2.3mOhm @ 20A, 10V
- Vgs(th) (Max) @ Id:
- 3.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 185 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 10552 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 600W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerPAK® 8 x 8
SQJQ186ER-T1_GE3 FAQ
1.How can I place an order for SQJQ186ER-T1_GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SQJQ186ER-T1_GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SQJQ186ER-T1_GE3 reliable?
The price and inventory of SQJQ186ER-T1_GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SQJQ186ER-T1_GE3 is usually 5 days.
3.What payment methods are accepted for SQJQ186ER-T1_GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SQJQ186ER-T1_GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SQJQ186ER-T1_GE3?
SQJQ186ER-T1_GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SQJQ186ER-T1_GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SQJQ186ER-T1_GE3?
For technical support, including SQJQ186ER-T1_GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SQJQ186ER-T1_GE3 requirements.
6.How does Aetrix verify that SQJQ186ER-T1_GE3 is sourced from the original manufacturer or authorized distributors?
All SQJQ186ER-T1_GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SQJQ186ER-T1_GE3 meets industry standards.
7.What is the process for return or replacement of SQJQ186ER-T1_GE3?
All SQJQ186ER-T1_GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SQJQ186ER-T1_GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SQJQ186ER-T1_GE3 part is unused and in its original packaging.
Return procedure for SQJQ186ER-T1_GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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