STMicroelectronics ST25DV04KC-IE8T3
- Part No.:
- ST25DV04KC-IE8T3
- Manufacturer:
- STMicroelectronics
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- 8-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
ST25DV04KC-IE8T3.pdf
- Description:
- MEMORY
- Quantity:
- Payment:

- Shipping:

Inventory:1,241
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ST25DV04KC-IE8T3 from STMicroelectronics is a dynamic NFC/RFID tag IC with 4-Kbit EEPROM, dual I²C and ISO/IEC 15693 contactless interfaces, 1.8–5.5 V supply, 256-byte fast-transfer buffer, and energy harvesting output (VEH). It serves as a secure, field-powered memory bridge in smart labels, industrial asset tags, and IoT sensor nodes requiring battery-free data exchange.
For engineers reviewing the ST25DV04KC-IE8T3 datasheet, ST25DV04KC-IE8T3 pinout, ST25DV04KC-IE8T3 application, or ST25DV04KC-IE8T3 equivalent, key selection criteria include RF/I²C coexistence timing, 4-byte block vs. byte addressing alignment, GPO interrupt configurability for field-change detection, and LPD-enabled low-power mode support in WLCSP10/UFDFPN12 packages.
Technical Context
This device implements a dual-interface architecture: the I²C interface operates as a standard 1 MHz serial EEPROM slave with byte-level access, while the RF interface complies fully with ISO/IEC 15693 and NFC Forum Type 5, supporting all modulations, coding schemes, subcarrier modes, and data rates up to 53 Kbit/s. Internal tuning capacitance is fixed at 28.5 pF for antenna matching.
The 256-byte volatile mailbox enables deterministic fast transfer between interfaces without host intervention; GPO supports mixed-event triggering (RF field change, memory write completion, fast transfer notification) and is configurable as open-drain (SO8/TSSOP8/UFDFPN8) or CMOS (WLCSP10/UFDFPN12), with VDCG required for CMOS drive.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 4-Kbit EEPROM = 512 bytes via I²C / 128 blocks × 4 bytes via RF |
| I²C interface speed | Up to 1 MHz - enables high-throughput wired configuration without bus contention |
| RF data rate | Up to 53 Kbit/s (fast read) - reduces NFC reader dwell time in high-throughput tagging |
| Write endurance | 1 million cycles at 25 °C - supports frequent firmware or calibration updates in field-deployed assets |
| Data retention | 40 years - ensures long-term integrity of calibration, serial, or configuration data |
| Supply voltage range | 1.8 V to 5.5 V - compatible with 1.8 V logic systems and legacy 3.3 V/5 V microcontrollers |
| Energy harvesting output | VEH analog pin - delivers unregulated RF-derived voltage to power external sensors or comparators |
Pinout & Package
ST25DV04KC-IE8T3 is supplied in TSSOP8 package (ECOPACK2, RoHS-compliant), featuring 8-pin surface-mount footprint with exposed pad (EP). Pin functions are validated per DS13519 Rev 8 Figures 3 and 4.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VEH | Energy harvesting analog output | Delivers unregulated RF-derived voltage; high-Z when field insufficient or EH disabled |
| AC0 / AC1 | RF antenna coil terminals | Differential inputs for ISO/IEC 15693-compatible LC tank; no DC bias or external coupling |
| VSS | Ground reference | Common return for VCC, VDCG, and VEH; must be low-impedance |
| VCC | DC supply input | 1.8–5.5 V wired power; internal regulator isolates VCC from RF rectified supply |
| GPO | Configurable interrupt output | Open-drain output; requires external pull-up >4.7 kΩ; signals RF field change, write completion |
| SCL | I²C clock input | Master-generated clock; open-drain compatible; internal pull-down inactive during operation |
| SDA | I²C bidirectional data | Open-drain I/O; wire-OR capable; requires external pull-up to VCC |
Key Features
| Feature | Design Value |
|---|---|
| NFC Forum Type 5 certification | Guarantees interoperability with certified readers across mobile, retail, and industrial NFC ecosystems |
| 256-byte fast-transfer buffer | Enables atomic handoff of up to 256 bytes between I²C host and RF reader without software coordination |
| Four configurable memory areas | Allows independent read/write protection per area using three 64-bit RF passwords and one I²C password |
| LPD pin support (not on TSSOP8) | Reduces standby current below 1 µA in WLCSP10/UFDFPN12 packages by disabling internal 1.8 V regulator |
| System configuration password protection | Secures UID, AFI, DSFID, and ENDA registers against unauthorized reconfiguration or cloning |
Applications
| Smart Industrial Labels | Medical Device Calibration Tags |
|---|---|
|
Use Scenario: Reusable metal-mounted labels on CNC tooling or robotic end-effectors store calibration offsets, usage counters, and maintenance logs. IC Role / Device Role / Timing Role: Dual-interface EEPROM bridging factory-programmed I²C data with field-updated RF-accessible parameters. Use Value: Eliminates manual scanning or wired connection for recalibration; 40-year data retention ensures traceability over equipment lifetime. |
Use Scenario: Sterilizable RFID tags attached to surgical instruments log autoclave cycles, calibration dates, and firmware versions. IC Role / Device Role / Timing Role: Secure, field-powered memory with password-protected memory areas isolating calibration data from operational logs. Use Value: Enables audit-ready compliance reporting without battery replacement; 125 °C-rated SO8N variant supports repeated sterilization. |
| IoT Sensor Node Identity Modules | Automotive Aftermarket Diagnostic Tokens |
|
Use Scenario: Compact environmental sensors use ST25DV04KC-IE8T3 to store unique ID, factory calibration coefficients, and firmware revision. IC Role / Device Role / Timing Role: Energy harvesting output powers external temperature/humidity sensor during NFC interrogation. Use Value: Enables zero-power identity and calibration retrieval via smartphone NFC - no battery or wired interface needed. |
Use Scenario: OBD-II dongles embed ST25DV04KC-IE8T3 to store vehicle-specific configuration profiles, ECU firmware hashes, and technician access logs. IC Role / Device Role / Timing Role: GPO pin signals RF field presence to wake microcontroller only during valid diagnostic session. Use Value: Reduces parasitic drain in parked vehicles; I²C interface allows secure profile update during service bay programming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-interface NFC tag applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ST25DV16KC-IE8T3 | 16-Kbit EEPROM (2048 bytes / 512 RF blocks); identical pinout and feature set | Required where larger configuration storage or multi-sensor parameter sets exceed 4-Kbit capacity | Select when future-proofing memory headroom is critical and board layout accommodates same TSSOP8 footprint |
| NXH3670UK/N1Z | NXP HF RFID tag with 2-Kbit EEPROM, no I²C interface, no energy harvesting, no GPO | Limited to pure contactless use cases; lacks wired configuration, event signaling, or peripheral powering capability | Choose only for cost-sensitive, single-interface NFC label applications without host MCU integration needs |
Compared with ST25DV16KC-IE8T3, this part trades memory density for lower cost and smaller footprint in constrained-space designs; versus NXH3670UK/N1Z, it adds I²C programmability, GPO-driven system wake-up, and energy harvesting - enabling true hybrid wired/wireless embedded architectures.
Availability
ST25DV04KC-IE8T3 is available at Aetrix Electronics and suitable for smart industrial labels, medical calibration tags, IoT sensor identity modules, and automotive diagnostic tokens requiring stable component supply across extended temperature ranges and lifecycle-critical deployments.
Supply support for ST25DV04KC-IE8T3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and connectivity solutions for industrial, automotive, and consumer markets.
ST25DVxxKC belongs to ST's Dynamic NFC/RFID tag product line, engineered specifically to unify wired I²C configuration with contactless ISO/IEC 15693 data access - targeting applications needing secure, field-powered memory with host MCU integration.
FAQ
What is the function of the VEH pin, and what load can it drive?
The VEH pin provides an unregulated analog voltage derived from the RF field strength, usable to power low-current external components such as comparators, temperature sensors, or reset supervisors. Its output voltage scales with RF field amplitude and coil tuning but is not regulated; typical peak output is ~1.8 V under strong field conditions. Maximum recommended load is 10 µA continuous to avoid collapse of the harvested voltage or interference with RF communication.
How does memory addressing differ between I²C and RF interfaces?
I²C accesses user memory as a linear byte array (0x0000–0x01FF for ST25DV04KC), supporting sequential reads/writes without wraparound. RF accesses the same memory as 4-byte blocks (0x0000–0x007F), where each command reads or writes one or more full blocks. Extended RF commands allow full memory access; standard commands are limited to block 0x00–0xFF. The mapping is deterministic: RF block N contains I²C bytes (N×4) through (N×4)+3.
Can the GPO pin be used to wake a host microcontroller from deep sleep?
Yes - the GPO pin can be configured to assert on RF field detection, memory write completion, or fast transfer events. In TSSOP8, it operates as an open-drain output requiring an external pull-up resistor; the host MCU's external interrupt pin can monitor GPO state change. This enables zero-power listening: the host remains in deep sleep until GPO transitions, eliminating polling overhead and reducing system power consumption significantly.
Is the UID truly unique, and how is it programmed?
Yes - each ST25DV04KC-IE8T3 device has a factory-programmed 64-bit UID compliant with ISO/IEC 15693, written during wafer sort and permanently stored in the system configuration area. It is read-only, cannot be altered in the field, and is used during the anticollision inventory sequence. The UID value is laser-trimmed and verified per unit; no two devices share the same UID, ensuring globally unique identification in multi-tag environments.
ST25DV04KC-IE8T3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- 8-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- RFID Transponder
- Frequency:
- 13.56MHz
- Standards:
- ISO 15693, NFC
- Interface:
- I2C
- Voltage - Supply:
- 1.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-TSSOP
ST25DV04KC-IE8T3 FAQ
1.How can I place an order for ST25DV04KC-IE8T3 through Aetrix?
Please submit a Request for Quotation (RFQ) for ST25DV04KC-IE8T3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ST25DV04KC-IE8T3 reliable?
The price and inventory of ST25DV04KC-IE8T3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ST25DV04KC-IE8T3 is usually 5 days.
3.What payment methods are accepted for ST25DV04KC-IE8T3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ST25DV04KC-IE8T3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ST25DV04KC-IE8T3?
ST25DV04KC-IE8T3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ST25DV04KC-IE8T3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ST25DV04KC-IE8T3?
For technical support, including ST25DV04KC-IE8T3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ST25DV04KC-IE8T3 requirements.
6.How does Aetrix verify that ST25DV04KC-IE8T3 is sourced from the original manufacturer or authorized distributors?
All ST25DV04KC-IE8T3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ST25DV04KC-IE8T3 meets industry standards.
7.What is the process for return or replacement of ST25DV04KC-IE8T3?
All ST25DV04KC-IE8T3 units undergo pre-shipment inspection (PSI). If there is an issue with ST25DV04KC-IE8T3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ST25DV04KC-IE8T3 part is unused and in its original packaging.
Return procedure for ST25DV04KC-IE8T3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ST25DV04KC-IE8T3 Tags

-
SL2S2602FTBX
NXP Semiconductors

-
ST25DV04K-IER6S3
STMicroelectronics

-
ST25DV04K-IER6C3
STMicroelectronics

-
LXMSJZNCMD-217
Murata Electronics

-
NT3H2111W0FTTJ
NXP Semiconductors

-
NT3H2111W0FHKH
NXP Semiconductors

-
M24LR04E-RMC6T/2
STMicroelectronics

-
ST25DV04KC-JF6D3
STMicroelectronics

-
ST25DV64KC-IE6S3
STMicroelectronics
-
ST25DV64K-IER6T3
STMicroelectronics

-
NT3H2211W0FTTJ
NXP Semiconductors

-
NT3H2211W0FHKH
NXP Semiconductors
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
