STMicroelectronics ST25DV04K-IER8C3
- Part No.:
- ST25DV04K-IER8C3
- Manufacturer:
- STMicroelectronics
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- 8-UFDFN Exposed Pad
- Datasheet:
-
ST25DV04K-IER8C3.pdf
- Description:
- IC RFID TRANSP 13.56MHZ 8UFDFPN
- Quantity:
- Payment:

- Shipping:

Inventory:4,994
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ST25DV04K-IER8C3 from STMicroelectronics is a dynamic NFC/RFID tag IC with 4-Kbit EEPROM, dual I²C and ISO/IEC 15693 contactless interfaces, 1.8–5.5 V supply, 256-byte fast-transfer buffer, and energy harvesting output (VEH). It serves as a secure, field-powered memory bridge in smart labels, industrial asset tags, and IoT sensor nodes requiring battery-free data exchange.
For engineers reviewing the ST25DV04K-IER8C3 datasheet, ST25DV04K-IER8C3 pinout, ST25DV04K-IER8C3 application, or ST25DV04K-IER8C3 equivalent, key selection criteria include RF/I²C dual-interface timing coordination, GPO interrupt configuration for RF activity detection, 4-Kbit user memory partitioning into four password-protected areas, and compatibility with NFC Forum Type 5 certification requirements.
Technical Context
The device implements a dual-domain architecture: an I²C slave interface (up to 1 MHz) accesses EEPROM byte-wise, while the ISO/IEC 15693 RF interface accesses memory in 4-byte blocks at up to 53 Kbit/s. Its internal 28.5 pF tuning capacitance enables direct antenna coil connection without external matching components.
Fast Transfer Mode uses a dedicated 256-byte volatile buffer to synchronize data between RF and I²C domains; GPO supports configurable interrupts (field change, write completion, mailbox availability) with open-drain output; energy harvesting delivers unregulated analog voltage (VEH) when RF field strength permits.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 4-Kbit EEPROM = 512 bytes via I²C, 128 blocks × 4 bytes via RF |
| I²C interface speed | Up to 1 MHz - enables high-speed wired host communication without bus contention |
| RF interface standard | ISO/IEC 15693 & NFC Forum Type 5 certified - ensures interoperability with commercial NFC readers |
| Write endurance | 1 million cycles at 25 °C - supports frequent firmware/data updates in maintenance applications |
| Data retention | 40 years - guarantees long-term integrity of calibration data or device identity stored in EEPROM |
| Supply voltage range | 1.8 V to 5.5 V - compatible with both low-voltage microcontrollers and legacy 3.3/5 V systems |
| Energy harvesting output | VEH analog pin - powers external sensors or logic when RF field is active and sufficient |
Pinout & Package
ST25DV04K-IER8C3 is packaged in UFDFPN8 (8-pin, 2 × 2 mm, 0.5 mm pitch), RoHS-compliant ECOPACK2, with exposed pad (EP) and open-drain GPO output.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | DC power supply input | Accepts 1.8–5.5 V; powers I²C interface and internal regulator; isolated from RF rectified supply |
| VSS | Ground reference | Common return for VCC, VDCG, and VEH; must be low-impedance for stable RF operation |
| SCL | I²C clock input | Open-drain compatible; requires external pull-up; synchronizes byte transfers at up to 1 MHz |
| SDA | I²C bidirectional data | Open-drain I/O; shares bus with other slaves; pull-up required per I²C specification |
| GPO | Configurable interrupt output | Open-drain; signals RF field presence, memory write completion, or mailbox events; requires ≥4.7 kΩ pull-up |
| VEH | Energy harvesting analog output | Unregulated analog voltage sourced from RF field; high-Z when inactive or insufficient field strength |
| AC0 / AC1 | Antenna coil terminals | Differential RF input; connect directly to tuned LC antenna; no DC bias or external components permitted |
| EP | Exposed thermal pad | Must be left floating or grounded per PCB layout guidelines; improves thermal dissipation and EMI performance |
Key Features
| Feature | Design Value |
|---|---|
| Fast Transfer Mode buffer | 256-byte volatile mailbox enables deterministic, low-latency data handoff between RF and I²C domains |
| Four-area memory protection | User memory partitioned into 4 configurable zones, each independently protected by 64-bit RF/I²C passwords |
| NFC Forum Type 5 certification | Guarantees out-of-box compatibility with Android NFC hosts and enterprise RFID infrastructure |
| Dynamic register access | Real-time status reporting (e.g., RF activity, field strength, mailbox full) via I²C or RF read commands |
| Low-power RF boot | tBootRF < 1 ms - enables rapid response to reader polling in duty-cycled sensor applications |
Applications
| Smart Industrial Labels | Secure Asset Tracking Tags |
|---|---|
Use Scenario: Permanent mounting on factory machinery for maintenance logs, calibration history, and firmware version storage. IC Role / Device Role / Timing Role: Dual-interface EEPROM bridge: I²C writes configuration during service; RF reads diagnostics during handheld scan. Use Value: Eliminates battery dependency; 40-year data retention preserves equipment lifecycle records; password-protected areas prevent unauthorized firmware overwrite. | Use Scenario: Tamper-evident tagging of high-value tools or medical devices across hospital logistics networks. IC Role / Device Role / Timing Role: Secure NFC tag with UID and AFI/DSFID registers: enables anticollision inventory and application-family filtering in multi-tag environments. Use Value: NFC Forum Type 5 compliance ensures Android compatibility; four password-protected memory areas isolate audit logs, ownership data, and usage counters. |
| IoT Sensor Node Identity | Energy-Harvesting Edge Devices |
Use Scenario: Embedding in wireless temperature/humidity sensors deployed in HVAC ducts or remote enclosures. IC Role / Device Role / Timing Role: Persistent identity store: holds unique UID, calibration coefficients, and last-seen timestamp accessible via I²C at boot and RF on demand. Use Value: Factory-programmed UID ensures traceability; 1 million write cycles support daily recalibration logging; RF read avoids physical connector wear. | Use Scenario: Battery-free environmental monitor powered solely by NFC reader field during periodic data upload. IC Role / Device Role / Timing Role: Energy harvesting source: VEH pin supplies 1.2–3.3 V to ultra-low-power MCU or ADC during RF activation. Use Value: Enables zero-battery operation; unregulated VEH output matches typical LDO input range; fast RF boot (<1 ms) minimizes field-on time and reader power draw. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dynamic NFC tag applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ST25DV16K-IER8C3 | 16-Kbit EEPROM (2048 bytes), same pinout and feature set | Supports larger configuration datasets or multi-sensor fusion metadata storage | Select when >512 bytes of persistent, field-accessible memory is required without changing PCB layout |
| NXH3670UK/V1 | Single-interface NFC tag IC (RF only), no I²C, 1-Kbit memory, integrated antenna driver | Lacks wired interface; targets pure contactless use cases with minimal footprint | Choose only if I²C host control is unnecessary and board space is constrained beyond UFDFPN8 limits |
Compared with ST25DV16K-IER8C3, this part reduces memory cost and power overhead where 4-Kbit suffices; versus NXH3670UK/V1, it adds critical I²C configurability and larger secure storage but requires additional routing for SDA/SCL/GPO.
Availability
ST25DV04K-IER8C3 is available at Aetrix Electronics and suitable for smart label deployment, industrial asset tracking, IoT sensor identity management, and energy-harvesting edge devices requiring stable component supply across production lifecycles.
Supply support for ST25DV04K-IER8C3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in microcontrollers, power management, sensors, and secure connectivity solutions for industrial, automotive, and consumer markets.
The ST25DV family targets secure, dual-interface NFC data exchange-designed to replace mechanical DIP switches and passive tags with programmable, field-upgradable memory in maintenance-critical and battery-constrained systems.
FAQ
What is the function of the VEH pin, and what voltage range can it deliver?
VEH is an unregulated analog energy harvesting output that delivers voltage derived from the RF carrier field. Its output depends on antenna coupling, field strength, and tuning; typical values range from ~1.2 V to 3.3 V under strong NFC reader fields. When the RF field is absent or insufficient, VEH enters high-impedance state and supplies no current.
How does memory protection work across I²C and RF interfaces?
User memory is divided into up to four configurable areas, each protected by independent 64-bit passwords: three for RF read/write access and one for I²C write access. The system configuration area (including ENDA registers and UID) is secured by a separate 64-bit configuration password accessible via both interfaces, preventing unauthorized re-partitioning or UID modification.
Can ST25DV04K-IER8C3 operate without a DC supply (VCC)?
Yes-it functions fully in contactless mode using only RF power. The internal rectifier and regulator generate all necessary voltages from the AC0/AC1 antenna inputs. VCC is optional and used only when wired I²C communication or GPO-driven wake-up of a host MCU is required during RF idle periods.
What is the purpose of the GPO pin, and how is it configured?
GPO is a configurable open-drain interrupt output signaling RF events: field detection, memory write completion, Fast Transfer readiness, or custom pulses. Configuration is done via I²C-accessible GPO_CTRL registers; default behavior is RF field change detection. An external pull-up resistor (>4.7 kΩ) is mandatory for proper logic-level operation.
ST25DV04K-IER8C3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- ST25D
- Package/Case:
- 8-UFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- RFID Transponder
- Frequency:
- 13.56MHz
- Standards:
- ISO 15693, NFC
- Interface:
- I2C
- Voltage - Supply:
- 1.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-UFDFPN (2x3)
ST25DV04K-IER8C3 FAQ
1.How can I place an order for ST25DV04K-IER8C3 through Aetrix?
Please submit a Request for Quotation (RFQ) for ST25DV04K-IER8C3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ST25DV04K-IER8C3 reliable?
The price and inventory of ST25DV04K-IER8C3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ST25DV04K-IER8C3 is usually 5 days.
3.What payment methods are accepted for ST25DV04K-IER8C3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ST25DV04K-IER8C3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ST25DV04K-IER8C3?
ST25DV04K-IER8C3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ST25DV04K-IER8C3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ST25DV04K-IER8C3?
For technical support, including ST25DV04K-IER8C3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ST25DV04K-IER8C3 requirements.
6.How does Aetrix verify that ST25DV04K-IER8C3 is sourced from the original manufacturer or authorized distributors?
All ST25DV04K-IER8C3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ST25DV04K-IER8C3 meets industry standards.
7.What is the process for return or replacement of ST25DV04K-IER8C3?
All ST25DV04K-IER8C3 units undergo pre-shipment inspection (PSI). If there is an issue with ST25DV04K-IER8C3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ST25DV04K-IER8C3 part is unused and in its original packaging.
Return procedure for ST25DV04K-IER8C3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ST25DV04K-IER8C3 Tags

-
SL2S2602FTBX
NXP Semiconductors

-
ST25DV04K-IER6S3
STMicroelectronics

-
ST25DV04K-IER6C3
STMicroelectronics

-
LXMSJZNCMD-217
Murata Electronics

-
NT3H2111W0FTTJ
NXP Semiconductors

-
NT3H2111W0FHKH
NXP Semiconductors

-
M24LR04E-RMC6T/2
STMicroelectronics

-
ST25DV04KC-JF6D3
STMicroelectronics

-
ST25DV64KC-IE6S3
STMicroelectronics
-
ST25DV64K-IER6T3
STMicroelectronics

-
NT3H2211W0FTTJ
NXP Semiconductors

-
NT3H2211W0FHKH
NXP Semiconductors
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
