Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > RF and Wireless > RFID, RF Access, Monitoring ICs

STMicroelectronics ST25DV64KC-IE8T3

Name: ST25DV64KC-IE8T3
Brand: STMicroelectronics
SKU: ST25DV64KC-IE8T3
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: ST25DV64KC-IE8T3

Manufacturer:: STMicroelectronics

Category:: RFID, RF Access, Monitoring ICs

Package:: 8-TSSOP (0.173", 4.40mm Width)

Datasheet:: ST25DV64KC-IE8T3.pdf

Description:: DYNAMIC NFC/RFID TAG IC WITH 64-

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:2,342

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

ST25DV64KC-IE8T3 from STMicroelectronics is a dynamic NFC/RFID tag IC with 64-Kbit EEPROM, dual I²C and ISO/IEC 15693 contactless interfaces, fast transfer mode (256-byte buffer), energy harvesting output (V_E_H), and configurable GPO interrupt. It operates from 1.8–5.5 V, supports 1 MHz I²C, and delivers 40-year data retention at 1 million write cycles (25 °C). Used in smart packaging, industrial asset tagging, and secure device configuration where wired + wireless memory access is required.

For engineers reviewing the ST25DV64KC-IE8T3 datasheet, ST25DV64KC-IE8T3 pinout, ST25DV64KC-IE8T3 application, or ST25DV64KC-IE8T3 equivalent, key selection criteria include RF/I²C coexistence timing, GPO event configurability (field change, fast transfer completion), block-vs-byte addressing mapping, and LPD-enabled low-power operation in WLCSP10/UFDFPN12 packages.

Technical Context

The ST25DV64KC-IE8T3 integrates two independent memory access paths: I²C interface addresses user memory byte-wise (8192 bytes), while RF interface accesses it block-wise (2048 blocks × 4 bytes) per ISO/IEC 15693. Its 256-byte volatile fast-transfer buffer enables synchronous data exchange between interfaces without host intervention.

It implements dual protection architecture: three 64-bit RF passwords and one 64-bit I²C password for user memory areas, plus separate 64-bit system configuration password. The analog energy harvesting output (V_E_H) delivers unregulated voltage under sufficient RF field strength, enabling passive peripheral power.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory capacity	64 Kbit EEPROM = 8192 bytes (I²C) / 2048 blocks × 4 bytes (RF)
I²C interface speed	Up to 1 MHz - enables high-speed configuration and firmware patching via microcontroller
RF protocol compliance	ISO/IEC 15693 & NFC Forum Type 5 certified - ensures interoperability with standard NFC readers
Write endurance	1 million cycles at 25 °C - supports frequent reprogramming in field-upgradable systems
Data retention	40 years at 25 °C - guarantees long-term data integrity in maintenance-free deployments
Supply voltage range	1.8 V to 5.5 V - compatible with battery-powered, USB, and industrial 3.3/5 V rails
Fast transfer buffer	256-byte dedicated volatile mailbox - eliminates polling overhead during RF↔I²C data handoff

Pinout & Package

ST25DV64KC-IE8T3 is supplied in SO8N (8-pin narrow SOIC) package with open-drain GPO output and no LPD/VDCG pins. Package meets ECOPACK2 RoHS requirements and includes exposed pad (EP) left floating.

Pin/Terminal	Circuit Role	Design Meaning
V_EH	Energy harvesting analog output	Delivers unregulated RF-derived voltage to power external sensors or logic; high-Z when inactive
AC0 / AC1	RF antenna coil terminals	Differential inputs for external LC tank; internal 28.5 pF tuning capacitance reduces external component count
V_SS	Ground reference	Common return for V_CC, V_EH, and analog RF front-end; must be low-impedance
V_CC	DC supply input	1.8–5.5 V DC power source; internal regulator isolates I²C domain from RF rectified supply
GPO	Configurable interrupt output	Open-drain output requiring external pull-up; signals RF field detection, memory write completion, or fast transfer events
SCL	I²C clock input	Master-generated clock; requires external pull-up; supports 1 MHz operation with proper bus capacitance
SDA	I²C bidirectional data	Open-drain I/O shared across multiple devices; pull-up resistor mandatory for bus arbitration

Key Features

Feature	Design Value
ISO/IEC 15693 fast read	Up to 53 Kbit/s - reduces reader dwell time in high-throughput logistics scanning
Four configurable memory areas	Each independently protected by RF/I²C passwords - enables multi-tier security (e.g., public ID + encrypted config + firmware + logs)
Dynamic register access	Real-time status reporting (RF activity, mailbox full, field strength) via I²C or RF - eliminates polling latency
Low-power mode support	LPD pin available in WLCSP10/UFDFPN12 - reduces standby current below 1 µA for battery-constrained designs
NFC Forum Type 5 certification	Guaranteed interoperability with Android/iOS NFC stacks - enables out-of-box smartphone commissioning

Applications

Smart Packaging Authentication

Industrial Asset Tagging

Use Scenario: Tamper-evident pharmaceutical blister pack with embedded NFC tag scanned by smartphone at point of sale.

IC Role / Device Role / Timing Role: Dual-interface memory storing batch ID, expiry date, and digital signature; I²C pre-programmed during packaging line, RF read by consumer app.

Use Value: Prevents counterfeiting via cryptographic challenge-response using stored passwords and UID; energy harvesting powers on-chip logic during scan without battery.

Use Scenario: High-temperature motor housing with metal-mount RFID tag accessed by handheld reader during predictive maintenance checks.

IC Role / Device Role / Timing Role: Robust EEPROM storing calibration coefficients, service history, and thermal derating curves; RF interface survives EMI-rich environments; I²C updated during factory programming.

Use Value: 125 °C-rated SO8N package ensures reliability; 40-year data retention preserves lifetime asset records; GPO pulses signal successful write to maintenance tool.

Secure IoT Device Onboarding

Automotive Component Configuration

Use Scenario: Wireless sensor node powered by harvested RF energy during provisioning, then configured via I²C before deployment.

IC Role / Device Role / Timing Role: Fast transfer buffer synchronizes Wi-Fi credentials (written via RF) with MCU boot parameters (read via I²C); V_E_H powers level shifter during handshake.

Use Value: Eliminates manual wiring or QR code entry; 256-byte mailbox enables atomic credential transfer without host CPU involvement.

Use Scenario: Engine control module with replaceable sensor subassembly requiring calibration data persistence across hot swaps.

IC Role / Device Role / Timing Role: Non-volatile storage of sensor offset/gain values and production test results; accessed simultaneously by ECU (I²C) and diagnostic tool (RF) during service.

Use Value: Dual-interface eliminates need for disassembly to update calibration; password-protected areas prevent unauthorized parameter modification.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dynamic NFC tag applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
ST25DV16KC-IE8T3	16-Kbit EEPROM (2048 bytes), same pinout and feature set	Limited to simpler configurations where <2 KB persistent data suffices	Select when cost sensitivity outweighs memory headroom; identical layout and firmware compatibility
NXH3670UK/NXH3670UK/1	Integrated NFC controller + EEPROM (64 KB), but lacks I²C interface and energy harvesting output	Requires external MCU for host-side logic; no V_E_H-driven peripherals possible	Choose only if standalone NFC reader functionality is primary; not a drop-in replacement for dual-interface use cases

Compared with ST25DV16KC-IE8T3, this part doubles memory for complex firmware metadata or multi-language labels; versus NXH3670UK, it retains critical I²C configurability and energy harvesting-enabling true hybrid wired/wireless system integration.

Availability

ST25DV64KC-IE8T3 is available at Aetrix Electronics and suitable for smart packaging authentication, industrial asset tagging, secure IoT device onboarding, and automotive component configuration requiring stable component supply across extended temperature ranges and dual-interface flexibility.

Supply support for ST25DV64KC-IE8T3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in microcontrollers, power management, sensors, and connectivity solutions for industrial, automotive, and consumer markets.

The ST25DVxxKC product line delivers dynamic NFC/RFID tags optimized for secure, dual-interface memory applications-enabling seamless interaction between embedded systems and NFC-enabled smartphones or readers.

FAQ

What is the maximum RF data rate supported by ST25DV64KC-IE8T3?

The device supports ISO/IEC 15693 high-speed mode up to 53 Kbit/s for custom fast read operations. Standard read/write commands operate at 26.48 Kbit/s (1-out-of-4 coding, 2-subcarrier). This enables rapid inventory scans in logistics or retail environments without compromising compatibility with legacy readers.

How does the fast transfer mode buffer function between I²C and RF interfaces?

The 256-byte volatile buffer acts as a mailbox: data written via I²C can be read via RF (and vice versa) without host CPU intervention. A GPO pulse signals buffer readiness, and the buffer is automatically cleared after RF read or I²C read-ensuring atomic, race-free handoff in real-time systems.

Can ST25DV64KC-IE8T3 operate without a DC supply (V_CC)?

Yes-it functions solely in RF mode when V_CC is unconnected, drawing power from the RF field via AC0/AC1. In this mode, I²C is disabled, but all RF features (memory access, GPO events, energy harvesting) remain fully operational, supporting truly contactless applications.

What is the purpose of the LPD pin, and is it present on ST25DV64KC-IE8T3?

The LPD pin disables the internal 1.8 V regulator to reduce standby current below 1 µA. However, ST25DV64KC-IE8T3 uses the SO8N package, which does not include LPD or VDCG pins. LPD is only available on WLCSP10 and UFDFPN12 variants for ultra-low-power designs.

ST25DV64KC-IE8T3 Specifications

Product attributes: Attribute value

Manufacturer:: STMicroelectronics

Series:: -

Package/Case:: 8-TSSOP (0.173", 4.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Type:: RFID Transponder

Frequency:: 13.56MHz

Standards:: ISO 15693, NFC

Interface:: I2C

Voltage - Supply:: 1.8V ~ 5.5V

Operating Temperature:: -40°C ~ 125°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 8-TSSOP

ST25DV64KC-IE8T3 FAQ

1.How can I place an order for ST25DV64KC-IE8T3 through Aetrix?

Please submit a Request for Quotation (RFQ) for ST25DV64KC-IE8T3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ST25DV64KC-IE8T3 reliable?

The price and inventory of ST25DV64KC-IE8T3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ST25DV64KC-IE8T3 is usually 5 days.

3.What payment methods are accepted for ST25DV64KC-IE8T3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ST25DV64KC-IE8T3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ST25DV64KC-IE8T3?

ST25DV64KC-IE8T3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ST25DV64KC-IE8T3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ST25DV64KC-IE8T3?

For technical support, including ST25DV64KC-IE8T3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ST25DV64KC-IE8T3 requirements.

6.How does Aetrix verify that ST25DV64KC-IE8T3 is sourced from the original manufacturer or authorized distributors?

All ST25DV64KC-IE8T3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ST25DV64KC-IE8T3 meets industry standards.

7.What is the process for return or replacement of ST25DV64KC-IE8T3?

All ST25DV64KC-IE8T3 units undergo pre-shipment inspection (PSI). If there is an issue with ST25DV64KC-IE8T3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ST25DV64KC-IE8T3 part is unused and in its original packaging.

Return procedure for ST25DV64KC-IE8T3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-08 Obsolete Electronic Components: How to Source and Evaluate Replacements

A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…