STMicroelectronics ST25DV64K-IER6S3

Overview

ST25DV64K-IER6S3 from STMicroelectronics is a dynamic NFC/RFID tag IC with dual I²C and ISO/IEC 15693 contactless interfaces, 64 Kbit EEPROM, 256-byte fast-transfer buffer, and energy harvesting output (V_EH). It operates from 1.8–5.5 V, supports 1 MHz I²C, and delivers up to 53 Kbit/s RF read speed. Used in smart labels, industrial asset tags, and IoT sensor nodes requiring secure, battery-free data exchange.

For engineers reviewing the ST25DV64K-IER6S3 datasheet, ST25DV64K-IER6S3 pinout, ST25DV64K-IER6S3 application, or ST25DV64K-IER6S3 equivalent, key selection criteria include RF/I²C coexistence timing, GPO interrupt configuration (open-drain vs. CMOS), LPD-enabled low-power mode, password-protected memory segmentation, and antenna tuning capacitance (28.5 pF).

Technical Context

The device implements a dual-world architecture: I²C interface accesses memory byte-wise for host-controlled configuration and high-speed wired updates; RF interface accesses memory block-wise (4-byte blocks) per ISO/IEC 15693, enabling passive operation powered by reader field. Its 256-byte volatile mailbox enables atomic fast-transfer mode between interfaces without host polling.

RF management includes configurable GPO events (field change, write completion, fast-transfer end), while energy harvesting provides unregulated analog voltage (V_EH) to power external circuitry when RF field strength suffices. Memory protection uses three 64-bit RF passwords and one 64-bit I²C password for user areas, plus dedicated configuration password.

Key Specifications

Pinout & Package

ST25DV64K-IER6S3 is supplied in UFDFPN8 package (8-pin, 2 × 2 mm, 0.5 mm pitch), RoHS-compliant ECOPACK2, with open-drain GPO output and no LPD/VDCG pins - confirming it is the IE-series variant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dynamic NFC tag applications.

Compared with ST25DV16K-IER6S3, this part doubles memory for extended logging and firmware staging; versus NXP NXH3170, it adds I²C configurability, energy harvesting, and secure dual-interface data synchronization - essential for intelligent edge nodes.

Availability

ST25DV64K-IER6S3 is available at Aetrix Electronics and suitable for smart industrial labels, secure asset tracking tags, energy-harvesting sensor nodes, and automotive diagnostic interfaces requiring stable component supply, long-term data retention, and NFC Forum-certified interoperability.

Supply support for ST25DV64K-IER6S3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and connectivity solutions for industrial, automotive, and consumer markets.

The ST25DV family targets intelligent RFID applications requiring secure, dual-interface memory with energy harvesting and fast data bridging - bridging the gap between passive tags and active wireless modules.

FAQ

What is the function of the V_EH pin, and how is it used in system design?

The V_EH pin delivers unregulated analog voltage harvested from the RF field, usable to power low-current external circuitry such as comparators, reset supervisors, or sensor bias networks. It enters high-Z state when RF field is absent or insufficient, requiring external regulation or buffering if powering digital logic. Designers must size external loads to avoid collapsing V_EH below minimum operating voltage of downstream components.

How does the 256-byte fast-transfer buffer improve system responsiveness?

The fast-transfer buffer enables deterministic, low-latency data exchange between I²C and RF domains without host polling or memory mapping overhead. When an RF reader requests data, the buffer contents are transferred atomically - eliminating race conditions during concurrent I²C writes. This reduces average read latency by >60% compared to sequential block reads, critical for real-time diagnostics and firmware staging.

Can the ST25DV64K-IER6S3 operate in both I²C-only and RF-only modes simultaneously?

No - the device cannot actively process I²C and RF commands concurrently. While both interfaces share the same EEPROM, the internal state machine prioritizes RF activity when field is present. During RF operation, I²C transactions are suspended until RF field deactivates or explicit RF disable command is issued via I²C register. This prevents memory corruption but requires host coordination for hybrid-mode sequencing.

What are the implications of the 28.5 pF internal tuning capacitance for antenna design?

The integrated 28.5 pF capacitor reduces external component count and improves production consistency by absorbing typical PCB parasitic capacitance variations. Designers select antenna inductance to resonate at 13.56 MHz with this fixed capacitance - typically 0.8–1.2 µH for standard etched loops. This eliminates trim capacitors and calibration steps, shortening time-to-market for NFC-enabled products.