STMicroelectronics ST25DV64K-IER8T3
- Part No.:
- ST25DV64K-IER8T3
- Manufacturer:
- STMicroelectronics
- Category:
- RFID, RF Access, Monitoring ICs
- Package:
- 8-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
ST25DV64K-IER8T3.pdf
- Description:
- IC RFID TRANSP 13.56MHZ 8TSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
ST25DV64K-IER8T3 from STMicroelectronics is a dynamic NFC/RFID tag IC with dual I²C and ISO/IEC 15693 contactless interfaces, 64 kbit EEPROM, 256-byte fast-transfer buffer, and energy harvesting output (VEH). It operates from 1.8–5.5 V, supports 1 MHz I²C, and delivers up to 53 Kbit/s RF read speed. Used in smart labels, industrial asset tags, and IoT sensor nodes requiring secure, battery-free configuration.
For engineers reviewing the ST25DV64K-IER8T3 datasheet, ST25DV64K-IER8T3 pinout, ST25DV64K-IER8T3 application, or ST25DV64K-IER8T3 equivalent, key selection criteria include RF/I²C coexistence timing, GPO interrupt configurability (open-drain), 40-year data retention, and password-protected memory segmentation across four user areas.
Technical Context
The device integrates two independent data paths: an I²C interface accessing memory byte-wise and an RF interface accessing 4-byte blocks per command under ISO/IEC 15693 and NFC Forum Type 5 compliance. Its analog front end includes 28.5 pF internal tuning capacitance and supports all ISO/IEC 15693 modulation modes and sub-carrier frequencies.
Fast Transfer Mode uses a dedicated 256-byte volatile buffer to synchronize data between RF and I²C domains without host intervention. The GPO pin-configured as open-drain in this variant-signals RF field change, memory write completion, or mailbox activity, enabling low-latency system wake-up or status monitoring.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory capacity | 64 kbit EEPROM (8192 bytes via I²C; 2048 blocks × 4 bytes via RF) |
| I²C interface speed | Up to 1 MHz - enables high-throughput wired configuration without bus contention |
| RF data rate | Up to 53 Kbit/s (fast read) - reduces tag interrogation time in high-speed logistics scanning |
| Data retention | 40 years at 25 °C - ensures long-term firmware or calibration data integrity in unpowered deployments |
| Write endurance | 1 million cycles at 25 °C; 400 k at 125 °C - supports frequent reprogramming in thermal-stressed industrial environments |
| Operating voltage | 1.8–5.5 V - compatible with wide-range microcontroller I/O rails and legacy 5 V systems |
| Energy harvesting | VEH analog output - powers external sensors or logic from RF field, eliminating need for local battery |
Pinout & Package
ST25DV64K-IER8T3 is supplied in an 8-pin TSSOP8 package (ECOPACK2, RoHS-compliant) with open-drain GPO output and no LPD/VDCG pins. Pin functions are validated per STMicroelectronics DS10925 Rev 11 (Figure 2).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Supply voltage input | Accepts 1.8–5.5 V DC; powers internal regulator and I²C logic; isolates RF rectified supply |
| VSS | Ground reference | Common return for VCC, VEH, and RF analog circuitry; must be low-impedance |
| SCL | I²C clock input | Open-drain compatible; requires external pull-up; synchronizes byte transfers with host controller |
| SDA | I²C bidirectional data | Open-drain I/O; shares bus with other devices; pull-up required for proper signal level restoration |
| GPO | Configurable interrupt output | Open-drain output; signals RF field detection, write completion, or mailbox events; requires external pull-up >4.7 kΩ |
| VEH | Energy harvesting analog output | Unregulated analog voltage sourced from RF coil; active only during sufficient field strength; high-Z when inactive |
| AC0 / AC1 | RF antenna connection | Differential inputs for external LC tank; no DC bias or additional AC paths permitted; tuned to 13.56 MHz |
Key Features
| Feature | Design Value |
|---|---|
| ISO/IEC 15693 & NFC Forum Type 5 certified | Guarantees interoperability with standard NFC readers and mobile phones without custom driver development |
| Four configurable password-protected memory areas | Enables granular access control: e.g., Area 1 for public calibration data (read-only), Area 3 for encrypted firmware (write-protected by 64-bit RF password) |
| 256-byte fast-transfer buffer (Mailbox) | Eliminates host polling: RF writes trigger GPO interrupt, allowing I²C host to fetch full 256-byte payload in single burst |
| Dynamic registers accessible via both interfaces | Permits real-time status monitoring (e.g., RF activity flag) and runtime feature enable/disable without memory rewrite |
| Factory-programmed 64-bit UID | Provides globally unique identifier compliant with ISO 15693 anticollision protocol; immutable and traceable across lifecycle |
Applications
| Smart Industrial Labels | Secure Asset Tracking Tags |
|---|---|
Use Scenario: Reusable metal-mount label on CNC tooling, updated wirelessly with usage count and calibration offsets. IC Role / Device Role / Timing Role: Dual-interface EEPROM storing tool ID, wear metrics, and firmware patches; RF updates performed during machine idle; I²C reads during setup. Use Value: Eliminates manual barcode scanning and physical connector wear; 40-year retention preserves lifetime tool history without battery dependency. | Use Scenario: Tamper-evident RFID tag on medical imaging equipment, logging service events and software version changes. IC Role / Device Role / Timing Role: Secure memory partitioned into read-only audit log (Area 1), write-protected config (Area 2), and encrypted service key storage (Area 3). Use Value: Three independent 64-bit RF passwords prevent unauthorized access to sensitive fields while enabling authenticated field technician updates. |
| IoT Sensor Node Configuration | Automotive Aftermarket Diagnostic Module |
Use Scenario: Battery-free environmental sensor node powered via NFC reader; stores calibration coefficients and threshold alerts. IC Role / Device Role / Timing Role: Energy harvesting output (VEH) powers external ADC and temperature sensor; RF writes new thresholds; I²C reads current values during wake-up. Use Value: VEH delivers usable analog voltage from reader field, enabling zero-battery operation and eliminating maintenance cycles. | Use Scenario: OBD-II dongle with embedded ST25DV64K storing vehicle-specific firmware, VIN binding, and diagnostic history. IC Role / Device Role / Timing Role: I²C interface loads firmware patches from MCU; RF interface allows dealership-level updates via handheld NFC tool without disassembly. Use Value: Fast Transfer Mode moves 256-byte firmware fragments in one RF transaction, reducing update time from seconds to sub-100 ms per block. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dynamic NFC tag applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ST25DV16K-IER8T3 | 16 kbit EEPROM (2048 bytes); identical pinout, package, and feature set except memory size | Suitable where firmware/config footprint <2 kB; lower cost and smaller die area | Select when total stored data fits within 2048 bytes and BOM cost sensitivity outweighs future scalability needs |
| NXH3670UK/N1Z | Integrated NFC controller + ARM Cortex-M0+; 128 kB flash; no EEPROM; requires external antenna matching | Enables local processing (e.g., sensor fusion) but lacks non-volatile EEPROM persistence without external memory | Choose when edge computation is required and system can accommodate larger footprint, higher power, and added design complexity |
Compared with ST25DV16K-IER8T3, the ST25DV64K-IER8T3 provides 4× more EEPROM for extended firmware logs or multi-parameter calibration tables; versus NXH3670, it offers simpler integration, zero-power persistence, and deterministic RF/I²C coexistence-but no onboard processing.
Availability
ST25DV64K-IER8T3 is available at Aetrix Electronics and suitable for smart label deployment, industrial asset tagging, IoT sensor node configuration, and automotive aftermarket diagnostics requiring stable component supply across multi-year production cycles.
Supply support for ST25DV64K-IER8T3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power management ICs, sensors, and connectivity solutions for industrial, automotive, and consumer markets.
The ST25DVxxx product line targets secure, battery-free identification and configuration in harsh or space-constrained environments, combining NFC interoperability with robust EEPROM reliability and dual-interface flexibility.
FAQ
What is the function of the VEH pin, and what load can it drive?
The VEH pin delivers unregulated analog voltage harvested from the RF field, active only when field strength exceeds operational threshold. It is not a regulated power rail and cannot drive loads exceeding 1 mA; typical use is biasing low-power comparators or enabling ultra-low-quiescent LDOs for auxiliary sensors. No external capacitor is required, but layout must minimize parasitic capacitance to preserve fast turn-on response.
How does the GPO pin behave during RF field detection, and what pull-up value is required?
In ST25DV64K-IER8T3 (open-drain variant), GPO asserts low upon RF field detection, memory write completion, or Fast Transfer end-configurable via dynamic registers. It requires an external pull-up resistor ≥4.7 kΩ to VCC; values >10 kΩ increase rise time and may cause missed interrupts in high-noise environments. Default mode is RF field change detection, and pulse duration is fixed at 10 µs unless modified via Manage GPO command.
Can the same memory address be accessed simultaneously via I²C and RF interfaces?
No-simultaneous access is blocked by hardware arbitration. When I²C is active, RF commands are ignored until I²C Stop condition is detected and internal write cycle completes (tW ≤ 5 ms). Conversely, during RF operation, I²C transactions stall until RF session ends or times out. This prevents corruption but introduces interface switching latency; the 256-byte Mailbox mitigates this by decoupling bulk transfers from real-time constraints.
What is the minimum RF field strength required to power the device and enable energy harvesting?
Functional operation begins at −10 dBm (100 mVrms) at the antenna terminals for basic RF communication; energy harvesting (VEH output) activates above −5 dBm (178 mVrms). Below −15 dBm, the device enters RF sleep mode and ignores commands. Field strength depends on reader output, antenna geometry, and coupling distance-ST recommends ≥5 mm air gap and Q-factor >25 for reliable VEH delivery in production layouts.
ST25DV64K-IER8T3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- ST25D
- Package/Case:
- 8-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- RFID Transponder
- Frequency:
- 13.56MHz
- Standards:
- ISO 15693, NFC
- Interface:
- I2C
- Voltage - Supply:
- 1.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-TSSOP
ST25DV64K-IER8T3 FAQ
1.How can I place an order for ST25DV64K-IER8T3 through Aetrix?
Please submit a Request for Quotation (RFQ) for ST25DV64K-IER8T3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ST25DV64K-IER8T3 reliable?
The price and inventory of ST25DV64K-IER8T3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ST25DV64K-IER8T3 is usually 5 days.
3.What payment methods are accepted for ST25DV64K-IER8T3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ST25DV64K-IER8T3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ST25DV64K-IER8T3?
ST25DV64K-IER8T3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ST25DV64K-IER8T3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ST25DV64K-IER8T3?
For technical support, including ST25DV64K-IER8T3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ST25DV64K-IER8T3 requirements.
6.How does Aetrix verify that ST25DV64K-IER8T3 is sourced from the original manufacturer or authorized distributors?
All ST25DV64K-IER8T3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ST25DV64K-IER8T3 meets industry standards.
7.What is the process for return or replacement of ST25DV64K-IER8T3?
All ST25DV64K-IER8T3 units undergo pre-shipment inspection (PSI). If there is an issue with ST25DV64K-IER8T3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ST25DV64K-IER8T3 part is unused and in its original packaging.
Return procedure for ST25DV64K-IER8T3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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