STMicroelectronics STD30NE06L
- Part No.:
- STD30NE06L
- Manufacturer:
- STMicroelectronics
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
STD30NE06L.pdf
- Description:
- MOSFET N-CH 60V 30A DPAK
- Quantity:
- Payment:

- Shipping:

Inventory:8,420
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
STD30NE06L from STMicroelectronics is an N-channel enhancement-mode power MOSFET in TO-252 (DPAK) package, rated for 60 V VDS, 30 A continuous drain current at TC = 25 °C, and typ. RDS(on) = 0.025 Ω at VGS = 10 V. It delivers high-speed switching with 7 V/ns dv/dt capability and is 100% avalanche tested-used in DC-DC converters and motor control stages where ruggedness and low conduction loss are critical.
For engineers reviewing the STD30NE06L datasheet, STD30NE06L pinout, STD30NE06L application, or STD30NE06L equivalent, key selection criteria include its 175 °C max junction temperature, 31 nC total gate charge, 2370 pF input capacitance, avalanche energy rating of 100 mJ, and DPAK thermal resistance (Rthj-pcb = 2.72 °C/W), all essential for thermal-aware high-current layout design.
Technical Context
This device employs ST's "Single Feature Size" strip-based process to achieve high cell density and low RDS(on), enabling efficient high-current operation while maintaining robust unclamped inductive switching performance. Its gate threshold voltage (1.0–2.5 V) supports direct 5 V logic-level drive, and the integrated body diode features 55 ns reverse recovery time with 0.1 µC Qrr at 150 °C junction temperature.
The MOSFET is characterized for high dv/dt immunity (7 V/ns) and operates within a safe operating area defined up to 120 A pulsed drain current. Thermal design leverages its low Rthj-pcb (2.72 °C/W) and 1.5 °C/W case-to-sink resistance when mounted on copper pour, supporting compact PCB-level thermal management without external heatsinks in medium-power applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 60 V - Maximum blocking voltage before breakdown; defines use in ≤48 V bus systems with margin. |
| RDS(on) (typ) | 0.025 Ω @ VGS = 10 V - Enables <1.1 W conduction loss at 30 A, reducing thermal load in high-current paths. |
| ID (cont) | 30 A @ TC = 25 °C - Sustains full-rated current with adequate heatsinking; derates to 21 A at 100 °C case. |
| Qg | 31 nC - Determines gate driver power requirement; enables fast switching with moderate gate resistance (e.g., 4.7 Ω). |
| EAS | 100 mJ - Single-pulse avalanche energy rating ensures reliability during inductive turn-off transients without snubbers. |
| dv/dt | 7 V/ns - High immunity to parasitic turn-on in noisy environments, critical for half-bridge and H-bridge topologies. |
| Ciss | 2370 pF - Input capacitance impacts gate drive loop stability and switching speed; requires careful gate resistor selection. |
Pinout & Package
Package: TO-252 (DPAK), surface-mount, single-drain tab configuration with exposed drain pad for thermal and electrical connection to PCB copper pour.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | Control terminal | Accepts 0–20 V gate drive; threshold at 1.7 V typical; low input capacitance enables fast edge rates. |
| 2 (Source) | Reference node for gate drive and current return | Connected to power ground plane; low-inductance routing required to minimize switching noise and shoot-through risk. |
| 3 (Drain) | Main current output path | Exposed metal tab tied internally to drain; must be soldered to large copper area for thermal dissipation and low EMI path. |
Key Features
| Feature | Design Value |
|---|---|
| 100% avalanche tested | Guarantees robustness against inductive energy spikes without derating; eliminates need for external clamping in solenoid drivers. |
| Low RDS(on) (0.025 Ω typ) | Reduces I²R losses by >30% vs. comparable 60 V MOSFETs, directly improving efficiency in 12–48 V DC-DC stages. |
| High dv/dt immunity (7 V/ns) | Prevents false triggering in high-noise motor control and relay drive circuits, enhancing system reliability without added gate filtering. |
| Optimized for 5 V logic drive | Operates fully enhanced at VGS = 5 V (RDS(on) ≤ 0.030 Ω), enabling direct interface with microcontroller GPIOs or low-voltage gate drivers. |
| TO-252 thermal performance | Rthj-pcb = 2.72 °C/W allows 20+ W dissipation on 2 oz. copper with 10 cm² thermal pad-no heatsink needed in many industrial modules. |
Applications
| Motor Control Stage | DC-DC Converter Primary Switch |
|---|---|
Use Scenario: Half-bridge driver for brushed DC motors in industrial actuators and HVAC dampers. IC Role / Device Role / Timing Role: High-side/low-side power switch handling 20–30 A peak currents with PWM frequencies up to 100 kHz. Use Value: Low RDS(on) and 100 mJ EAS prevent failure during stall conditions and commutation spikes, extending field lifetime. | Use Scenario: Synchronous rectifier or primary-side switch in isolated 24 V input, 5–12 V output flyback or forward converters. IC Role / Device Role / Timing Role: Main power switch operating in hard-switched or quasi-resonant mode with 30–100 kHz switching frequency. Use Value: 7 V/ns dv/dt rating suppresses false turn-on during transformer leakage spikes, improving regulation stability and EMI compliance. |
| Solenoid & Relay Driver | Audio Amplifier Output Stage |
Use Scenario: Direct-drive interface between MCU and 24 V/1.5 A solenoids in fluid control valves and pneumatic systems. IC Role / Device Role / Timing Role: Single-ended switch with freewheeling diode conduction during de-energization. Use Value: Fast 55 ns trr and low Qrr (0.1 µC) minimize voltage overshoot and reduce snubber size, cutting BOM cost and board space. | Use Scenario: Class-D output stage in mid-power audio amplifiers (20–50 W) for public address and automotive infotainment. IC Role / Device Role / Timing Role: High-current, low-distortion output switch operating at ≥300 kHz carrier frequency. Use Value: Low Ciss (2370 pF) and balanced Coss/Crss ratio ensure clean zero-voltage switching transitions, lowering THD+N and EMI emissions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel 60 V power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRFZ44NPBF | RDS(on) = 0.028 Ω (typ), Qg = 67 nC, no avalanche rating specified | Lacks guaranteed avalanche ruggedness; requires external clamping in inductive loads | Choose only if avalanche stress is absent and gate drive strength permits higher Qg. |
| STP30NF06L | Same die family, TO-220 package, Rthj-amb = 62 °C/W vs. 100 °C/W for DPAK | Requires heatsink for >10 W dissipation; less suitable for space-constrained PCBs | Select when mechanical mounting flexibility outweighs thermal PCB integration needs. |
Compared with IRFZ44NPBF and STP30NF06L, STD30NE06L uniquely combines DPAK-mountable thermal efficiency (Rthj-pcb = 2.72 °C/W), guaranteed 100 mJ avalanche energy, and 5 V logic compatibility-making it optimal for compact, rugged, high-reliability industrial power stages.
Availability
STD30NE06L is available at Aetrix Electronics and suitable for motor control, DC-DC conversion, solenoid driving, and audio amplifier output stages requiring stable component supply across long-lifecycle industrial programs.
Supply support for STD30NE06L includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing analog, power, microcontroller, and sensor solutions for industrial, automotive, and consumer markets.
STD30NE06L belongs to ST's StripFET™ II power MOSFET product line, engineered specifically for high-efficiency, high-ruggedness switching in industrial power supplies, motor drives, and automotive body electronics.
FAQ
Is STD30NE06L suitable for 5 V microcontroller gate drive?
Yes. With a gate threshold voltage range of 1.0–2.5 V and full enhancement at VGS = 5 V (RDS(on) ≤ 0.030 Ω), it interfaces directly with standard 5 V GPIOs. No level-shifting circuitry is required, simplifying drive-stage design and reducing component count in cost-sensitive applications.
What is the maximum continuous power dissipation at 100 °C case temperature?
At TC = 100 °C, the device supports 21 A continuous drain current. Using RDS(on) = 0.028 Ω (max), conduction loss is ~12.3 W. With Rthj-pcb = 2.72 °C/W and Tj(max) = 175 °C, the achievable steady-state power is ~27 W on a well-designed 2 oz. copper thermal pad-well above the 12.3 W loss.
Does STD30NE06L include an integrated body diode? What are its recovery characteristics?
Yes, it integrates a fast, low-loss body diode with trr = 55 ns, Qrr = 0.1 µC, and IRRM = 3.5 A at Tj = 150 °C. These parameters enable efficient freewheeling in synchronous rectification and half-bridge configurations without external Schottky diodes in many medium-frequency designs.
Can STD30NE06L replace older ST power MOSFETs like STD20NE06L in existing designs?
Yes-STD30NE06L is a direct upgrade: same TO-252 package, identical pinout, higher current rating (30 A vs. 20 A), lower RDS(on) (0.025 Ω vs. 0.035 Ω), and improved avalanche rating (100 mJ vs. 65 mJ). Layout and drive circuitry remain unchanged, delivering immediate efficiency and ruggedness gains.
STD30NE06L Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- STripFET™
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 30A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 5V, 10V
- Rds On (Max) @ Id, Vgs:
- 28mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 2.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 41 nC @ 5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2370 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 55W (Tc)
- Operating Temperature:
- 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DPAK
STD30NE06L FAQ
1.How can I place an order for STD30NE06L through Aetrix?
Please submit a Request for Quotation (RFQ) for STD30NE06L on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for STD30NE06L reliable?
The price and inventory of STD30NE06L are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for STD30NE06L is usually 5 days.
3.What payment methods are accepted for STD30NE06L?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for STD30NE06L transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for STD30NE06L?
STD30NE06L orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your STD30NE06L order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for STD30NE06L?
For technical support, including STD30NE06L datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your STD30NE06L requirements.
6.How does Aetrix verify that STD30NE06L is sourced from the original manufacturer or authorized distributors?
All STD30NE06L products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that STD30NE06L meets industry standards.
7.What is the process for return or replacement of STD30NE06L?
All STD30NE06L units undergo pre-shipment inspection (PSI). If there is an issue with STD30NE06L, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The STD30NE06L part is unused and in its original packaging.
Return procedure for STD30NE06L:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
STD30NE06L Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

;;2.jpg)