Vishay Siliconix SUD35N10-26P-GE3
- Part No.:
- SUD35N10-26P-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
SUD35N10-26P-GE3.pdf
- Description:
- MOSFET N-CH 100V 35A TO252
- Quantity:
- Payment:

- Shipping:

Inventory:1,914
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SUD35N10-26P-GE3 from Vishay Siliconix is an N-channel enhancement-mode TrenchFET® power MOSFET rated for 100 V drain-source voltage, 35 A continuous drain current at TC = 25 °C, and 26 mΩ typical RDS(on) at VGS = 10 V. It features 31 nC total gate charge, 100% UIS tested, and is optimized as a primary-side switch in offline SMPS topologies.
For engineers reviewing the SUD35N10-26P-GE3 datasheet, SUD35N10-26P-GE3 pinout, SUD35N10-26P-GE3 application, or SUD35N10-26P-GE3 equivalent, key selection criteria include its TO-252 package thermal performance (RthJC = 1.5 °C/W), body diode recovery characteristics (trr = 50 ns typ.), and robust avalanche energy rating (EAS = 55 mJ).
Technical Context
This MOSFET employs trench-gate silicon technology to achieve low on-resistance and fast switching with controlled gate charge (Qg = 31 nC). Its 100 V VDS rating supports universal-input AC/DC flyback and LLC resonant converters operating up to 400 V DC bus.
The device integrates a co-packaged body diode with specified reverse recovery time (trr = 50–75 ns) and Qrr = 100–150 nC, enabling reliable operation in hard-switched primary-side configurations without external snubbing in moderate-frequency designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 100 V - Supports 400 V DC link with 2× safety margin in offline SMPS |
| RDS(on) | 0.026 Ω @ VGS = 10 V - Enables <1 W conduction loss at 20 A ID |
| ID (cont.) | 35 A @ TC = 25 °C - Requires heatsinking above ~50 °C case temperature |
| Qg | 31 nC - Determines gate driver power requirement and switching speed trade-off |
| EAS | 55 mJ - Withstands single-pulse inductive energy without failure under UIS test |
| trr / Qrr | 50 ns / 100 nC - Limits diode recovery losses and EMI in hard-switched topologies |
| RthJC | 1.5 °C/W - Enables high-power dissipation when mounted to copper heatsink |
Pinout & Package
Package: TO-252AA (DPAK), surface-mount, drain-connected tab for thermal and electrical connection to PCB copper pour.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G (Gate) | Control electrode | Receives 10 V logic-level drive; 1.5 Ω gate resistance limits ringing and dV/dt-induced turn-on |
| D (Drain) | High-side power terminal | Connected internally to exposed metal tab; must be soldered to large copper area for thermal management |
| S (Source) | Power return and reference node | Serves as local ground reference for gate drive; critical for minimizing common-source inductance |
Key Features
| Feature | Design Value |
|---|---|
| TrenchFET® architecture | Delivers 26 mΩ RDS(on) in TO-252, enabling higher efficiency than planar MOSFETs of same size |
| 100 % UIS tested | Guarantees ruggedness against inductive switching stress without derating |
| Low Qgd / Qgs ratio | Qgd = 9 nC, Qgs = 10 nC - Reduces Miller plateau duration and improves dv/dt immunity |
| Enhanced body diode | trr = 50 ns, VSD = 0.8–1.2 V @ IS = 10 A - Low forward drop and fast recovery reduce dead-time losses |
| Lead (Pb)-free and RoHS-compliant | Meets JEDEC J-STD-020 reflow profile; compatible with standard SnAgCu soldering processes |
Applications
| AC/DC Flyback Converter | LLC Resonant Converter |
|---|---|
Use Scenario: Primary-side switch in 65–300 W universal-input offline adapter with 400 V DC bus. IC Role / Device Role / Timing Role: High-voltage, medium-current switching element driven by PWM controller; handles full input power conversion cycle. Use Value: 26 mΩ RDS(on) reduces conduction loss by >30% vs. comparable 40 mΩ DPAK MOSFETs, improving full-load efficiency by ~0.8%. | Use Scenario: Primary-side half-bridge switch in 150–500 W server PSU with ZVS operation. IC Role / Device Role / Timing Role: Fast-switching power switch synchronized to resonant tank zero-voltage transitions. Use Value: 31 nC Qg and low Coss (180 pF) enable efficient ZVS at 300–500 kHz, reducing switching loss by ~25% versus higher-Qg alternatives. |
| Industrial Motor Drive Inverter | DC-DC Boost Converter |
Use Scenario: Low-side switch in 24–48 V BLDC inverter stage driving 1–3 kW PMSM loads. IC Role / Device Role / Timing Role: Pulse-width modulated power switch controlling phase current commutation. Use Value: 50 A pulsed drain current (IDM) and 55 mJ EAS support motor stall and short-circuit fault conditions without failure. | Use Scenario: Main switch in 12 V–48 V input, 400 V output boost converter for solar microinverters. IC Role / Device Role / Timing Role: High-duty-cycle, high-VDS switching element handling continuous 15–25 A currents. Use Value: 100 V rating and 1.5 °C/W RthJC allow stable operation at 83 W PD with minimal heatsink, simplifying mechanical design. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP35NF10 | TO-220 package, 35 A/100 V, RDS(on) = 30 mΩ @ 10 V, Qg = 42 nC | Higher thermal resistance (RthJC = 1.5 °C/W same, but no drain-tab soldering); larger footprint | Preferred where through-hole mounting or higher peak current (IDM = 140 A) is required |
| IRF540NPBF | TO-220, 33 A/100 V, RDS(on) = 44 mΩ @ 10 V, Qg = 71 nC, no UIS rating | Higher conduction and switching losses; not UIS-tested; lower reliability in inductive switching | Only suitable for low-cost, non-critical linear or low-frequency switching applications |
Compared with STP35NF10 and IRF540NPBF, the SUD35N10-26P-GE3 delivers superior thermal performance via TO-252 drain-tab soldering, lower gate charge for faster switching, and guaranteed UIS ruggedness-making it optimal for compact, high-efficiency, high-reliability SMPS primary-side designs.
Availability
SUD35N10-26P-GE3 is available at Aetrix Electronics and suitable for AC/DC adapters, industrial motor drives, solar boost converters, and LLC resonant power supplies requiring stable component supply and long-term manufacturability.
Supply support for SUD35N10-26P-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on power efficiency and ruggedness.
The SUD35N10-26P-GE3 belongs to Vishay's TrenchFET® Gen III power MOSFET family, engineered specifically for high-frequency, high-efficiency primary-side switching in space-constrained AC/DC and isolated DC/DC converters.
FAQ
What is the maximum continuous drain current rating for the SUD35N10-26P-GE3 at 70 °C case temperature?
The SUD35N10-26P-GE3 supports 32 A continuous drain current at TC = 70 °C, per its Absolute Maximum Ratings table. This reflects thermal derating from the 35 A rating at TC = 25 °C and ensures safe operation within junction temperature limits when properly heatsinked. The SUD35N10-26P-GE3 must be mounted on ≥1" × 1" FR4 with 2 oz copper to achieve this rating.
Does the SUD35N10-26P-GE3 have a fully characterized body diode for synchronous rectification?
No-the SUD35N10-26P-GE3 body diode is optimized for freewheeling and clamping, not synchronous rectification. Its trr = 50–75 ns and Qrr = 100–150 nC are suitable for hard-switched primary-side use, but it lacks the low VSD and ultra-fast recovery needed for secondary-side SR. For synchronous rectification, dedicated low-VF Schottky or logic-level MOSFETs are recommended instead of relying on the SUD35N10-26P-GE3 body diode.
Can the SUD35N10-26P-GE3 be driven directly from a 3.3 V microcontroller GPIO?
No-the SUD35N10-26P-GE3 has a gate threshold voltage range of 2.5–4.4 V and requires ≥10 V VGS for full enhancement (RDS(on) = 0.026 Ω). At 3.3 V, it remains in weak inversion with RDS(on) >1 Ω, causing excessive heating. A dedicated gate driver (e.g., TC4427) or level-shifting circuit is required to deliver 10–15 V drive to the SUD35N10-26P-GE3 gate.
What is the safe operating area (SOA) limitation for the SUD35N10-26P-GE3 at 100 V VDS and 10 A ID?
At VDS = 100 V and ID = 10 A, the SUD35N10-26P-GE3 operates within its DC SOA limit only for pulse widths ≤10 ms, as shown in the Safe Operating Area graph (Figure 10). Continuous DC operation at this point exceeds the package's 8.3 W ambient-limited power dissipation. For sustained 100 V/10 A operation, active cooling or reduced duty cycle is mandatory to keep TJ ≤ 175 °C. The SUD35N10-26P-GE3 SOA is primarily limited by RDS(on) heating, not avalanche.
Is the SUD35N10-26P-GE3 suitable for automotive applications per AEC-Q101?
No-the SUD35N10-26P-GE3 is not AEC-Q101 qualified. While it meets industrial temperature range (−55 °C to +175 °C), Vishay does not list it in their AEC-Q101 product portfolio. For automotive primary-side switching, consider the AEC-Q101-qualified SiHFR100N10E or SiHF100N10E instead. The SUD35N10-26P-GE3 is intended for commercial/industrial power supplies, not automotive ECUs or ADAS systems.
SUD35N10-26P-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET®
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 35A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 7V, 10V
- Rds On (Max) @ Id, Vgs:
- 26mOhm @ 12A, 10V
- Vgs(th) (Max) @ Id:
- 4.4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 47 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2000 pF @ 12 V
- FET Feature:
- -
- Power Dissipation (Max):
- 8.3W (Ta), 83W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252AA
SUD35N10-26P-GE3 FAQ
1.How can I place an order for SUD35N10-26P-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SUD35N10-26P-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SUD35N10-26P-GE3 reliable?
The price and inventory of SUD35N10-26P-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SUD35N10-26P-GE3 is usually 5 days.
3.What payment methods are accepted for SUD35N10-26P-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SUD35N10-26P-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SUD35N10-26P-GE3?
SUD35N10-26P-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SUD35N10-26P-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SUD35N10-26P-GE3?
For technical support, including SUD35N10-26P-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SUD35N10-26P-GE3 requirements.
6.How does Aetrix verify that SUD35N10-26P-GE3 is sourced from the original manufacturer or authorized distributors?
All SUD35N10-26P-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SUD35N10-26P-GE3 meets industry standards.
7.What is the process for return or replacement of SUD35N10-26P-GE3?
All SUD35N10-26P-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SUD35N10-26P-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SUD35N10-26P-GE3 part is unused and in its original packaging.
Return procedure for SUD35N10-26P-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SUD35N10-26P-GE3 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

