Vishay Siliconix SUD50N03-06AP-T4E3
- Part No.:
- SUD50N03-06AP-T4E3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
SUD50N03-06AP-T4E3.pdf
- Description:
- MOSFET N-CH 30V 90A TO252
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SUD50N03-06AP-T4E3 from Vishay Siliconix is an N-channel 30-V TrenchFET® power MOSFET optimized for low-side synchronous rectifier operation in DC/DC converters, with rDS(on) = 0.0057 Ω at VGS = 10 V, 90 A continuous drain current (TC = 25 °C), and TO-252 package with drain-connected tab for enhanced thermal performance.
For engineers reviewing the SUD50N03-06AP-T4E3 datasheet, SUD50N03-06AP-T4E3 pinout, SUD50N03-06AP-T4E3 application, or SUD50N03-06AP-T4E3 equivalent, key selection criteria include low RDS(on) at 4.5 V gate drive, 100% Rg tested gate resistance, body diode recovery characteristics (trr = 65–100 ns), and thermal resistance RthJC = 1.5 °C/W for high-efficiency power stage design.
Technical Context
This MOSFET employs trench-gate silicon technology to achieve low on-resistance and fast switching with controlled Qg (62–95 nC at VGS = 10 V) and low Crss (305 pF), enabling high-frequency synchronous rectification. Its gate threshold voltage (VGS(th) = 1.2–2.4 V) supports logic-level and standard 5 V/10 V drive compatibility.
The device integrates a robust intrinsic body diode with VSD = 0.9–1.5 V at IS = 6.7 A and Qrr = 38–60 nC, critical for minimizing reverse recovery losses in buck and LLC topologies. Thermal design is supported by RthJC = 1.5 °C/W and RthJA = 12–15 °C/W (t ≤ 10 sec) under defined PCB mounting conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum blocking voltage for 12 V/24 V input DC/DC stages |
| rDS(on) @ 10 V | 0.0057 Ω - Enables <1.7 W conduction loss at 50 A, critical for >95 % efficiency targets |
| rDS(on) @ 4.5 V | 0.0078 Ω - Supports direct 3.3 V/5 V controller gate drive without level-shifting |
| Qg @ 10 V | 62–95 nC - Determines gate driver power requirement and switching speed trade-off |
| trr | 65–100 ns - Limits shoot-through risk and EMI during body diode commutation |
| RthJC | 1.5 °C/W - Allows ~55 W dissipation with 80 °C case temperature rise, enabling compact heatsinking |
| ID (cont.) | 90 A @ TC = 25 °C - Package-limited current rating defines maximum safe operating area at low duty cycles |
Pinout & Package
TO-252AA (DPAK) surface-mount package with exposed drain-connected copper tab for direct thermal path to PCB copper pour or heatsink. Standard three-terminal configuration: Gate (G), Source (S), Drain (D).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G | Gate control input | Receives PWM signal; 100 % Rg tested to ensure consistent turn-on timing across production lots |
| S | Source reference node | Common return for gate drive and load current; ties to power ground plane in low-side switch layout |
| D | Drain output / power terminal | Connected internally to exposed tab; must be soldered to large copper area for thermal and current handling |
Key Features
| Feature | Design Value |
|---|---|
| TrenchFET® architecture | Delivers industry-leading rDS(on) × Qg figure-of-merit for high-frequency power conversion |
| Optimized for low-side synchronous rectification | Low VGS(th) and fast trr reduce body diode conduction time and associated losses |
| 100 % Rg tested | Guarantees gate resistance between 0.9–1.4 Ω, ensuring predictable gate charge timing and driver stress |
| RoHS-compliant lead-free termination | SUD50N03-06AP-T4E3 meets JEDEC J-STD-020 reflow profile requirements for Pb-free assembly |
| Drain-connected tab | Enables direct thermal coupling to PCB; RthJC = 1.5 °C/W supports high-power density designs |
Applications
| Buck Converter Power Stage | Server VRM Low-Side Switch |
|---|---|
Use Scenario: High-current, high-frequency (300–1000 kHz) step-down regulation for CPU/GPU core voltage. IC Role / Device Role / Timing Role: Low-side synchronous rectifier replacing Schottky diode to reduce conduction loss and improve efficiency. Use Value: 0.0078 Ω rDS(on) at 4.5 V enables >90 % efficiency at 100 A output with minimal thermal derating. | Use Scenario: Multi-phase voltage regulator module supplying 0.8–1.8 V at up to 200 A per rail in datacenter servers. IC Role / Device Role / Timing Role: Primary low-side switch in each phase leg, driven by dedicated gate controller IC. Use Value: Fast trr (65–100 ns) and low Qrr (38–60 nC) minimize dead-time losses and EMI generation during phase interleaving. |
| Industrial DC/DC Module | Telecom POL Converter |
Use Scenario: Isolated 48 V-to-12 V intermediate bus converter in factory automation equipment. IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier in forward or active-clamp forward topology. Use Value: 90 A continuous rating and RthJC = 1.5 °C/W support 100 W+ output in compact, fanless enclosures. | Use Scenario: Point-of-load converter delivering 3.3 V/5 V from 12 V or 48 V backplane in telecom line cards. IC Role / Device Role / Timing Role: Low-side switch in monolithic or discrete buck regulator with tight transient response requirements. Use Value: Low VGS(th) (1.2–2.4 V) ensures reliable turn-on with 3.3 V gate drivers, reducing BOM count and layout complexity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRL3803PbF | rDS(on) = 0.006 Ω @ 10 V; higher Qg (80 nC); TO-220 package | Larger footprint and higher RthJA; less suitable for ultra-thin or high-density layouts | Prefer SUD50N03-06AP-T4E3 for surface-mount, thermally constrained designs requiring DPAK form factor |
| DMT3006LPS-13 | rDS(on) = 0.0055 Ω @ 10 V; lower Qg (52 nC); same TO-252 package | Improved FOM but tighter VGS(th) range (1.0–2.0 V) increases risk of spurious turn-on in noisy environments | Prefer SUD50N03-06AP-T4E3 where gate drive margin and body diode softness are prioritized over minimal RDS(on) |
Compared with IRL3803PbF and DMT3006LPS-13, the SUD50N03-06AP-T4E3 offers balanced trade-offs: competitive rDS(on), verified Rg consistency, and robust body diode recovery-making it optimal for industrial and telecom DC/DC where reliability and thermal management outweigh marginal RDS(on) gains.
Availability
SUD50N03-06AP-T4E3 is available at Aetrix Electronics and suitable for buck converters, server VRMs, and industrial DC/DC modules requiring stable component supply, RoHS compliance, and proven thermal performance in TO-252 packaging.
Supply support for SUD50N03-06AP-T4E3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in power MOSFETs, diodes, and optoelectronics with emphasis on high-reliability, high-efficiency solutions for industrial and computing markets.
The SUD50N03-06AP-T4E3 belongs to Vishay's TrenchFET® Gen IV low-voltage power MOSFET family, engineered specifically for high-current, high-frequency synchronous rectification in space-constrained, thermally demanding power supplies.
FAQ
What is the maximum continuous drain current rating for the SUD50N03-06AP-T4E3?
The SUD50N03-06AP-T4E3 has a continuous drain current rating of 90 A when case temperature (TC) is maintained at 25 °C. At TC = 70 °C, the rating drops to 75 A due to thermal derating. The package-limited current is 50 A under steady-state conditions, meaning actual design limits depend on PCB thermal design and ambient conditions. Always verify junction temperature using RthJC = 1.5 °C/W in your layout.
Does the SUD50N03-06AP-T4E3 support 4.5 V gate drive in practical applications?
Yes, the SUD50N03-03AP-T4E3 is fully specified for 4.5 V gate drive: rDS(on) = 0.0078 Ω (typical) at VGS = 4.5 V and ID = 20 A. Its VGS(th) range of 1.2–2.4 V ensures strong enhancement-mode turn-on with standard 3.3 V or 5 V controllers. This eliminates need for gate boosters in many point-of-load and telecom POL designs.
How does the body diode performance of the SUD50N03-06AP-T4E3 impact synchronous rectifier design?
The SUD50N03-06AP-T4E3 features a well-characterized intrinsic body diode with VSD = 0.9–1.5 V at IS = 6.7 A and reverse recovery time trr = 65–100 ns. These parameters directly affect dead-time optimization and EMI in synchronous buck converters. Low Qrr (38–60 nC) reduces voltage spikes during commutation, improving system reliability versus older MOSFET generations.
Is the SUD50N03-06AP-T4E3 RoHS compliant and what does the "-T4E3" suffix indicate?
Yes, the SUD50N03-06AP-T4E3 is RoHS compliant with lead-free terminations. The "-T4E3" suffix denotes tape-and-reel packaging (T4) and lead-free (E3) finish per JEDEC standards. It replaces legacy "-E3" versions and is qualified for standard Pb-free reflow profiles (J-STD-020). No exemptions apply-the device contains no intentionally added lead.
What thermal considerations are critical when using the SUD50N03-06AP-T4E3 in high-power applications?
For high-power use, the SUD50N03-06AP-T4E3 requires a minimum 1" × 1" FR4 copper pour connected to the drain tab, per Vishay's recommended pad layout (Application Note 826). Junction-to-case thermal resistance is 1.5 °C/W, so maintaining TC ≤ 70 °C limits PD to 58 W. Exceeding this without forced cooling risks exceeding TJ(max) = 175 °C. Thermal simulation and IR imaging are recommended for >40 W designs.
SUD50N03-06AP-T4E3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET®
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 90A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 5.7mOhm @ 20A, 10V
- Vgs(th) (Max) @ Id:
- 2.4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 95 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3800 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 10W (Ta), 83W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252
SUD50N03-06AP-T4E3 FAQ
1.How can I place an order for SUD50N03-06AP-T4E3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SUD50N03-06AP-T4E3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SUD50N03-06AP-T4E3 reliable?
The price and inventory of SUD50N03-06AP-T4E3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SUD50N03-06AP-T4E3 is usually 5 days.
3.What payment methods are accepted for SUD50N03-06AP-T4E3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SUD50N03-06AP-T4E3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SUD50N03-06AP-T4E3?
SUD50N03-06AP-T4E3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SUD50N03-06AP-T4E3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SUD50N03-06AP-T4E3?
For technical support, including SUD50N03-06AP-T4E3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SUD50N03-06AP-T4E3 requirements.
6.How does Aetrix verify that SUD50N03-06AP-T4E3 is sourced from the original manufacturer or authorized distributors?
All SUD50N03-06AP-T4E3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SUD50N03-06AP-T4E3 meets industry standards.
7.What is the process for return or replacement of SUD50N03-06AP-T4E3?
All SUD50N03-06AP-T4E3 units undergo pre-shipment inspection (PSI). If there is an issue with SUD50N03-06AP-T4E3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SUD50N03-06AP-T4E3 part is unused and in its original packaging.
Return procedure for SUD50N03-06AP-T4E3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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