Vishay Siliconix SUD50N03-12P-E3
- Part No.:
- SUD50N03-12P-E3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
SUD50N03-12P-E3.pdf
- Description:
- MOSFET N-CH 30V TO252
- Quantity:
- Payment:

- Shipping:

Inventory:5,339
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Product details
Overview
SUD50N03-12P-E3 from Vishay Siliconix is an N-channel 30 V TrenchFET® Power MOSFET in TO-252 package, rated for 17.5 A continuous drain current at 25 °C, with RDS(on) = 0.0120 Ω at VGS = 10 V and 0.0175 Ω at VGS = 4.5 V, used in DC-DC converter high-side switching and motor drive half-bridge legs.
For engineers reviewing the SUD50N03-12P-E3 datasheet, SUD50N03-12P-E3 pinout, SUD50N03-12P-E3 application, or SUD50N03-12P-E3 equivalent, key selection criteria include its 30 V VDS, 100 % Rg and UIS tested reliability, RoHS-compliant lead-free construction, and thermal performance with RthJC = 2.6 °C/W.
Technical Context
This MOSFET employs trench-gate silicon technology optimized for low on-resistance and fast switching in surface-mount power conversion topologies. Its gate threshold voltage (1–3 V) enables compatibility with 3.3 V and 5 V logic-level drivers, while the integrated source-drain diode supports synchronous rectification and freewheeling operation.
The device features a drain-connected tab for direct thermal coupling to PCB copper, with maximum junction temperature of 175 °C and avalanche energy rating of 45 mJ. Its Ciss = 1600 pF and Qg = 28–42 nC support efficient gate driving in high-frequency PWM applications up to 500 kHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum blocking voltage for 24 V system rail protection and buck converter switches |
| RDS(on) @ VGS = 10 V | 0.0120 Ω - Enables ≤2.1 W conduction loss at 17.5 A, suitable for thermally constrained PCB layouts |
| RDS(on) @ VGS = 4.5 V | 0.0175 Ω - Ensures usable on-state performance with standard 5 V microcontroller GPIO drive |
| ID Continuous @ TA = 25 °C | 17.5 A - Supports medium-power motor control and industrial SMPS without forced air cooling |
| Qg Total Gate Charge | 28–42 nC - Determines gate driver power requirement and switching transition time in hard-switched converters |
| RthJC | 2.6 °C/W (typ.) - Allows direct heatsinking via drain tab to internal ground plane or external metal layer |
| EAS | 45 mJ - Provides robustness against inductive load switching transients without external snubbers |
Pinout & Package
Package: TO-252AA (DPAK), surface-mount, drain-connected tab for thermal and electrical grounding. Dimensions per Vishay document 71197: 6.09 mm × 6.54 mm × 2.28 mm (L × W × H), gage plane height 0.5 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G (Gate) | Control input terminal | Receives voltage-controlled signal to modulate channel conductivity; requires <1.5 Ω series gate resistor for optimal EMI and dV/dt control |
| S (Source) | Reference node for gate drive and current return path | Common connection point for low-side sensing, feedback networks, and driver IC reference; tied to PCB ground plane |
| D (Drain) | Main power output terminal | Connected internally to exposed metal tab; must be soldered to ≥200 mm² copper pour for thermal management and low-inductance high-current routing |
Key Features
| Feature | Design Value |
|---|---|
| TrenchFET® architecture | Delivers industry-leading RDS(on) × area efficiency for compact 24 V power stages in space-constrained designs |
| 100 % Rg and UIS tested | Ensures gate resistance consistency and single-pulse avalanche ruggedness across all production units-critical for automotive and industrial reliability |
| RoHS-compliant, lead-free (Pb-free) | Meets EU Directive 2002/95/EC; compatible with standard SnAgCu reflow profiles and halogen-free assembly processes |
| Drain-connected tab | Enables direct thermal path from junction to PCB copper, reducing RthJA by up to 40 % versus non-tabbed packages under identical layout conditions |
| Low Qgd/Qg ratio (≈0.12) | Minimizes Miller effect during switching transitions, improving noise immunity and enabling stable operation with high dV/dt rates |
Applications
| DC-DC Buck Converter | Brushed DC Motor Driver |
|---|---|
Use Scenario: High-efficiency 12–24 V input to 3.3/5/12 V output conversion in industrial PLC I/O modules. IC Role / Device Role / Timing Role: High-side synchronous rectifier switch operating at 250–500 kHz PWM frequency. Use Value: Low RDS(on) reduces conduction losses below 1.5 W at full load, enabling natural convection cooling in sealed enclosures. |
Use Scenario: Bidirectional 24 V brushed motor control in automated gate actuators and HVAC dampers. IC Role / Device Role / Timing Role: Half-bridge upper-leg switch with complementary low-side FET, driven by isolated gate driver. Use Value: Avalanche-rated design withstands flyback energy from motor inductance without external clamping diodes. |
| LED Constant-Current Driver | Hot-Swap Controller |
Use Scenario: High-brightness LED string regulation in outdoor signage with ambient temperatures up to 85 °C. IC Role / Device Role / Timing Role: Series pass element in linear or pseudo-linear constant-current loop with analog dimming. Use Value: 175 °C max junction temperature allows sustained operation at elevated ambient without derating in thermally isolated housings. |
Use Scenario: Inrush current limiting and fault protection for 24 V backplane insertion in telecom shelf systems. IC Role / Device Role / Timing Role: Main pass transistor in active hot-swap controller IC reference design (e.g., LTC4215). Use Value: Low gate charge enables fast turn-on/off response (<50 ns rise/fall) for precise current limiting and short-circuit shutdown. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF7470PBF | RDS(on) = 0.014 Ω @ 10 V; TO-252 package; higher Qg = 48 nC; no 100 % UIS test specified | Marginally higher conduction loss; less robust under repetitive avalanche stress | Acceptable where cost sensitivity outweighs avalanche margin requirements |
| DMN3025LSD-13 | RDS(on) = 0.018 Ω @ 10 V; dual N-channel SO-8; lower ID = 12 A; RthJA = 50 °C/W (higher thermal resistance) | Not suitable for same power level without significant derating; limited to low-power dual-switch configurations | Only viable in space-constrained dual-FET applications where total current ≤12 A per channel |
Compared with IRF7470PBF and DMN3025LSD-13, the SUD50N03-12P-E3 delivers superior thermal performance (RthJC = 2.6 °C/W), verified avalanche ruggedness, and tighter RDS(on) tolerance-making it preferred for industrial motor drives and high-reliability DC-DC converters where thermal headroom and transient robustness are critical.
Availability
SUD50N03-12P-E3 is available at Aetrix Electronics and suitable for DC-DC buck converters, brushed DC motor drivers, and LED constant-current drivers requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.
Supply support for SUD50N03-12P-E3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors and passive components, specializing in high-reliability power MOSFETs, diodes, and optoelectronics for industrial, automotive, and computing markets.
The SUD50N03-12P-E3 belongs to Vishay's TrenchFET® Gen III family, engineered specifically for high-efficiency, high-density power conversion in surface-mount applications demanding low RDS(on), fast switching, and rugged avalanche performance.
FAQ
What is the maximum continuous drain current rating for the SUD50N03-12P-E3 at 100 °C ambient temperature?
The SUD50N03-12P-E3 supports 12.4 A continuous drain current at TA = 100 °C, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limitations of the TO-252 package under natural convection; actual current capability increases with PCB copper area and airflow. The SUD50N03-12P-E3 datasheet confirms this value applies to surface-mounted FR4 boards with t ≤ 10 s pulse duration.
Does the SUD50N03-12P-E3 require a gate resistor, and if so, what value is recommended?
Yes, the SUD50N03-12P-E3 benefits from a series gate resistor to control dI/dt and suppress ringing. Vishay recommends 1–2.5 Ω for typical 250–500 kHz PWM applications, based on its Qg = 28–42 nC and Rg = 0.3–3.0 Ω internal gate resistance. The SUD50N03-12P-E3 gate driver interface must account for this to ensure clean turn-on/turn-off transitions and minimize EMI.
Is the SUD50N03-12P-E3 suitable for logic-level gate drive from a 3.3 V microcontroller?
The SUD50N03-12P-E3 has a gate threshold voltage range of 1–3 V, but its RDS(on) = 0.0175 Ω at VGS = 4.5 V-not 3.3 V. At 3.3 V, RDS(on) rises significantly (>0.03 Ω), increasing conduction loss. For reliable 3.3 V drive, the SUD50N03-12P-E3 should be paired with a gate driver or level shifter; it is not a true logic-level MOSFET.
How is thermal performance affected when the SUD50N03-12P-E3 drain tab is not soldered to a copper plane?
Without soldering the drain tab to ≥200 mm² of 2 oz copper, the SUD50N03-12P-E3 junction-to-ambient thermal resistance degrades from 18 °C/W (t ≤ 10 s) to up to 50 °C/W (steady state), risking thermal runaway above 5 A. The SUD50N03-12P-E3 datasheet explicitly ties RthJA values to proper tab soldering per Application Note 826 pad layout guidelines.
What does "100 % Rg and UIS tested" mean for the SUD50N03-12P-E3?
"100 % Rg tested" means every SUD50N03-12P-E3 unit undergoes production screening for gate resistance (0.3–3.0 Ω), ensuring consistent drive requirements. "100 % UIS tested" confirms each device passes unclamped inductive switching stress at IAS = 30 A and EAS = 45 mJ-verifying avalanche ruggedness beyond typical qualification sampling. This is documented in Vishay specification 72267.
SUD50N03-12P-E3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET®
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 17.5A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 12mOhm @ 20A, 10V
- Vgs(th) (Max) @ Id:
- 3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 42 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1600 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 6.5W (Ta), 46.8W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252AA
SUD50N03-12P-E3 FAQ
1.How can I place an order for SUD50N03-12P-E3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SUD50N03-12P-E3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SUD50N03-12P-E3 reliable?
The price and inventory of SUD50N03-12P-E3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SUD50N03-12P-E3 is usually 5 days.
3.What payment methods are accepted for SUD50N03-12P-E3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SUD50N03-12P-E3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SUD50N03-12P-E3?
SUD50N03-12P-E3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SUD50N03-12P-E3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SUD50N03-12P-E3?
For technical support, including SUD50N03-12P-E3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SUD50N03-12P-E3 requirements.
6.How does Aetrix verify that SUD50N03-12P-E3 is sourced from the original manufacturer or authorized distributors?
All SUD50N03-12P-E3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SUD50N03-12P-E3 meets industry standards.
7.What is the process for return or replacement of SUD50N03-12P-E3?
All SUD50N03-12P-E3 units undergo pre-shipment inspection (PSI). If there is an issue with SUD50N03-12P-E3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SUD50N03-12P-E3 part is unused and in its original packaging.
Return procedure for SUD50N03-12P-E3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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