onsemi SZESD7241N2T5G
- Part No.:
- SZESD7241N2T5G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 2-XDFN
- Datasheet:
-
SZESD7241N2T5G.pdf
- Description:
- TVS DIODE 24VWM 48VC 2X2DFN
- Quantity:
- Payment:

- Shipping:

Inventory:37,876
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Product details
Overview
SZESD7241N2T5G from onsemi is a bi-directional ESD protection diode in X2DFN2 package, designed for ultra-low-capacitance RF signal line protection with 0.7 pF capacitance at 1 GHz, 38 V clamping voltage at 8 A TLP, and ±28 kV IEC61000-4-2 contact ESD rating - deployed in antenna feed lines of 5G handsets and NFC interfaces.
For engineers reviewing the SZESD7241N2T5G datasheet, pinout, applications, or equivalent options, key selection criteria include sub-1.0 pF capacitance stability over bias, <0.6 dB insertion loss at 3 GHz, 24 V working voltage, and AEC-Q101 qualification for automotive RF front-end use.
Technical Context
This device implements a silicon avalanche diode structure optimized for low dynamic impedance (0.84 Ω) and linear CV response across 0–24 V reverse bias, enabling minimal RF signal distortion in high-frequency paths. Its bi-directional clamping behavior ensures symmetrical protection against both positive and negative transients without polarity dependence.
The X2DFN2 package features 0.65 mm pitch, 1.00 × 0.60 mm footprint, and wettable flank–compatible geometry (though not the MXWT5G variant), supporting automated optical inspection and high-density RF layout. Thermal resistance is 400 °C/W junction-to-ambient under standard FR-4 mounting.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Capacitance @ 1 GHz | 0.7 pF - preserves signal integrity in 3–6 GHz 5G NR and Wi-Fi 6E antenna paths |
| Clamping Voltage @ 8 A TLP | 38 V - limits transient overvoltage to safe levels for 24 V-rated RF ICs and LNAs |
| Working Peak Reverse Voltage | 24 V - supports continuous operation on USB 3.x VBUS and cellular antenna DC bias rails |
| IEC61000-4-2 Contact ESD | ±28 kV - exceeds Level 4 immunity for handheld consumer and automotive infotainment ports |
| Insertion Loss @ 3 GHz | 0.58 dB - enables >90% RF power transfer in compact mmWave front-end modules |
| Dynamic Resistance | 0.84 Ω - ensures rapid turn-on and low-voltage overshoot during fast ESD pulses |
Pinout & Package
X2DFN2 package: 2-terminal, 1.00 mm × 0.60 mm × 0.37 mm body, 0.65 mm lead pitch, Pb-free, RoHS-compliant. Terminals are non-polarized and functionally symmetric for bi-directional ESD suppression.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Terminal 1 | Anode/Cathode (bi-directional) | Connects to protected signal line (e.g., antenna feed); no polarity assignment required |
| Terminal 2 | Anode/Cathode (bi-directional) | Connects to ground reference; forms low-impedance path for ESD current during either polarity event |
Key Features
| Feature | Design Value |
|---|---|
| Capacitance linearity over voltage | Stable 0.7–1.0 pF across 0–24 V bias - prevents detuning of matching networks in tunable RF front-ends |
| Ultra-low insertion loss | 0.15 dB @ 1 GHz / 0.58 dB @ 3 GHz - maintains gain flatness and noise figure in LNA input stages |
| AEC-Q101 qualification | Validated for automotive temperature range (−55 °C to +150 °C) and mechanical stress - suitable for telematics and V2X antenna protection |
| IEC61000-4-5 lightning surge rating | 2.5 A (8/20 µs) - provides system-level resilience against induced surges in outdoor wireless terminals |
Applications
| 5G Smartphone Antenna Line Protection | NFC Interface ESD Suppression |
|---|---|
|
Use Scenario: Protecting main diversity antenna feed line in sub-6 GHz 5G handsets exposed to repeated human-body ESD events during daily handling. IC Role / Device Role / Timing Role: Bi-directional transient voltage suppressor placed in series between antenna switch and RF transceiver, operating continuously at RF frequencies up to 3.8 GHz. Use Value: 0.7 pF capacitance minimizes impedance mismatch; 38 V clamping prevents damage to sensitive GaAs pHEMT LNAs while maintaining TRP/TIS performance. |
Use Scenario: Shielding ISO14443-A/B 13.56 MHz NFC reader coil and data lines from ESD during card tap interactions in payment terminals and access control devices. IC Role / Device Role / Timing Role: Low-capacitance shunt protector across differential NFC signal pair, activated only during ESD transients (ns-scale), transparent during normal carrier operation. Use Value: Sub-1.0 pF capacitance avoids resonance shift in 13.56 MHz LC tank; ±28 kV contact rating ensures field reliability across global user demographics. |
| USB 3.2 Gen 2 VBUS Line Protection | Automotive V2X 5.9 GHz DSRC Antenna Port |
|
Use Scenario: Safeguarding USB 3.2 Gen 2 (10 Gbps) VBUS power rail against hot-plug ESD and load-dump transients in docking stations and portable SSD enclosures. IC Role / Device Role / Timing Role: Standoff diode connected between VBUS and chassis ground, clamping transients before they reach USB controller power management circuitry. Use Value: 24 V working voltage matches USB PD 3.0 specification; 0.58 dB loss at 3 GHz avoids signal integrity degradation in high-speed data lanes sharing same PCB layer. |
Use Scenario: Protecting dedicated 5.9 GHz DSRC/V2X antenna port in automotive ADAS ECUs from ESD during service or environmental exposure in roadside units and vehicle-mounted transceivers. IC Role / Device Role / Timing Role: AEC-Q101-qualified RF ESD clamp mounted directly at SMA connector feed-through, minimizing stub length to preserve VSWR below 1.5:1. Use Value: −55 °C to +150 °C operation supports under-hood deployment; 0.65 mm pitch enables placement within 1 mm of RF connector for optimal high-frequency transient capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD7205MUTAG | 0.35 pF @ 1 GHz, 12 V VRWM, 24 V VC @ 8 A, SOT-523 package (1.6 × 0.8 mm) | Lower capacitance but reduced voltage rating - suited for 12 V logic I/O, not 24 V RF bias rails | Select when protecting low-voltage digital interfaces (e.g., I²C, UART) where <0.4 pF is mandatory and 24 V operation is unnecessary |
| SP1003-01UTG | 0.6 pF @ 1 GHz, 5 V VRWM, 12 V VC @ 8 A, 0201 DFN package (0.6 × 0.3 mm) | Smaller footprint and lower clamping, but insufficient for 24 V antenna bias - fails IEC61000-4-2 Level 4 at >20 kV | Choose for space-constrained 5 V IoT sensor nodes with strict size limits; avoid for cellular or automotive RF applications requiring ≥24 V standoff |
Compared with ESD7205MUTAG and SP1003-01UTG, SZESD7241N2T5G uniquely balances 24 V working voltage, ±28 kV ESD robustness, and 0.7 pF RF transparency - making it the only qualified option for 5G antenna line protection where voltage rating, frequency response, and automotive qualification intersect.
Availability
SZESD7241N2T5G is available at Aetrix Electronics and suitable for 5G handset antenna protection, NFC interface hardening, and automotive V2X RF port safeguarding requiring stable component supply across high-volume production cycles.
Supply support for SZESD7241N2T5G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power management, analog, sensing, and connectivity solutions for automotive, industrial, and cloud infrastructure markets.
SZESD7241N2T5G belongs to onsemi's ESD72xx family of ultra-low-capacitance TVS diodes engineered specifically for RF front-end protection - targeting design-in requirements for next-generation wireless handsets, telematics, and high-frequency IoT systems.
FAQ
What is the maximum clamping voltage of SZESD7241N2T5G under IEC61000-4-2 8 kV contact discharge?
The SZESD7241N2T5G does not specify clamping voltage under the full IEC61000-4-2 waveform in its datasheet. Instead, it provides TLP-derived clamping: 38 V at 8 A and 48 V at 16 A. These values correlate to the peak current portion of an 8 kV ESD event and serve as the engineering basis for system-level protection design. Actual oscilloscope waveforms for ±8 kV contact discharge are shown in Figures 7 and 8 of the SZESD7241N2T5G datasheet.
Is SZESD7241N2T5G compatible with reflow soldering per J-STD-020?
Yes, SZESD7241N2T5G is rated for lead solder temperature up to 260 °C for 10 seconds, fully compliant with J-STD-020 moisture sensitivity level (MSL) 1 requirements. The X2DFN2 package uses Pb-free terminations and supports standard SnAgCu reflow profiles with peak temperatures ≤260 °C and time above liquidus (TAL) ≤60 seconds - verified in onsemi's package reliability testing.
Does SZESD7241N2T5G support bi-directional signal paths such as RF differential pairs?
Yes, SZESD7241N2T5G is inherently bi-directional due to its symmetrical silicon avalanche structure. It provides identical clamping performance from Terminal 1 to Terminal 2 and Terminal 2 to Terminal 1, as confirmed by separate TLP IV curves in Figures 11 and 12 of the datasheet. This makes SZESD7241N2T5G suitable for protecting balanced RF lines like LTE MIMO antenna feeds without polarity concerns.
What is the leakage current specification for SZESD7241N2T5G at 24 V reverse bias?
The SZESD7241N2T5G specifies maximum reverse leakage current (IR) of 0.5 µA at VRWM = 24 V, measured per JEDEC JESD22-A114. This low leakage ensures negligible DC loading on RF bias networks and preserves quiescent current budgets in battery-powered 5G modules where the SZESD7241N2T5G is commonly deployed.
How does the capacitance of SZESD7241N2T5G vary with applied DC bias voltage?
SZESD7241N2T5G exhibits industry-leading capacitance linearity: 1.0 pF at 0 V, decreasing to 0.7 pF at 24 V reverse bias (per Figure 2). This monotonic, predictable CV curve minimizes detuning of impedance-matching networks in tunable antenna systems - a critical advantage over conventional ESD diodes whose capacitance may drop sharply near breakdown.
SZESD7241N2T5G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 2-XDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 24V (Max)
- Voltage - Breakdown (Min):
- 24.3V
- Voltage - Clamping (Max) @ Ipp:
- 48V (Typ)
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- RF Antenna
- Capacitance @ Frequency:
- 1pF @ 1MHz (Max)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 2-X2DFN (1x0.6)
SZESD7241N2T5G FAQ
1.How can I place an order for SZESD7241N2T5G through Aetrix?
Please submit a Request for Quotation (RFQ) for SZESD7241N2T5G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SZESD7241N2T5G reliable?
The price and inventory of SZESD7241N2T5G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SZESD7241N2T5G is usually 5 days.
3.What payment methods are accepted for SZESD7241N2T5G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SZESD7241N2T5G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SZESD7241N2T5G?
SZESD7241N2T5G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SZESD7241N2T5G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SZESD7241N2T5G?
For technical support, including SZESD7241N2T5G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SZESD7241N2T5G requirements.
6.How does Aetrix verify that SZESD7241N2T5G is sourced from the original manufacturer or authorized distributors?
All SZESD7241N2T5G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SZESD7241N2T5G meets industry standards.
7.What is the process for return or replacement of SZESD7241N2T5G?
All SZESD7241N2T5G units undergo pre-shipment inspection (PSI). If there is an issue with SZESD7241N2T5G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SZESD7241N2T5G part is unused and in its original packaging.
Return procedure for SZESD7241N2T5G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SZESD7241N2T5G Tags

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ESD9B5.0ST5G
onsemi

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DESD3V3E1BL-7B
Diodes Incorporated

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onsemi

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D5V0H1B2LP-7B
Diodes Incorporated

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D5V0P1B2LP-7B
Diodes Incorporated

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DESD5V0U1BA-7
Diodes Incorporated

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ESD5Z5.0T1G
onsemi

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DESD5V0U1BB-7
Diodes Incorporated

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D12V0L1B2LP-7B
Diodes Incorporated

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PESD2V0Y1BSFYL
Nexperia USA Inc.

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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

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Diodes Incorporated
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