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onsemi SZESD7462MXWT5G
- Part No.:
- SZESD7462MXWT5G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 2-XDFN
- Datasheet:
-
SZESD7462MXWT5G.pdf
- Description:
- TVS DIODE 16VWM 47VC 2X2DFNW
- Quantity:
- Payment:
- Shipping:
Inventory:8,577
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Product details
Overview
SZESD7462MXWT5G from onsemi is a bi-directional ESD protection diode in a wettable flank X2DFNW-2 package, featuring ultra-low 0.3 pF typical junction capacitance, ±18 kV IEC 61000-4-2 contact ESD rating, and 0.05 dB insertion loss at 1 GHz - engineered for RF antenna line protection in wireless handsets.
For engineers reviewing the SZESD7462MXWT5G datasheet, pinout, applications, or equivalent options, key selection criteria include capacitance linearity over voltage, clamping performance under ±8 kV IEC contact discharge, wettable flank AOI compatibility, and AEC-Q101 qualification for automotive RF front-end use.
Technical Context
The SZESD7462MXWT5G implements a bi-directional TVS structure with symmetrical breakdown (16.5–28 V at 1 mA) and dynamic resistance of 1.6 Ω, enabling low-voltage clamping during fast ESD transients. Its capacitance remains stable from 0 V to 16 V reverse bias, critical for maintaining RF signal integrity across antenna paths.
Designed for placement directly at RF connectors or switch outputs, it supports IEC 61000-4-2 Level 4 (±18 kV contact), IEC 61000-4-4 (40 A EFT), and ISO 10605 (±30 kV, 150 pF/2 kΩ), with clamping voltage specified at ±34 V (IPP = ±8 A) and ±47 V (IPP = ±16 A) per TLP testing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Capacitance @ 0 V, 1 MHz | 0.30 pF typical - preserves impedance matching and minimizes signal distortion in 50 Ω RF paths up to 3 GHz. |
| Clamping Voltage @ ±8 A TLP | ±34 V - limits transient overvoltage to safe levels for sensitive GaAs pHEMT or CMOS RF switches. |
| Working Peak Reverse Voltage | 16 V - supports continuous operation in 3.3 V, 5 V, and 12 V RF supply rails without leakage degradation. |
| Reverse Leakage @ 16 V | < 100 nA typical - avoids DC loading of high-impedance antenna detection circuits or LNA bias networks. |
| ESD Rating (IEC 61000-4-2) | ±18 kV contact - exceeds Level 4 immunity requirement for handheld consumer and automotive infotainment antennas. |
| Insertion Loss @ 1 GHz | 0.05 dB - ensures negligible RF power loss in main antenna feed lines, preserving TRP/TIS metrics. |
| Package | X2DFNW-2 (1.00 × 0.60 × 0.37 mm, 0.65 mm pitch) - wettable flank design enables automated optical inspection and reliable solder joint assessment. |
Pinout & Package
X2DFNW-2 is a 2-terminal, bi-directional surface-mount package with exposed wettable flank side walls for AOI-compatible solder joint verification. Dimensions: 1.00 mm × 0.60 mm × 0.37 mm, 0.65 mm lead pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | Anode/Cathode (bi-directional) | Shared terminal for symmetrical ESD current conduction - connects between RF line and ground or between differential RF traces. |
| Pin 2 | Anode/Cathode (bi-directional) | Second terminal completing the bi-directional path - no polarity marking required; interchangeable in layout. |
Key Features
| Feature | Design Value |
|---|---|
| Capacitance linearity over voltage | Stable 0.25–0.55 pF range from 0–16 V reverse bias - maintains consistent group delay and phase response in wideband antenna tuning. |
| Wettable flank package | X2DFNW-2 footprint with side-wall metallization - enables 100% automated optical inspection of solder fillet geometry without X-ray. |
| AEC-Q101 qualification | Qualified for automotive applications including telematics and ADAS antenna modules - validated for temperature cycling, HTRB, and ESD robustness. |
| Ultra-low insertion loss | 0.05 dB @ 1 GHz and 0.10 dB @ 3 GHz - reduces thermal rise in PA output stages and preserves antenna efficiency in LTE/5G bands. |
Applications
| Antenna Line Protection | RF Switch ESD Clamp |
|---|---|
|
Use Scenario: Protecting main cellular antenna feed line in smartphone PCBs against user-hand ESD events during plug/unplug or pocket discharge. IC Role / Device Role / Timing Role: Bi-directional shunt ESD clamp placed between antenna port and RF transceiver IC input. Use Value: 0.3 pF capacitance prevents detuning of PIFA or ceramic antennas; ±18 kV contact rating ensures pass/fail compliance per IEC 61000-4-2. |
Use Scenario: Safeguarding SPDT RF switches in multi-band front-end modules from ESD-induced gate oxide damage during board handling. IC Role / Device Role / Timing Role: Low-capacitance transient suppressor mounted directly at switch RF I/O pins before matching network. Use Value: 0.05 dB insertion loss avoids gain compression in 2.4 GHz Wi-Fi or sub-6 GHz 5G bands; clamps to ±34 V at 8 A TLP peak. |
| NFC Antenna Interface | Automotive Telematics Antenna |
|
Use Scenario: Shielding 13.56 MHz NFC loop antenna traces from electrostatic discharge during card tap or reader proximity events. IC Role / Device Role / Timing Role: Series-connected ESD protector on differential NFC antenna feed, minimizing common-mode noise coupling. Use Value: Capacitance stability over bias ensures consistent resonance frequency shift < ±0.1 MHz; <100 nA leakage avoids DC offset in analog demodulator inputs. |
Use Scenario: Hardening LTE/V2X antenna ports in automotive telematics control units against roadside ESD and ignition noise transients. IC Role / Device Role / Timing Role: AEC-Q101-qualified shunt protector integrated into antenna coaxial interface PCB layout near SMA connector. Use Value: Wettable flank X2DFNW-2 package supports IPC-A-610 Class 3 AOI acceptance; ±30 kV ISO 10605 rating covers vehicle-level ESD stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD7462N2T5G | Same die, X2DFN2 package (non-wettable flank); identical electrical specs but lacks AOI-compatible side walls. | Preferred for cost-sensitive consumer electronics where AOI is not mandated; unsuitable for automotive PPAP validation requiring solder joint inspection. | Select when AOI is not required and footprint compatibility with legacy X2DFN2 layouts is prioritized. |
| CM1213A-03SO | 0.35 pF typical capacitance, ±12 kV IEC 61000-4-2 rating, SOD-323 package (1.7 × 1.3 mm); higher insertion loss (0.25 dB @ 1 GHz). | Used in mid-tier IoT devices with less stringent RF performance; larger footprint limits placement near ultra-compact antenna connectors. | Choose only if board space allows larger package and ±12 kV rating suffices for target end-equipment immunity class. |
Compared with ESD7462N2T5G and CM1213A-03SO, SZESD7462MXWT5G uniquely combines wettable flank AOI support, ±18 kV ESD immunity, and 0.3 pF capacitance in a 1.00 × 0.60 mm footprint - making it the only option qualified for automotive-grade RF antenna protection with full process traceability.
Availability
SZESD7462MXWT5G is available at Aetrix Electronics and suitable for RF antenna line protection, automotive telematics modules, and high-frequency NFC interfaces requiring stable component supply, AEC-Q101 compliance, and wettable flank manufacturability.
Supply support for SZESD7462MXWT5G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.
SZESD7462MXWT5G belongs to onsemi's ESD7462 family of ultra-low-capacitance TVS diodes, designed specifically for protecting high-speed RF signal paths in next-generation wireless handsets and automotive connectivity systems.
FAQ
What is the primary circuit role of the SZESD7462MXWT5G in an RF design?
The SZESD7462MXWT5G serves as a bi-directional shunt ESD protection device placed directly on RF signal lines - such as antenna feeds or RF switch I/O - to clamp transient voltages while introducing minimal capacitive loading. Its 0.3 pF capacitance and 0.05 dB insertion loss at 1 GHz ensure RF performance remains uncompromised, making SZESD7462MXWT5G ideal for LTE, 5G, and Wi-Fi front-end protection.
Does the SZESD7462MXWT5G meet automotive qualification standards?
Yes, the SZESD7462MXWT5G is AEC-Q101 qualified and PPAP capable, with test reports covering temperature cycling, high-temperature reverse bias, and ESD robustness. Its X2DFNW-2 wettable flank package further supports automotive manufacturing requirements, including AOI-based solder joint verification - confirming SZESD7462MXWT5G is approved for use in telematics, V2X, and infotainment antenna systems.
What is the clamping voltage behavior of the SZESD7462MXWT5G under real-world ESD stress?
The SZESD7462MXWT5G clamps to ±34 V at ±8 A TLP current and ±47 V at ±16 A TLP, per ANSI/ESD STM5.5.1 testing. Under IEC 61000-4-2 ±8 kV contact discharge, oscilloscope waveforms show clamping within 10 ns. This rapid response and predictable voltage ceiling protect downstream LNAs and power amplifiers - a core design value of SZESD7462MXWT5G in RF front-end architectures.
How does the wettable flank feature of the SZESD7462MXWT5G improve manufacturing yield?
The X2DFNW-2 package of SZESD7462MXWT5G includes metallized side walls that allow automated optical inspection (AOI) systems to verify solder fillet shape, height, and wetting angle - eliminating reliance on X-ray for hidden-joint assessment. This capability reduces false call rates in high-volume smartphone and automotive PCB assembly, directly improving first-pass yield for SZESD7462MXWT5G placements near RF connectors.
Can the SZESD7462MXWT5G be used in USB 2.0 data line protection?
Yes, the SZESD7462MXWT5G is explicitly cited in its datasheet for USB 2.0 and USB 3.0 applications due to its ultra-low 0.3 pF capacitance, which avoids signal integrity degradation at 480 Mbps (USB 2.0) and 5 Gbps (USB 3.0). Its ±18 kV IEC 61000-4-2 rating exceeds USB-IF ESD immunity requirements, confirming SZESD7462MXWT5G as a validated solution for high-speed serial interface protection.
SZESD7462MXWT5G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 2-XDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 16V (Max)
- Voltage - Breakdown (Min):
- 16.5V
- Voltage - Clamping (Max) @ Ipp:
- 47V (Typ)
- Current - Peak Pulse (10/1000µs):
- 16A
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- RF Antenna, Telecom, USB 2.0, USB 3.0
- Capacitance @ Frequency:
- 0.3pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 2-X2DFNW (1x0.6)
SZESD7462MXWT5G FAQ
1.How can I place an order for SZESD7462MXWT5G through Aetrix?
Please submit a Request for Quotation (RFQ) for SZESD7462MXWT5G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SZESD7462MXWT5G reliable?
The price and inventory of SZESD7462MXWT5G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SZESD7462MXWT5G is usually 5 days.
3.What payment methods are accepted for SZESD7462MXWT5G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SZESD7462MXWT5G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SZESD7462MXWT5G?
SZESD7462MXWT5G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SZESD7462MXWT5G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SZESD7462MXWT5G?
For technical support, including SZESD7462MXWT5G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SZESD7462MXWT5G requirements.
6.How does Aetrix verify that SZESD7462MXWT5G is sourced from the original manufacturer or authorized distributors?
All SZESD7462MXWT5G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SZESD7462MXWT5G meets industry standards.
7.What is the process for return or replacement of SZESD7462MXWT5G?
All SZESD7462MXWT5G units undergo pre-shipment inspection (PSI). If there is an issue with SZESD7462MXWT5G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SZESD7462MXWT5G part is unused and in its original packaging.
Return procedure for SZESD7462MXWT5G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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