onsemi SZESD7551N2T5G
- Part No.:
- SZESD7551N2T5G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 2-XDFN
- Datasheet:
-
SZESD7551N2T5G.pdf
- Description:
- BI-DIRECTIONAL, 5V ESD PROTECTIO
- Quantity:
- Payment:

- Shipping:

Inventory:7,750
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Product details
Overview
SZESD7551N2T5G from onsemi is a bi-directional ESD protection diode in X2DFN2 package, designed for ultra-low-capacitance (0.35 pF max) transient suppression on high-frequency signal lines. It features 3.3 V stand-off voltage, 10 V clamping at 1 A IPP, <1 ns response time, and AEC-Q101 qualification-ideal for USB 2.0 high-speed data lines and RF antenna interfaces.
For engineers reviewing the SZESD7551N2T5G datasheet, pinout, applications, or equivalent options, key selection criteria include clamping voltage under IEC 61000-4-2 Level 4, junction capacitance at 1 GHz, dynamic resistance (<2 Ω), leakage current (<50 nA @ 3.3 V), and wettable flank compatibility for AOI inspection.
Technical Context
The SZESD7551N2T5G implements a symmetric bi-directional TVS structure optimized for sub-1 GHz RF signal integrity. Its low dynamic resistance (0.55 Ω typ.) and ultra-low capacitance (0.22 pF @ 1 GHz) minimize insertion loss and signal distortion in antenna front-end and NFC applications.
It meets IEC 61000-4-2 Level 4 (±25 kV contact/air) and ISO 10605 (±30 kV, 150 pF/2 kΩ), with clamping voltage measured per TLP pulse (1 A/3 A) and validated using oscilloscope waveform capture-not just peak voltage thresholds.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Stand-off Voltage | 3.3 V - Ensures no conduction during normal operation of 3.3 V logic or RF bias rails. |
| Clamping Voltage | 10 V @ 1 A IPP - Limits voltage seen by protected IC to safe level during ESD strike. |
| Junction Capacitance | 0.22 pF @ 1 GHz - Preserves signal integrity in 2.4 GHz Wi-Fi, Bluetooth, and NFC antenna paths. |
| Dynamic Resistance | 0.55 Ω typ. - Reduces voltage overshoot during fast transients by minimizing IR drop across diode. |
| ESD Rating | ±25 kV IEC 61000-4-2 contact - Validated protection level for handheld and portable device interfaces. |
| Leakage Current | <50 nA @ 3.3 V - Prevents DC loading on sensitive RF amplifier bias networks. |
| Response Time | <1 ns - Activates before transient energy couples into downstream IC inputs. |
Pinout & Package
Package: X2DFN2 (1.00 mm × 0.60 mm × 0.37 mm, 0.65 mm pitch), Pb-free, halogen-free, RoHS-compliant surface-mount package with exposed cathode pad for thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Cathode) | Protected Line Terminal (Anode-side connection in bi-directional clamp) | Connected to signal line requiring ESD protection; forms one side of symmetrical clamp path. |
| 2 (Anode) | Protected Line Terminal (Cathode-side connection in bi-directional clamp) | Connected to same signal line as Pin 1; enables equal clamping in both polarity directions. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance | 0.22 pF @ 1 GHz - Enables use on 480 Mbps USB 2.0 differential pairs without eye diagram degradation. |
| Bi-directional clamping | Symmetric IV curve - Protects AC-coupled RF signals (e.g., antenna feeds) without polarity constraints. |
| AEC-Q101 qualification | Automotive-grade reliability - Validated for under-hood and infotainment module deployment per stress test requirements. |
| Wettable flank option available | SZESD7551MXWT5G variant - Supports automated optical inspection of solder joint quality on fine-pitch PCBs. |
| IEC/ISO compliance | Passes IEC 61000-4-2 Level 4 & ISO 10605 - Meets global regulatory requirements for consumer and automotive end-equipment. |
Applications
| USB 2.0 High-Speed Interface | Mobile Antenna Front-End |
|---|---|
Use Scenario: Protection of D+ and D− lines in smartphone USB ports against user-handling ESD events. IC Role / Device Role: Bi-directional transient voltage suppressor placed directly at connector entry point. Use Value: 0.22 pF capacitance avoids signal rise-time degradation, maintaining 480 Mbps data integrity per USB 2.0 spec. |
Use Scenario: ESD safeguarding of LTE/5G antenna feedlines between RF switch and transceiver. IC Role / Device Role: Low-capacitance shunt clamp integrated between antenna switch output and PA input. Use Value: Sub-1 ns response prevents gate oxide damage to GaAs/GaN power amplifiers during handling discharge. |
| NFC Loop Antenna | Automotive Infotainment Display Port |
Use Scenario: Transient protection on 13.56 MHz NFC reader coil connections in payment terminals. IC Role / Device Role: Series-connected ESD diode on differential loop driver outputs. Use Value: 0.35 pF max capacitance preserves Q-factor and read range (>10 cm) without tuning compensation. |
Use Scenario: HDMI or MIPI D-PHY data lanes in automotive center-stack displays exposed to service technician ESD. IC Role / Device Role: Per-lane bi-directional clamp adjacent to display controller I/O pins. Use Value: AEC-Q101 qualification ensures long-term reliability in 85°C under-hood thermal cycling environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD7551N2T5G | Non-automotive grade; identical electrical specs but lacks AEC-Q101 certification and SZ prefix traceability. | Targeted at consumer electronics where automotive qualification is not required. | Select when cost sensitivity outweighs automotive compliance needs and supply chain traceability is non-critical. |
| CM1213A-03SR | Higher capacitance (0.65 pF), higher clamping (14 V @ 1 A), SOD-923 package (1.0 × 0.6 mm but different footprint). | Better suited for lower-frequency interfaces (e.g., I²C, UART); not recommended for >1 GHz RF paths. | Choose only if board layout allows SOD-923 rework and system-level ESD margin permits higher clamping voltage. |
Compared with ESD7551N2T5G and CM1213A-03SR, the SZESD7551N2T5G delivers automotive-grade reliability and lowest RF insertion loss-critical for antenna and high-speed serial interface protection where signal fidelity and qualification compliance are jointly mandatory.
Availability
SZESD7551N2T5G is available at Aetrix Electronics and suitable for USB 2.0 high-speed interfaces, mobile antenna front-ends, and automotive infotainment display ports requiring stable component supply and full AEC-Q101 traceability.
Supply support for SZESD7551N2T5G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (Semiconductor Components Industries, LLC) is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.
The SZESD7551N2T5G belongs to onsemi's ESD7551 family-engineered specifically for ultra-low-capacitance, high-frequency ESD protection in space-constrained RF and high-speed digital systems.
FAQ
What is the maximum clamping voltage of SZESD7551N2T5G under IEC 61000-4-2 testing?
The SZESD7551N2T5G does not specify a single "maximum clamping voltage" under IEC 61000-4-2, as the standard defines pass/fail by peak current-not clamping. Instead, onsemi characterizes it via TLP: 10 V clamping at 1 A IPP and 13 V at 3 A IPP. These values represent the actual voltage seen by protected circuitry during standardized ESD transients, and the SZESD7551N2T5G consistently achieves them across production lots.
Is SZESD7551N2T5G compatible with lead-free reflow profiles?
Yes, SZESD7551N2T5G supports JEDEC J-STD-020D-compliant lead-free reflow, with a maximum lead solder temperature of 260°C for 10 seconds. Its X2DFN2 package is qualified for standard Pb-free assembly processes, and the device's thermal resistance (RJA = 400°C/W) ensures safe operation during typical reflow ramp rates and soak times used in high-volume SMT lines.
Does SZESD7551N2T5G require external biasing or control signals?
No, SZESD7551N2T5G is a passive, bi-directional TVS diode requiring no external bias, power, or control. It operates solely on voltage threshold behavior: conducting only when reverse voltage exceeds ~5 V (breakdown) or forward voltage exceeds ~0.7 V. This makes the SZESD7551N2T5G ideal for always-on protection on unpowered or intermittently active signal lines like antenna feeds or USB connectors.
How does the capacitance of SZESD7551N2T5G vary with frequency?
SZESD7551N2T5G exhibits 0.25 pF at 1 MHz, 0.22 pF at 1 GHz, and remains ≤0.35 pF up to 6 GHz per datasheet CV curves. This flat, ultra-low profile-unlike conventional diodes whose capacitance rises at lower frequencies-is achieved through optimized junction geometry and low-parasitic packaging, ensuring minimal impact on 5G NR and Wi-Fi 6E antenna matching networks.
Can SZESD7551N2T5G be used in place of a unidirectional ESD diode?
SZESD7551N2T5G is inherently bi-directional and should not replace unidirectional diodes in circuits requiring DC blocking or polarity-specific clamping (e.g., power rail protection). However, for AC-coupled signal lines like USB D+/D−, RF antennas, or MIPI clock pairs, its symmetric clamping provides superior protection without polarity constraints-and the SZESD7551N2T5G's 3.3 V stand-off ensures compatibility with common 3.3 V I/O domains.
SZESD7551N2T5G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 2-XDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 5V
- Voltage - Clamping (Max) @ Ipp:
- 13V
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- Telecom, USB
- Capacitance @ Frequency:
- 0.22pF @ 1GHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 2-X2DFN (1x0.6)
SZESD7551N2T5G FAQ
1.How can I place an order for SZESD7551N2T5G through Aetrix?
Please submit a Request for Quotation (RFQ) for SZESD7551N2T5G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SZESD7551N2T5G reliable?
The price and inventory of SZESD7551N2T5G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SZESD7551N2T5G is usually 5 days.
3.What payment methods are accepted for SZESD7551N2T5G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SZESD7551N2T5G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SZESD7551N2T5G?
SZESD7551N2T5G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SZESD7551N2T5G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SZESD7551N2T5G?
For technical support, including SZESD7551N2T5G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SZESD7551N2T5G requirements.
6.How does Aetrix verify that SZESD7551N2T5G is sourced from the original manufacturer or authorized distributors?
All SZESD7551N2T5G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SZESD7551N2T5G meets industry standards.
7.What is the process for return or replacement of SZESD7551N2T5G?
All SZESD7551N2T5G units undergo pre-shipment inspection (PSI). If there is an issue with SZESD7551N2T5G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SZESD7551N2T5G part is unused and in its original packaging.
Return procedure for SZESD7551N2T5G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SZESD7551N2T5G Tags

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ESD9B5.0ST5G
onsemi

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DESD3V3E1BL-7B
Diodes Incorporated

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ESD5Z3.3T1G
onsemi

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D5V0H1B2LP-7B
Diodes Incorporated

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D5V0P1B2LP-7B
Diodes Incorporated

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DESD5V0U1BA-7
Diodes Incorporated

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ESD5Z5.0T1G
onsemi

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DESD5V0U1BB-7
Diodes Incorporated

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D12V0L1B2LP-7B
Diodes Incorporated

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PESD2V0Y1BSFYL
Nexperia USA Inc.

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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

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D5V0L1B2WS-7
Diodes Incorporated
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