My Inquiry
My Account
onsemi SZESD7C3.3DT5G
- Part No.:
- SZESD7C3.3DT5G
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- SOT-723
- Datasheet:
-
SZESD7C3.3DT5G.pdf
- Description:
- SOT-723 EUT SNGL CPR PBF
- Quantity:
- Payment:
- Shipping:
Inventory:3,827
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SZESD7C3.3DT5G from onsemi is a unidirectional ESD protection diode in SOT-723 package, featuring 3.3 V working peak reverse voltage, ≤13 pF capacitance at 1 MHz, clamping voltage ≤12 V at 8 kV IEC 61000-4-2 contact discharge, <1 ns response time, and AEC-Q101 qualification for automotive use.
For engineers reviewing the SZESD7C3.3DT5G datasheet, pinout, applications, or equivalent options, key selection criteria include low-capacitance signal-line protection, sub-1 ns transient response, automotive-grade reliability, and compact 1.20 mm × 0.80 mm footprint for high-density portable designs.
Technical Context
This device implements a single unidirectional silicon avalanche diode structure optimized for IEC 61000-4-2 Level 4 (±8 kV contact / ±15 kV air) ESD suppression. It operates with a 3.3 V stand-off voltage and clamps transients to ≤12 V at 8 kV pulse, enabling protection of 3.3 V logic interfaces without forward conduction during normal operation.
Its 13 pF max capacitance at 0 V bias and 1 MHz ensures minimal signal integrity impact on high-speed lines such as USB 2.0, HDMI DDC, or I²C buses. The SOT-723 package supports reflow soldering up to 260 °C and meets MSL 1 requirements with void-free thermoset epoxy housing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Working Peak Reverse Voltage | 3.3 V - defines maximum continuous DC voltage the diode blocks before breakdown; matches 3.3 V I/O rail systems. |
| Clamping Voltage (IEC 61000-4-2) | ≤12 V at 8 kV contact - limits transient voltage seen by protected IC to safe level during ESD event. |
| Capacitance | 13 pF max @ 0 V, 1 MHz - preserves signal rise/fall times on data lines up to ~200 Mbps without distortion. |
| Response Time | <1 ns - enables suppression before sensitive circuitry experiences damaging overvoltage. |
| ESD Rating | Class 3 HBM (>16 kV), IEC 61000-4-2 Level 4 (±8 kV contact) - exceeds industrial and automotive immunity requirements. |
| Leakage Current | 1.0 μA max @ 3.3 V - avoids loading of high-impedance sensor or reference nodes. |
| Package | SOT-723 (Case 631AA), 1.20 mm × 0.80 mm × 0.50 mm - fits ultra-compact PCB layouts in smartphones and wearables. |
Pinout & Package
SOT-723 package: surface-mount, 3-terminal, lead-free matte tin finish, MSL 1, 260 °C max reflow temperature. Dimensions: 1.20 mm × 0.80 mm × 0.50 mm body, 0.40 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode | Connected to protected line (e.g., USB D+); conducts during positive ESD transients to ground. |
| 2 | Cathode | Internally tied to Pin 1; provides redundant cathode connection for improved current sharing and layout flexibility. |
| 3 | Anode | Connected to system ground; completes conduction path during ESD events; must be low-inductance ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| Low Capacitance | 13 pF max enables use on 480 Mbps USB 2.0 data lines without measurable eye diagram degradation. |
| AEC-Q101 Qualified | Validated for automotive infotainment and ADAS interface protection under temperature cycling, humidity, and mechanical stress. |
| IEC 61000-4-2 Level 4 Compliance | Guarantees robustness against real-world electrostatic discharges encountered during handling and operation. |
| Sub-1 ns Response | Activates faster than typical CMOS input protection structures, preventing latch-up or gate oxide damage. |
| Small Footprint | 1.20 mm × 0.80 mm area saves >60% board space vs. standard SOD-323, critical for multi-port mobile devices. |
Applications
| USB 2.0 Data Lines | HDMI DDC Channel |
|---|---|
Use Scenario: Protecting differential USB 2.0 D+ and D− lines from user-handling ESD in smartphones and OTG accessories. IC Role / Device Role: Unidirectional shunt clamp placed between each data line and ground, operating below 3.3 V logic threshold. Use Value: 13 pF capacitance avoids signal integrity loss at 480 Mbps; clamping ≤12 V prevents PHY layer damage during ±8 kV contact discharge. | Use Scenario: Safeguarding HDMI Display Data Channel (DDC) I²C bus (SCL/SDA) in portable projectors and docking stations. IC Role / Device Role: Standoff-rated ESD suppressor on 3.3 V open-drain I²C lines, with no DC loading due to 1.0 μA leakage. Use Value: Sub-1 ns response intercepts fast ESD transients before I²C transceivers enter fault state; SOT-723 allows dual-device placement in tight 2.5 mm pitch. |
| Automotive Infotainment Buttons | Industrial Sensor Interface |
Use Scenario: ESD protection for capacitive touch buttons and rotary encoders in vehicle center consoles exposed to dry-climate static discharge. IC Role / Device Role: Single-line unidirectional clamp referenced to chassis ground, qualified per AEC-Q101 for -40 °C to +125 °C operation. Use Value: 16 kV HBM rating withstands repeated glove-based contact; low leakage avoids drift in analog front-end bias networks. | Use Scenario: Shielding 4–20 mA loop-powered sensor inputs in factory automation modules from maintenance personnel ESD events. IC Role / Device Role: Low-capacitance transient suppressor on 3.3 V microcontroller ADC input pins connected to isolated analog front ends. Use Value: 3.3 V VRWM aligns with MCU I/O voltage; 12 V clamping prevents ADC saturation or internal ESD diode failure during field service. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD7L3.3DT5G | Lower capacitance (6.2 pF typ), same 3.3 V VRWM, but rated only to IEC Level 3 (±6 kV contact). | Preferred for ultra-high-speed lines (>500 Mbps) where lower C is critical; not suitable for Level 4 environments like automotive interiors. | Select when signal bandwidth >300 MHz dominates over ESD severity requirements. |
| TPD2E001DRYR | Bi-directional configuration, 10 pF max, 5 V VRWM, supports dual-line protection in one 1.0 mm × 0.6 mm package. | Used for bidirectional data lines (e.g., UART, RS-485) requiring symmetrical clamping; incompatible with unidirectional 3.3 V rail-referenced protection. | Choose for space-constrained bidirectional interfaces where 5 V standoff suffices and polarity alignment is not required. |
Compared with ESD7L3.3DT5G and TPD2E001DRYR, SZESD7C3.3DT5G uniquely balances Level 4 ESD robustness, 3.3 V rail compatibility, and 13 pF capacitance-making it optimal for automotive and premium consumer USB/HDMI interfaces where both immunity and signal fidelity are non-negotiable.
Availability
SZESD7C3.3DT5G is available at Aetrix Electronics and suitable for USB 2.0 interface protection, automotive infotainment button circuits, and industrial sensor ADC input conditioning requiring stable component supply across production lifecycles.
Supply support for SZESD7C3.3DT5G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.
The SZESD7C series is part of onsemi's ESD protection portfolio designed specifically for ultra-compact, high-reliability transient suppression in portable and automotive electronics with stringent board-area constraints.
FAQ
What is the maximum clamping voltage of SZESD7C3.3DT5G under IEC 61000-4-2 testing?
The SZESD7C3.3DT5G exhibits a maximum clamping voltage of 12 V when subjected to an 8 kV contact discharge per IEC 61000-4-2 Level 4. This value is measured across the device terminals during the first 30 ns of the ESD pulse waveform and ensures downstream ICs remain within safe operating voltage limits. The clamping performance is validated using oscilloscope waveform capture per onsemi Application Note AND8307/D.
Is SZESD7C3.3DT5G suitable for protecting bidirectional data lines like I²C?
SZESD7C3.3DT5G is a unidirectional ESD suppressor and is not recommended for true bidirectional lines such as I²C without external biasing. Its 3.3 V stand-off voltage blocks only negative transients relative to ground; positive transients on a pull-up line require either a second device or a bi-directional alternative like TPD2E001DRYR. For I²C SDA/SCL, proper implementation requires verifying signal polarity and DC bias conditions before selecting SZESD7C3.3DT5G.
Does SZESD7C3.3DT5G meet automotive qualification standards?
Yes, SZESD7C3.3DT5G carries the "SZ" prefix indicating AEC-Q101 qualification and PPAP capability. It has been tested for temperature cycling, high-temperature operating life, and ESD robustness per automotive requirements, supporting operation from −40 °C to +125 °C junction temperature. This makes SZESD7C3.3DT5G appropriate for infotainment, body control, and ADAS interface protection in passenger vehicles.
What is the thermal resistance and power dissipation limit of SZESD7C3.3DT5G?
SZESD7C3.3DT5G has a thermal resistance of 525 °C/W (junction-to-ambient) on FR-5 board and a maximum power dissipation of 240 mW at 25 °C ambient. Derating is 1.9 mW/°C above 25 °C. These values reflect its micro-package construction and define safe continuous operating limits-though ESD events are transient, so peak power (Ppk) during clamping is the dominant design parameter, not steady-state dissipation.
How does the SOT-723 package of SZESD7C3.3DT5G compare to SOD-323 in PCB layout?
The SOT-723 package of SZESD7C3.3DT5G measures 1.20 mm × 0.80 mm × 0.50 mm-approximately 40% smaller in footprint than standard SOD-323 (1.7 mm × 1.3 mm). Its 0.40 mm pin pitch and dual-cathode configuration allow tighter routing around high-density connectors and reduce parasitic inductance. Layout best practices for SZESD7C3.3DT5G include short, direct traces to ground and avoiding vias in the protection path to preserve sub-1 ns response.
SZESD7C3.3DT5G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- SOT-723
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 2
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 5V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- -
- Capacitance @ Frequency:
- 12pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-723
SZESD7C3.3DT5G FAQ
1.How can I place an order for SZESD7C3.3DT5G through Aetrix?
Please submit a Request for Quotation (RFQ) for SZESD7C3.3DT5G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SZESD7C3.3DT5G reliable?
The price and inventory of SZESD7C3.3DT5G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SZESD7C3.3DT5G is usually 5 days.
3.What payment methods are accepted for SZESD7C3.3DT5G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SZESD7C3.3DT5G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SZESD7C3.3DT5G?
SZESD7C3.3DT5G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SZESD7C3.3DT5G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SZESD7C3.3DT5G?
For technical support, including SZESD7C3.3DT5G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SZESD7C3.3DT5G requirements.
6.How does Aetrix verify that SZESD7C3.3DT5G is sourced from the original manufacturer or authorized distributors?
All SZESD7C3.3DT5G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SZESD7C3.3DT5G meets industry standards.
7.What is the process for return or replacement of SZESD7C3.3DT5G?
All SZESD7C3.3DT5G units undergo pre-shipment inspection (PSI). If there is an issue with SZESD7C3.3DT5G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SZESD7C3.3DT5G part is unused and in its original packaging.
Return procedure for SZESD7C3.3DT5G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SZESD7C3.3DT5G Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
