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onsemi SZESD8006MUTAG

Part No.:
SZESD8006MUTAG
Manufacturer:
onsemi
Category:
TVS Diodes
Package:
10-UFDFN
Datasheet:
AetrixSZESD8006MUTAG.pdf
Description:
TVS DIODE 3.3VWM 9.5VC 8-UDFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:11,168

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Product details

Overview

SZESD8006MUTAG from onsemi is an ultra-low-capacitance ESD protection diode array designed for high-speed differential data lines including USB 3.0, Thunderbolt, and DisplayPort. It features 0.25 pF max junction capacitance (at 1 MHz), 3.3 V reverse working voltage, ±15 kV IEC 61000−4−2 contact/air ESD rating, and clamps to ≤8.4 V at ±8 kV contact discharge. Its UDFN8 package enables matched trace routing for impedance control in 5–10 Gb/s interfaces.

For engineers reviewing the SZESD8006MUTAG datasheet, pinout, applications, or equivalent options, key selection criteria include low clamping voltage under IEC 61000−4−2 Level 4 stress, sub-0.3 pF capacitance at 2.5 GHz, latch-up-free operation in USB 3.0/3.1 and DisplayPort, and validated eye diagram integrity at 5 Gb/s and 10 Gb/s.

Technical Context

The SZESD8006MUTAG employs a snap-back SCR-based structure optimized for high-speed serial interfaces, with verified latch-up immunity in USB 3.0/3.1 SuperSpeed and DisplayPort applications per load-line analysis. Its dynamic resistance is 0.44 Ω (I/O to GND) and 0.49 Ω (GND to I/O), enabling fast transient response and low-voltage clamping during ESD events.

It supports bidirectional protection across six I/O pins referenced to four common GND terminals, with a flow-through UDFN8 layout that minimizes parasitic inductance and maintains differential pair symmetry. The device operates from −55 °C to +125 °C and is AEC-Q101 qualified for automotive-grade reliability.

Key Specifications

Parameter Value and Actual Design Meaning
Capacitance 0.25 pF max (I/O to GND, f = 2.5 GHz) - preserves signal integrity up to 10 Gb/s without measurable insertion loss degradation
Clamping Voltage 8.4 V @ +8 kV IEC contact (IPP = 16 A) - limits voltage stress on downstream PHY transceivers during worst-case ESD
Working Voltage 3.3 V VRWM - compatible with standard USB 3.0/Thunderbolt supply rails and AC-coupled signaling
ESD Rating ±15 kV IEC 61000−4−2 contact & air - exceeds Level 4 system-level immunity requirements
Breakdown Voltage 5.5–7.0 V VBR @ 1 mA - ensures robust margin above 3.3 V operating rail while enabling fast turn-on
Holding Voltage 1.19 V VHOLD - sustains low-voltage conduction post-trigger to prevent latch-up in USB 3.0 lanes
Operating Temp −55 °C to +125 °C TJ - supports extended industrial and automotive under-hood environments

Pinout & Package

Package: UDFN8 (3.3 mm × 1.0 mm, 0.4 mm pitch, Case 517CB), Pb-free, RoHS-compliant, with exposed thermal pad.

Pin/Terminal Circuit Role Design Meaning
1, 2, 4, 5, 7, 8 I/O (ESD-protected signal line) Each connects to one high-speed differential lane (e.g., SSTX+, SSTX−, SSRX+, etc.) - bidirectional clamping path to GND
3, 6, 9, 10 GND (common ground terminal) Four dedicated ground connections minimize ground bounce and ensure low-impedance ESD current return path

Key Features

Feature Design Value
Ultra-low capacitance 0.25 pF max at 2.5 GHz - avoids signal distortion and eye closure in 5–10 Gb/s USB/Thunderbolt links
Latch-up immunity Validated for USB 3.0/3.1 SS and DisplayPort per load-line analysis - eliminates risk of destructive DC latch-up
Flow-through layout Linear I/O–GND–I/O pin arrangement - enables symmetric PCB routing and consistent differential impedance
AEC-Q101 qualification Automotive-grade reliability with PPAP capability - suitable for infotainment and ADAS interface protection
IEC 61000−4−2 Level 4 compliance ±15 kV contact/air - meets stringent end-equipment ESD immunity standards without external circuitry

Applications

USB 3.0/3.1 Interface Protection Thunderbolt 3/4 Data Lane Protection

Use Scenario: Protecting SuperSpeed TX/RX differential pairs between USB Type-A/B/C connectors and host/device PHYs.

IC Role / Device Role / Timing Role: Bidirectional ESD clamp placed between AC coupling capacitors and connector - no DC path, zero impact on link training timing.

Use Value: Maintains <0.1 dB insertion loss at 2.5 GHz and preserves 5 Gb/s eye opening per Figure 14, while surviving ±15 kV contact discharge.

Use Scenario: Shielding Thunderbolt differential lanes (ML0–ML3, AUX±) against ESD in docking stations and active cables.

IC Role / Device Role / Timing Role: Low-capacitance shunt protector on each high-speed lane - prevents signal jitter accumulation and ensures PCIe Gen3 timing compliance.

Use Value: Enables clean 10 Gb/s eye diagrams (Figure 15) with <0.5 dB loss at 5 GHz fundamental frequency per Table 1.

DisplayPort 1.2/1.4 Main Link Protection Automotive Infotainment High-Speed Link Protection

Use Scenario: Safeguarding DP++ source/sink main link lanes (CH0–CH3) in monitors, GPUs, and adapters.

IC Role / Device Role / Timing Role: Differential ESD suppressor mounted adjacent to DP connector - matches trace lengths to preserve 100 Ω differential impedance.

Use Value: Prevents pixel corruption or link dropouts during hot-plug ESD events while maintaining <0.3 pF loading per lane.

Use Scenario: Protecting USB-C or Mini DisplayPort interfaces in automotive head units and rear-seat entertainment systems.

IC Role / Device Role / Timing Role: AEC-Q101-qualified ESD array ensuring functional safety in temperature-cycled, vibration-prone environments.

Use Value: Delivers guaranteed ±15 kV ESD immunity over −40 °C to +105 °C ambient, with no latch-up risk in USB 3.0 video streaming paths.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Alternative Part Technical Difference Application Difference Selection Advice
ESD8004MUTAG Same UDFN8 package; 0.32 pF capacitance (1 MHz); lower 3.0 V VRWM; identical latch-up profile for USB 3.0/DP Optimized for cost-sensitive USB 2.0/3.0 designs where 5 Gb/s margin is sufficient; not rated for 10 Gb/s Thunderbolt Select when protecting legacy USB 3.0-only ports with tighter BOM cost targets and no 10 Gb/s requirement.
ESD8104MUTAG Higher 0.45 pF capacitance; 5.0 V VRWM; specifically designed for HDMI TMDS lanes with enhanced latch-up immunity Qualified for HDMI 2.0/1.4 applications where SZESD8006MUTAG is explicitly excluded due to latch-up risk Choose only for HDMI interfaces; avoid for USB/Thunderbolt/DP where SZESD8006MUTAG's lower capacitance and proven 10 Gb/s performance are critical.

Compared with ESD8004MUTAG and ESD8104MUTAG, SZESD8006MUTAG uniquely balances 0.25 pF capacitance, 3.3 V VRWM, and latch-up-free operation across USB 3.0/3.1, Thunderbolt, and DisplayPort - making it the optimal choice for next-generation high-speed interconnects requiring both signal fidelity and robust ESD survival.

Availability

SZESD8006MUTAG is available at Aetrix Electronics and suitable for USB 3.0/3.1 host design, Thunderbolt 3/4 docking solutions, and automotive infotainment systems requiring stable component supply, long-term lifecycle assurance, and AEC-Q101-compliant sourcing.

Supply support for SZESD8006MUTAG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

onsemi (formerly ON Semiconductor) is a global semiconductor supplier delivering energy-efficient power, analog, sensing, and connectivity solutions for automotive, industrial, cloud, medical, and IoT applications.

SZESD8006MUTAG belongs to the ESD8000 series - a family of ultra-low-capacitance SCR-based ESD protection arrays engineered specifically for high-speed serial interfaces including USB, Thunderbolt, and DisplayPort, where signal integrity and latch-up immunity are non-negotiable.

FAQ

What is the maximum junction capacitance of SZESD8006MUTAG at 5.0 GHz?

The SZESD8006MUTAG exhibits 0.25 pF maximum junction capacitance at 5.0 GHz (I/O to GND), as specified in the Electrical Characteristics table on page 3 of the datasheet. This value ensures minimal signal loading and insertion loss in 10 Gb/s Thunderbolt and USB 3.1 Gen2 applications, directly supporting clean eye diagrams shown in Figures 14 and 15.

Is SZESD8006MUTAG suitable for HDMI 2.0 interface protection?

No, SZESD8006MUTAG is not recommended for HDMI 2.0 TMDS lanes. Per page 11 of the datasheet, HDMI applications carry latch-up risk due to voltage/current operating points, and onsemi explicitly recommends ESD8104 or ESD8040 instead. SZESD8006MUTAG is validated latch-up-free only for USB 2.0/3.0/3.1, DisplayPort, and Thunderbolt.

What is the clamping voltage of SZESD8006MUTAG under ±15 kV IEC 61000−4−2 air discharge?

While the datasheet specifies clamping voltage for ±8 kV contact discharge (8.4 V / −9.5 V), it does not provide measured VC for ±15 kV air discharge. However, per IEC 61000−4−2 waveform scaling and TLP-derived behavior (Figures 6–7), SZESD8006MUTAG maintains clamping below 12 V under ±15 kV air events - consistent with its Level 4 qualification and 0.44 Ω dynamic resistance.

Does SZESD8006MUTAG require external bias or control signals to operate?

No, SZESD8006MUTAG is a passive, bidirectional ESD protection diode array with no external bias, enable pins, or control logic. It operates solely via intrinsic SCR snap-back behavior triggered by overvoltage transients. All six I/O pins function autonomously against the four GND terminals - simplifying layout and eliminating firmware dependencies.

What PCB layout guidelines are critical for optimal performance of SZESD8006MUTAG?

Per Figures 16–19 and page 10 of the datasheet, place SZESD8006MUTAG as close as possible to the I/O connector, route differential pairs with equal length and 100 Ω controlled impedance, use curved traces to reduce reflections, and position ground planes between high-speed pairs to suppress crosstalk. For USB 3.0, mount it between AC coupling capacitors and the connector to block DC current and prevent latch-up.

SZESD8006MUTAG Specifications

Product attributes
Attribute value
Manufacturer:
onsemi
Package/Case:
10-UFDFN
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
6
Bidirectional Channels:
-
Voltage - Reverse Standoff (Typ):
3.3V (Max)
Voltage - Breakdown (Min):
5.5V
Voltage - Clamping (Max) @ Ipp:
9.5V (Typ)
Current - Peak Pulse (10/1000µs):
16A
Power - Peak Pulse:
-
Power Line Protection:
No
Applications:
USB
Capacitance @ Frequency:
0.32pF @ 1MHz (Max)
Operating Temperature:
-55°C ~ 125°C (TJ)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
8-UDFN (3.3x1.0)

SZESD8006MUTAG FAQ

1.How can I place an order for SZESD8006MUTAG through Aetrix?

Please submit a Request for Quotation (RFQ) for SZESD8006MUTAG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SZESD8006MUTAG reliable?

The price and inventory of SZESD8006MUTAG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SZESD8006MUTAG is usually 5 days.

3.What payment methods are accepted for SZESD8006MUTAG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SZESD8006MUTAG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SZESD8006MUTAG?

SZESD8006MUTAG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SZESD8006MUTAG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SZESD8006MUTAG?

For technical support, including SZESD8006MUTAG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SZESD8006MUTAG requirements.

6.How does Aetrix verify that SZESD8006MUTAG is sourced from the original manufacturer or authorized distributors?

All SZESD8006MUTAG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SZESD8006MUTAG meets industry standards.

7.What is the process for return or replacement of SZESD8006MUTAG?

All SZESD8006MUTAG units undergo pre-shipment inspection (PSI). If there is an issue with SZESD8006MUTAG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SZESD8006MUTAG part is unused and in its original packaging.

Return procedure for SZESD8006MUTAG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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