onsemi SZESD8104MUTAG

Overview

SZESD8104MUTAG from onsemi is a unidirectional, low-capacitance ESD protection diode array in UDFN10 (2.5 × 1.0 mm) package, designed for high-speed differential data lines. It delivers 0.37 pF max junction capacitance (I/O to GND), ±15 kV IEC 61000−4−2 contact/air ESD rating, and clamps to ≤11.4 V at ±16 A TLP, enabling robust protection of USB 3.1 (10 Gb/s), HDMI 2.0 (6 Gb/s), and DisplayPort interfaces without signal integrity degradation.

For engineers reviewing the SZESD8104MUTAG datasheet, pinout, applications, or equivalent options, key selection criteria include ultra-low capacitance (<0.4 pF), AEC-Q101 qualification, flow-through UDFN10 layout compatibility with matched trace lengths, and verified eye diagram performance at 10 Gb/s with <0.15 dB insertion loss at fundamental frequencies up to 5 GHz.

Technical Context

The SZESD8104MUTAG employs Low Voltage Punch Through (LVPT) technology, enabling fast turn-on below 4.0 V breakdown and optimized clamping for soft-failure prevention in sub-28 nm ICs. Its unidirectional architecture protects against negative transients only, with common GND pins (3 and 8) supporting shared ground return paths across four I/O channels.

Designed for impedance-critical layouts, the flow-through pinout (I/O–I/O–GND–I/O–I/O–GND) minimizes stub length and maintains differential pair symmetry. It supports IEC 61000−4−2 Level 4 compliance (±15 kV air, ±8 kV contact) and exhibits dynamic resistance of 0.36 Ω (GND→I/O) and 0.44 Ω (I/O→GND), ensuring stable voltage clamping under multi-amp ESD pulses.

Key Specifications

Pinout & Package

UDFN10 package (Case 517BB), 2.5 mm × 1.0 mm footprint, 0.5 mm pitch, exposed thermal pad (optional construction), Pb-free and RoHS compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Compared with ESD8104DMUTAG (identical function, alternate marking) and TPD4E05U06DQAR (higher capacitance, lower ESD rating), SZESD8104MUTAG uniquely balances 0.37 pF capacitance, ±15 kV robustness, and flow-through UDFN10 layout-making it the only choice for production-grade 10 Gb/s differential interface protection with AEC-Q101 compliance.

Availability

SZESD8104MUTAG is available at Aetrix Electronics and suitable for USB 3.1 Gen 2 docking stations, HDMI 2.0 broadcast monitors, and automotive infotainment head units requiring stable component supply and long-term lifecycle assurance.

Supply support for SZESD8104MUTAG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

onsemi (formerly ON Semiconductor) is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and IoT applications.

The ESD8100 series-including SZESD8104MUTAG-is engineered specifically for ultra-high-speed digital interfaces, using LVPT technology to protect sub-28 nm SoCs from soft failures caused by ESD-induced voltage spikes without compromising signal fidelity.

FAQ

What is the maximum clamping voltage of SZESD8104MUTAG under IEC 61000−4−2 Level 4 stress?

The SZESD8104MUTAG clamps to 11.4 V at +16 A TLP current, which corresponds to the IEC 61000−4−2 Level 4 (±8 kV contact) waveform's secondary peak. This value is measured per Figure 5 and Table on page 2 of the official datasheet, confirming its ability to limit transient overvoltage to safe levels for 3.3 V I/O circuits. The SZESD8104MUTAG achieves this with low dynamic resistance (0.36 Ω) and fast LVPT turn-on behavior.

Is SZESD8104MUTAG suitable for bidirectional high-speed data lines like USB 3.1 differential pairs?

Yes-SZESD8104MUTAG is unidirectional (I/O-to-GND only) but fully supports bidirectional signaling on differential lanes such as USB 3.1 SSTX+/− because each I/O pin clamps negative transients to GND while allowing full-swing positive signals to pass unaffected. Its 3.3 V VRWM and 4.0–5.0 V VBR ensure no conduction during normal 3.3 V logic operation. The SZESD8104MUTAG's flow-through pinout preserves differential balance critical for 10 Gb/s eye integrity.

Does SZESD8104MUTAG require external biasing or series resistors for USB 3.1 protection?

No-SZESD8104MUTAG operates passively with no external components required. Its 3.3 V VRWM matches standard USB 3.1 I/O voltage rails, and its 0.37 pF capacitance introduces negligible loading (<< 0.5% impedance change at 5 GHz). Layout guidelines recommend placement between AC coupling capacitors and the connector, but no series resistors, pull-ups, or bias networks are needed. The SZESD8104MUTAG integrates all necessary protection into a single, self-contained device.

How does the UDFN10 package of SZESD8104MUTAG improve PCB layout for HDMI 2.0 designs?

The UDFN10 package of SZESD8104MUTAG features a flow-through pinout (I/O–I/O–GND–I/O–I/O–GND) that enables straight-through routing of HDMI 2.0 TMDS differential pairs-eliminating stubs, vias, or bends that cause impedance mismatch. With 2.5 mm × 1.0 mm footprint and 0.5 mm pitch, it allows matched trace lengths within ±50 µm, critical for maintaining <0.1 UI skew at 6 Gb/s. The SZESD8104MUTAG's mechanical outline (Case 517BB) is optimized for automated placement and reflow in high-density video interface layouts.

What AEC-Q101 test conditions apply to SZESD8104MUTAG, and is PPAP documentation available?

SZESD8104MUTAG is AEC-Q101 qualified per stress test conditions including temperature cycling (−55 °C to +125 °C, 1000 cycles), high-temperature operating life (1000 hrs at +125 °C), and ESD robustness (HBM ≥ 8 kV, MM ≥ 400 V). PPAP documentation-including part submission warrant, process flow, control plan, and test reports-is available upon request for automotive customers. The "SZ" prefix in SZESD8104MUTAG explicitly denotes AEC-Q101 qualification and PPAP capability per onsemi's product marking convention.